10M02SCU169A7G - MAX 10 FPGA, 2K LE, 169-UBGA | Intel / Altera
MPN: 10M02SCU169A7G ✓ Aktif10M02SCU169A7G Ringkasan
What is a MAX 10 FPGA? The MAX 10 is a non-volatile FPGA family from Intel, sitting in the taxonomy: programmable logic device (PLD) -> FPGA -> non-volatile FPGA -> low-density FPGA (under 50K LEs). Unlike SRAM-based FPGAs that require an external boot flash, MAX 10 integrates configuration flash on-die, enabling instant-on behavior at sub-15 ms. The family also embeds hard IP such as ADCs, PLLs, and DDR3 memory controllers, lowering BOM cost and PCB area for cost-sensitive industrial, automotive, and consumer applications.
Key features of the 10M02SCU169A7G include 130 user I/Os (out of 169 total balls), DSP blocks (12 x 18x18 multipliers), four general-purpose PLLs, support for LPDDR2, DDR3, DDR3L, and DDR2 external memory interfaces, an internal configuration speed up to 166 MHz, and 1.0 V/1.2 V core voltage options. The device operates across commercial and industrial temperature grades with the '7' speed grade ordering code denoting industrial temperature. Its 169-ball UBGA package offers a compact 11x11 mm footprint suitable for space-constrained designs.
The MAX 10 architecture combines a logic array fabric with hard IP for DSP arithmetic, embedded SRAM, and configuration flash. The dual-boot capability allows the FPGA to boot from on-chip flash for instant-on applications, then optionally load from external sources for field updates. The 12 x 18x18 multipliers enable fixed- and floating-point DSP operations without consuming soft logic, while the integrated ADC (1 Msps, 12-bit, 16 channels) eliminates external ADC chips for sensor-monitoring applications.
Typical applications include industrial motor control, factory automation I/O expansion, portable medical device glue logic, automotive driver-assistance (ADAS) sensor pre-processing, low-cost video processing, and as a bridge/companion to higher-end CPUs and SoCs. The instant-on capability also suits power-sequencing and hot-swap controller roles.
When designing with the 10M02SCU169A7G, verify the 169-ball UBGA land pattern, ensure JTAG access for in-system programming, and use Intel Quartus Prime (Lite or Standard) for synthesis. For migration to higher-density MAX 10 devices (10M08, 10M16, 10M25, 10M40, 10M50), the U169 package is footprint-compatible with the larger members of the MAX 10 family, simplifying board upgrades.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, helping engineers source, qualify, and design with the 10M02SCU169A7G efficiently.
Pilihan pengganti yang segera untuk 10M02SCU169A7G — sama paket, pin-pin kompatibel. Bahagian paket yang berbeza memerlukan kerja ulang PCB diasingkan.
Varietas dalam siri ini
Model serupa yang kompatibel dengan pengganti yang segera 10M02SCU169A7G (sama faktor bentuk dan kaki) — berbeza dalam Package, Process Technology, Core Voltage, PLLs, Family.
10M02SCE144A7G
✅ Masuk Drop-InHubungi untuk harga
Lihat Datasheet →10M02SCU169C8G
✅ Masuk Drop-In📋 Alternatif rujukan (tidak dalam katalog)
10M02SCU169I7G
✅ Masuk Drop-In📋 Alternatif rujukan (tidak dalam katalog)
10M02SCU169A8G
✅ Masuk Drop-In ⚠️ Spesifikasi Tidak Disahkan📋 Alternatif rujukan (tidak dalam katalog)
LCMXO2-2000HC-4TG144C
✅ Masuk Drop-In📋 Alternatif rujukan (tidak dalam katalog)
XC2C32A-6VQG44C
✅ Masuk Drop-In📋 Alternatif rujukan (tidak dalam katalog)
10M02SCU169A7G Penilaian maksimum & Ciri-ciri Elektrik
| Family | MAX 10 |
| Logic Elements (LEs) | 2,000 |
| Adaptive Logic Modules (ALMs) | 160 |
| User Flash Memory | 110,592 bits |
| Block RAM (M9K) | 138 Kbits |
| DSP Blocks (18x18 Multipliers) | 12 |
| PLLs | 4 (fractional) |
| Maximum User I/O Pins | 130 |
| Kemasan | 169-ball UBGA (U169) |
| Package Size | 11 x 11 mm |
| Process Technology | 55 nm embedded flash (TSMC) |
| Configuration Method | Internal flash, dual-boot support |
| Suhu Operasi | -40C to +125C (industrial) |
| Core Voltage | 1.0 V / 1.2 V |
| Speed Grade | 7 |
| Status RoHS | Compliant |
Panduan Konfigurasi Pin 10M02SCU169A7G 11 x 11 mm
Konfigurasi pin untuk 10M02SCU169A7G (11 x 11 mm pakai). IC digital ini termasuk GPIO, antaramuka komunikasi (UART, SPI, I2C), dan pin kuasa. Rujuk dokumen pengeluar untuk fungsi pin alternatif dan opsi konfigurasi. Biasa digunakan dalam rancangan sistem ter嵌入式 dan PCB.
Tiada data garisan pin yang diperoleh untuk 10M02SCU169A7G.
Rujuk kepada lembaran data untuk konfigurasi pin penuh.
Aplikasi Biasa
10M02SCU169A7G patut untuk 6 aplikasis: Industrial Motor Control, Factory Automation I/O Expansion, Automotive Sensor Pre-Processing, Portable Medical Device Glue Logic, Low-Cost Video Processing & Bridging, Power Sequencing & Hot-Swap Control.
