MPC870ZT133 vs MPC875ZT133 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MPC870ZT133 disebabkan oleh NXP Semiconductors dan MPC875ZT133 disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
MPC875ZT133 - PowerQUICC 133MHz 32-Bit MPU | NXP Semiconductors
MPC875ZT133 ✗ Akhir HayatPengandingan Spesifikasi
| Parametr | MPC870ZT133 | MPC875ZT133 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Obsolete | Akhir Hidup |
| Manufacturer | NXP USA Inc. (formerly Freescale) | — |
| Product Family | PowerQUICC MPC8xx | — |
| Processor Type | MPC8xx PowerQUICC, 32-Bit | — |
| Core Architecture | Power Architecture (G2_LE) | Power Architecture (PowerPC) 32-bit |
| Core Frequency | 133 MHz | 133 MHz |
| Number of Cores | 1 | — |
| External Data Bus Width | 32-bit | — |
| Tegangan Pemberi Arus | 3.3 V I/O, 1.8 V core | — |
| Suhu Operasi | 0C to +95C (commercial) | 0C to +95C |
| Kemasan / Case | 256-PBGA (23 x 23 mm) | — |
| Terminal Form | BALL | BALL |
| Number of Terminals | 256 | 256 |
| Package Code | HBGA | HBGA, Grid Array with Heat Sink/Slug |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Lead Free Status | Contains Lead | — |
| Status RoHS | Non-Compliant (legacy part) | [DATA_NEEDED: rohs status] |
| Packaging | Tray | — |
| Core Count | — | 1 |
| Family | — | MPC8xx / PowerQUICC |
| Kemasan | — | 256-ball PBGA (23x23 mm) |
| Maximum Supply Voltage | — | 1.9 V |
| Communications Processor Module (CPM) | — | Yes (on-chip) |
| Ethernet MAC | — | 10/100 Mbps (Fast Ethernet, integrated) |
| Memory Controller | — | External SDRAM/Flash bus (integrated) |
| Status Lingkungan Hidup | — | End of Life (per NXP discontinuance notice) |
| Instruction Set | — | Power Architecture 32-bit |