XC6SLX25-2FG484C vs XC6SLX25-3FG484I Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng XC6SLX25-2FG484C sa pamamagitan ng AMD at XC6SLX25-3FG484I sa pamamagitan ng AMD. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | XC6SLX25-2FG484C | XC6SLX25-3FG484I |
|---|---|---|
| Brand | AMD | AMD |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Device Type | Field-Programmable Gate Array (FPGA) | Field Programmable Gate Array (FPGA) |
| FPGA Family | Spartan-6 LX | Spartan-6 LX |
| Logic Cells | 24,051 cells | 24,051 cells |
| Number of I/O | 266 I/O | — |
| Internal Frequency | 500 MHz | 500 MHz |
| Technology | 45 nm CMOS | — |
| Core Supply Voltage | 1.2 V | [DATA_NEEDED: core supply voltage] |
| Speed Grade | -2 | -3 |
| Package Type | 484-pin FBGA | 484-BBGA |
| Number of Package Balls | 484 balls | — |
| Terminal Type | Ball | — |
| Package Shape | Square | — |
| Temperature na Operasyon | 0°C to 85°C | 0°C to 85°C |
| Lead-Free Status | Lead-free | Lead-free package |
| Tindminan RoHS | RoHS compliant | [DATA_NEEDED: RoHS status] |
| Uri ng Pagpapasok | Surface mount | — |
| I/O Count | — | 266 I/O |
| Process Technology | — | 45 nm CMOS |
| Package Pin Count | — | 484 pins |
| Package Body Size | — | 15 mm x 15 mm |
| Ball Pitch | — | 0.80 mm |
| Terminal Form | — | BGA balls |
| Power Consumption | — | [DATA_NEEDED: typical and maximum power consumption] |
| REACH Status | — | [DATA_NEEDED: REACH status] |