MPC860DPZQ66D4 vs MPC862PZQ66B 比較
詳細並排比較 MPC860DPZQ66D4 由 NXP Semiconductors 與 MPC862PZQ66B 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
NXP Semiconductors
MPC862PZQ66B - 66MHz PowerQUICC MPU, 357-PBGA | NXP Semiconductors
MPC862PZQ66B Obsolete規格比較
| 參數 | MPC860DPZQ66D4 | MPC862PZQ66B |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | 最後購買 | Obsolete |
| Processor Type | MPC8xx PowerQUICC 32-Bit RISC MPU | MPC8xx PowerQUICC 32-Bit MPU |
| Core | 1 Core, 32-Bit PowerPC | — |
| Operating Frequency | 66 MHz | — |
| Core / I/O Voltage | 3.3 V | — |
| L1 Instruction Cache | 4 Kbyte | — |
| L1 Data Cache | 4 Kbyte | — |
| On-chip RAM (per data sheet) | [DATA_NEEDED: internal SRAM size] | — |
| Co-Processor / DSP | Communications Processor Module (CPM) | — |
| Ethernet | 10 Mbps (via CPM, Fast Ethernet not supported on DP variant) | — |
| DRAM Controller | Yes, up to 256 Mbyte addressable | — |
| Address Bus Width | 32-Bit | — |
| 封裝 / 外殼 | 357-Ball PBGA, 25 x 25 mm | 357-BBGA (PBGA, 25 x 25 mm) |
| Packaging | Tray | Tray |
| Lead-Free Status | Contains Lead | — |
| RoHS 狀態 | Non-RoHS (legacy BGA, contains lead) | Non-compliant per third-party listing (Contains Pb) |
| 工作溫度 | 0C to +70C (commercial grade) | — |
| Part Status | Not For New Designs | — |
| Manufacturer | — | NXP Semiconductors |
| Number of Cores | — | 1 |
| Core Architecture | — | PowerPC + CPM (QUICC) |
| 資料匯流排寬度 | — | 32-bit |
| Maximum Clock Speed | — | 66 MHz |
| 工作電源電壓 | — | 3.3 V |
| 安裝類型 | — | Surface Mount |
| Lead Free Status | — | Contains Lead |
| Terminal Form | — | Ball |
| Number of Terminals | — | 357 |
| Package Code | — | BGA (PBGA) |
| Series | — | MPC8xx PowerQUICC |
| Temperature Grade | — | Other (per data sheet) |