MSC8144ETVT800A vs MSC8157SVT1000A Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MSC8144ETVT800A disebabkan oleh NXP Semiconductors dan MSC8157SVT1000A disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
MSC8144ETVT800A - SC3400 Core DSP, 800MHz, 783-FCBGA | NXP
MSC8144ETVT800A ObsoleteNXP Semiconductors
MSC8157SVT1000A - 6x SC3850 DSP SoC, 1GHz, FCBGA-783 | NXP
MSC8157SVT1000A ObsoletePengandingan Spesifikasi
| Parametr | MSC8144ETVT800A | MSC8157SVT1000A |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | DSP | DSP |
| Status Lingkungan Hidup | Obsolete | Obsolete |
| Core Architecture | SC3400 StarCore (4-core) | — |
| Number of Cores | 4 | — |
| Core Clock Rate | 800 MHz | — |
| On-Chip RAM | 10.5 MB | — |
| Non-Volatile Memory | External (NOR/NAND boot ROM) | — |
| Core Voltage | 1.00 V | — |
| I/O Voltage | 3.30 V | — |
| Suhu Operasi | -40C to +105C | -40C to +105C |
| Operating Temperature Grade | Extended Industrial | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Kemasan | 783-FCBGA (29x29 mm) | — |
| Terminal Form | Ball | — |
| Number of Terminals | 783 | — |
| Package Code | BGA / FCBGA | — |
| Package Shape | Square | — |
| Interfaces | Ethernet (UTOPIA), I2C, SPI, TDM, UART | — |
| Technology | High-performance multi-core DSP, SIMD | — |
| Status RoHS | [DATA_NEEDED: RoHS status not in web data] | Compliant |
| Product Type | — | Multi-core Digital Signal Processor (DSP SoC) |
| Architecture | — | StarCore SC3850, six cores |
| Lebar Bus Data | — | 64-bit |
| Maximum Clock Speed | — | 1 GHz |
| Performance | — | 1000 MIPS per core, up to 6000 MIPS aggregate |
| L1 Instruction Cache (per core) | — | 32 KB |
| L1 Data Cache (per core) | — | 32 KB |
| L2 Cache (unified) | — | Shared KB-scale unified L2 |
| Tegangan Pemberi Arus | — | 1 V (core) + I/O rails |
| Package Type | — | FCBGA-783 (Flip-Chip BGA) |
| Package Size | — | 29 mm x 29 mm |
| Kiraan Pin | — | 783 |
| Lead Free | — | Yes |
| Aras MSL | — | [DATA_NEEDED: MSL rating] |
| Memory Interface | — | External DDR2/DDR3 SDRAM controller |
| Serial Interfaces | — | SerDes, Ethernet MAC, I2C, UART |