P1014NXN5HHA557 vs P1014NXE5HHA Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci P1014NXN5HHA557 disebabkan oleh NXP Semiconductors dan P1014NXE5HHA disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
P1014NXN5HHA557 - 800MHz QorIQ P1 MPU, 32-Bit PowerPC | NXP
P1014NXN5HHA557 ✓ AktifPengandingan Spesifikasi
| Parametr | P1014NXN5HHA557 | P1014NXE5HHA |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | Aktif |
| Manufacturer | NXP Semiconductors | NXP Semiconductors (formerly Freescale) |
| Product Family | QorIQ P1 | — |
| Core Architecture | PowerPC e500v2 | PowerPC e500v2 |
| Number of Cores | 1 | 1 |
| Data Width | 32-bit | — |
| Maximum Core Frequency | 800 MHz | — |
| L1 Cache (I/D) | 32 KB / 32 KB | — |
| L2 Cache | 256 KB | — |
| Memory Controller | DDR3 / DDR3L (with ECC support per datasheet) | DDR3 with ECC |
| Ethernet | Dual 10/100/1000 Mbps MAC with hardware acceleration | 2x Gigabit Ethernet (RGMII / SGMII) |
| Package Type | 425-TEPBGA-I (19x19 mm) | — |
| Terminal Pitch | 0.80 mm | — |
| JEDEC Package Code | S-PBGA-B425 | — |
| Tegangan Pemberi Arus | Multi-rail (per datasheet - core + I/O) | — |
| Gambaran Suhu Operasi | -40C to +105C (industrial) | — |
| Process Technology | CMOS | — |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Status RoHS | Compliant | — |
| Aras MSL | [DATA_NEEDED: MSL level] | — |
| Lead-Free | Yes | — |
| Series | — | QorIQ P1 |
| Lebar Bus Data | — | 32-bit |
| Core Frequency | — | 800 MHz |
| Kemasan / Case | — | 425-TEPBGA I (19x19 mm), 0.8 mm pitch |
| Suhu Operasi | — | -40C to +105C |
| SATA | — | 2x SATA |
| USB | — | USB 2.0 |
| PCIe | — | 2x PCIe |
| Security Engine | — | SEC (DES, 3DES, AES, SHA, MD5, ARC4, PKA) |
| Lead-Free / RoHS | — | Lead Free / RoHS Compliant |
| Packaging | — | Tray |
| Process Node | — | 45 nm |