MT40A512M8RH-075E:B vs K4A4G085WD-BCTD Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MT40A512M8RH-075E:B disebabkan oleh Micron Technology dan K4A4G085WD-BCTD disebabkan oleh Samsung Electronics. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Micron Technology
MT40A512M8RH-075E:B - DDR4 4Gb 2666 MT/s SDRAM | Micron
MT40A512M8RH-075E:B ✓ AktifSamsung Electronics
K4A4G085WD-BCTD - 4Gb DDR4 SDRAM 512Mx8 2666Mbps | Samsung
K4A4G085WD-BCTD ✓ AktifPengandingan Spesifikasi
| Parametr | MT40A512M8RH-075E:B | K4A4G085WD-BCTD |
|---|---|---|
| Merek | Micron Technology | Samsung Electronics |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Jenis Ingatan | DDR4 SDRAM | DDR4 SDRAM |
| Density | 4 Gbit | 4 Gb |
| Organisasi | 512M x 8 | 512M x 8 |
| Kadar Data | 2666 MT/s (DDR4-2666) | 2666 Mbps/pin |
| Clock Frequency | 1333 MHz (1.33 GHz) | — |
| VDD Supply Voltage | 1.2 V +/-60 mV | — |
| VDDQ Supply Voltage | 1.2 V +/-60 mV | — |
| VPP Supply Voltage | 2.5 V, -125 mV/+250 mV | — |
| Jenis Antaramuka | Parallel | — |
| I/O Structure | 1.2V pseudo open-drain | — |
| Tegangan Rujukan | On-die internal adjustable VREFDQ generation | — |
| Kemasan | 78-FBGA (9 x 10.5 mm), TFBGA | 78-ball FBGA |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Suhu Operasi | [DATA_NEEDED: operating temperature range (standard grade)] | 0C to +85C |
| Refresh | Refresh max interval extension at extended TC temperature range (125C capable per family features) | — |
| Speed Grade Suffix | -075E | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance status] |
| Packaging Option Suffix | :B (ball map B designation per Mouser listing) | — |
| Die Generation | — | D-die |
| Tegangan Pemberi Arus | — | 1.2 V |
| Ball Pitch | — | 0.8 mm |
| Antaramuka | — | DDR4 (JEDEC-compatible) |
| Speed Class | — | DDR4-2666 (PC4-21300) |
| Bank Architecture | — | DDR4 bank-group architecture |
| On-Die Termination (ODT) | — | Yes |
| DLL | — | Yes |
| Aras MSL | — | [DATA_NEEDED: moisture sensitivity level] |