S9S08SL8F1CTJ vs S9S08SL16F1CTJ Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci S9S08SL8F1CTJ disebabkan oleh NXP Semiconductors dan S9S08SL16F1CTJ disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
S9S08SL16F1CTJ - 8-bit S08 MCU, 16KB Flash, LIN, 20-TSSOP | NXP
S9S08SL16F1CTJ ✓ AktifPengandingan Spesifikasi
| Parametr | S9S08SL8F1CTJ | S9S08SL16F1CTJ |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | Aktif |
| Core Processor | S08 8-bit | — |
| Core Size | 8-bit | — |
| Frekuensi Klock Maksimum | 40 MHz | 40 MHz |
| Flash Memory | 8 KB (8K x 8) | — |
| EEPROM | Integrated EEPROM (size [DATA_NEEDED: EEPROM size]) | — |
| RAM Size | [DATA_NEEDED: RAM size] | 512 bytes |
| ADC Resolution | 10-bit | — |
| LIN Interface | Embedded slave LIN interface controller (SLIC) | — |
| Kemasan | 20-TSSOP (0.173 in, 4.40 mm width) | 20-pin TSSOP |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Suhu Operasi | -40 C to +85 C | — |
| Tegangan Pemberi Arus | [DATA_NEEDED: supply voltage range] | — |
| Tingkat sensitiviti Air Nama (MSL) | 3 | — |
| Peak Reflow Temperature | 260 C | — |
| Maximum Time at Peak Reflow Temperature | 40 s | — |
| Terminal Finish | Tin (JESD-609 Code e3) | — |
| Process Technology | 0.25 um | — |
| Status RoHS | Compliant | — |
| Core | — | S08 (HCS08 CISC) |
| Lebar Bus Data | — | 8 bit |
| Program Memory Size | — | 16 KB Flash |
| EEPROM Size | — | 256 bytes |
| Supply Voltage Range | — | 2.7 V to 5.5 V |
| Gambaran Suhu Operasi | — | -40 C to +85 C |
| GPIO Pin Count | — | 16 |
| ADC Channels | — | 12 x 10-bit |
| Communication Interfaces | — | I2C, LINbus, SCI (UART), SPI |
| On-chip Peripherals | — | LVD, POR, PWM, WDT, SLIC |
| Automotive Qualified | — | Yes (AEC-Q100, -40C to +85C) |
| Lead-Free / RoHS | — | Yes |