XC6SLX25-2FG484C vs XC6SLX25-3FG484I Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci XC6SLX25-2FG484C disebabkan oleh AMD dan XC6SLX25-3FG484I disebabkan oleh AMD. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | XC6SLX25-2FG484C | XC6SLX25-3FG484I |
|---|---|---|
| Merek | AMD | AMD |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Device Type | Field-Programmable Gate Array (FPGA) | Field Programmable Gate Array (FPGA) |
| FPGA Family | Spartan-6 LX | Spartan-6 LX |
| Logic Cells | 24,051 cells | 24,051 cells |
| Number of I/O | 266 I/O | — |
| Internal Frequency | 500 MHz | 500 MHz |
| Technology | 45 nm CMOS | — |
| Core Supply Voltage | 1.2 V | [DATA_NEEDED: core supply voltage] |
| Speed Grade | -2 | -3 |
| Package Type | 484-pin FBGA | 484-BBGA |
| Number of Package Balls | 484 balls | — |
| Terminal Type | Ball | — |
| Package Shape | Square | — |
| Suhu Operasi | 0°C to 85°C | 0°C to 85°C |
| Lead-Free Status | Lead-free | Lead-free package |
| Status RoHS | RoHS compliant | [DATA_NEEDED: RoHS status] |
| Jenis Pemasangan | Surface mount | — |
| I/O Count | — | 266 I/O |
| Process Technology | — | 45 nm CMOS |
| Package Pin Count | — | 484 pins |
| Package Body Size | — | 15 mm x 15 mm |
| Ball Pitch | — | 0.80 mm |
| Terminal Form | — | BGA balls |
| Power Consumption | — | [DATA_NEEDED: typical and maximum power consumption] |
| REACH Status | — | [DATA_NEEDED: REACH status] |