MPX2100DP vs MPX2100GP Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci MPX2100DP disebabkan oleh NXP Semiconductors dan MPX2100GP disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

NXP Semiconductors
MPX2100DP MPX2100DP - 100kPa Differential Pressure Sensor, 40mV | NXP

MPX2100DP - 100kPa Differential Pressure Sensor, 40mV | NXP

MPX2100DP ✓ Aktif
NXP Semiconductors
MPX2100GP MPX2100GP - 100kPa Vented Gauge Pressure Sensor | NXP

MPX2100GP - 100kPa Vented Gauge Pressure Sensor | NXP

MPX2100GP ✓ Aktif

Pengandingan Spesifikasi

Parametr MPX2100DP MPX2100GP
Merek NXP Semiconductors NXP Semiconductors
Kategori Pressure Sensors Pressure Sensors
Status Lingkungan Hidup Aktif Aktif
Pressure Type Differential Vented Gauge
Operating Pressure Range 0 kPa to 100 kPa (0 to 14.5 psi) 0 to 14.5 psi (0 to 100 kPa)
Maximum Overload Pressure [DATA_NEEDED: maximum overload pressure] —
Full-Scale Span (Typical) 40 mV (at 10 V excitation) —
Zero Pressure Offset [DATA_NEEDED: zero pressure offset] —
Linearity 1% typical —
Tegangan Pemberi Arus 10 V DC typical 10 V typical (ratiometric)
Arus Pemberi Arus [DATA_NEEDED: supply current] —
Jenis Output Analog mV (Wheatstone Bridge) Wheatstone Bridge (analog voltage, ratiometric)
Suhu Operasi 0C to +85C (compensated) [DATA_NEEDED: operating temperature range]
Storage Temperature [DATA_NEEDED: storage temperature] —
Port Configuration Dual port, axial tube, 4.93 mm (0.19 in) —
Kemasan / Case 4-SIP Module (Case 344C-01) —
Jenis Pemasangan Through-Hole Through-Hole
Technology Silicon piezoresistive, on-chip temperature compensation Silicon piezoresistive, MEMS
Status RoHS Compliant unknown
Aras MSL [DATA_NEEDED: MSL rating] —
Maximum Overpressure — 58.02 psi (400 kPa)
Full-Scale Span — 40 mV typical at 10 V supply
Offset — 0 mV minimum at 0 kPa
Maximum Operating Current — 6 mA
Port Size — Male 0.19 in (4.93 mm) barbed tube
Port Style — Barbed
Kemasan — 4-SIP Module (Unibody through-hole)
Temperature Compensation — On-chip, calibrated
Termination Style — PCB (SIP pins)

Laporan Datasheet & Sumber

Lihat Semua Produk Buat BOQ Minta Bao Harga