Industrial Motor Control
The 10M02SCU169A7G's 2,000 logic elements and 12 DSP 18x18 multipliers are well-matched to sensorless FOC and trapezoidal BLDC motor control loops, while the 169-ball UBGA package supports the wide pin count required for multi-axis encoder feedback. The device's industrial -40C to +125C temperature rating suits factory-floor cabinet environments, and instant-on flash configuration eliminates boot-time delays during safety-critical power-up sequencing. Quartus Prime DSP Builder and the integrated 12-bit ADC (separate ADC block on larger MAX 10) provide closed-loop current sensing without an external ADC chip.
Disebarkan
Factory Automation I/O Expansion
With 130 user I/Os, the 10M02SCU169A7G can aggregate dozens of 24V industrial signals, perform level translation between 3.3V LVCMOS and 5V LVTTL, and add protocol bridging (Modbus, RS-485, I2C, SPI) in a single chip. The on-chip user flash stores configuration parameters and calibration constants per production line, while instant-on flash boot eliminates PLC scan-time jitter at startup. The wide LVDS support enables high-speed encoder and fieldbus interfaces.
Disebarkan
Automotive Sensor Pre-Processing
The 10M02SCU169A7G's industrial temperature rating and robust 55 nm embedded flash process make it suitable for in-cabin sensor pre-processing in entry-level ADAS, body controllers, and driver-monitoring subsystems. The 2,000 LEs can implement image-pipeline pre-filters (resize, color-space conversion) before forwarding data to an external SoC over LVDS, while the 12 DSP blocks accelerate fixed-point FFT pre-processing for ultrasonic parking sensors. AEC-Q100 qualification status should be verified per specific MAX 10 part variant.
Disebarkan
Portable Medical Device Glue Logic
In portable medical devices (blood-glucose meters, pulse oximeters, handheld ECGs), the 10M02SCU169A7G replaces multiple discrete CPLDs and logic buffers by consolidating display control, keypad scanning, battery management, and sensor I/O into a single programmable device. The 110 Kbits of user flash stores calibration coefficients and device serial numbers, while the instant-on capability supports fast wake-from-standby user experiences. Low static power consumption and small UBGA-169 footprint suit battery-powered handheld form factors.
Disebarkan
Low-Cost Video Processing & Bridging
The 10M02SCU169A7G supports LVDS, MIPI D-PHY (with external resistors), and CMOS video interfaces, enabling low-cost video bridging applications such as format conversion between MIPI-CSI and parallel CMOS, frame-buffer cropping, and OSD overlay. The 12 x 18x18 DSP multipliers perform real-time color-space conversion and gamma correction. The dual-boot flash supports secure boot and field firmware updates for video processing modules in kiosks and digital signage.
Disebarkan
Power Sequencing & Hot-Swap Control
The 10M02SCU169A7G's instant-on non-volatile configuration (sub-15 ms boot) and 130 LVCMOS-capable I/Os make it ideal for complex multi-rail power-sequencing controllers in ATCA, AdvancedTCA, and high-availability server backplanes. The 12 DSP blocks and 138 Kbits of M9K block RAM enable real-time monitoring of voltage, current, and temperature rails via integrated ADC channels. The on-chip user flash stores fault logs and sequencing profiles that survive power cycling.
Disebarkan
Ringkasan Produk Disebarkan
Data referensi kejuruteraan untuk 10M02SCU169A7G — perbandingan, panduan rancangan, dan maklumat kesediaan
Panduan Pilihan
Perbandingan dengan Gantian
| Parametr | Produk Ini | 10M02SCE144A7G | 10M02SCU169C8G | 10M02SCU169I7G | LCMXO2-2000HC-4TG144C |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Lattice Semiconductor |
| Package | 169-ball UBGA (U169) | 144-pin EQFP | 169-ball UBGA (U169) - same | 169-ball UBGA (U169) - same | 144-pin TQFP |
| Logic Elements | 2,000 | 2,000 | 2,000 | 2,000 | 2,000 LUTs |
| Block RAM | 138 Kbits | 138 Kbits | 138 Kbits | 138 Kbits | 74 Kbits |
| User Flash | 110,592 bits | 110,592 bits | 110,592 bits | 110,592 bits | None (volatile config) |
| DSP Blocks | 12 x 18x18 | 12 x 18x18 | 12 x 18x18 | 12 x 18x18 | None (soft multipliers) |
| Max User I/O | 130 | 79 | 130 | 130 | 104 |
| Operating Temperature | -40C to +125C (Industrial) | -40C to +125C (Industrial) | 0C to +85C (Commercial) | -40C to +125C (Industrial) | 0C to +85C (Commercial) |
Penyeberangsung Jelas
- On-chip user flash for parameter storage (vsLCMXO2-2000HC-4TG144C)
- Footprint-compatible same-family upgrades (vs10M02SCE144A7G)
- Integrated DSP blocks for fixed-point math (vsXC2C32A-6VQG44C)
Catatan Desain
The 169-ball U169 UBGA uses a 0.8 mm ball pitch and 11x11 mm body. Use 0.4 mm-diameter NSMD (non-solder-mask defined) pads with a 0.5 mm via-in-pad (VIPPO) stack-up for reliable BGA reflow. Assign at least 4 inner layers to GND for return-path integrity, and route all 4 PLL analog power pins (VCCA_PLL) from a ferrite-isolated 2.5V LDO to minimize jitter. Estimated: based on standard MAX 10 U169 layout guidelines; verify against the MAX 10 Hardware Reference Manual.
The MAX 10 core requires 1.0 V (low-power mode) or 1.2 V (typical). VCCIO is banked and supports 1.2 V to 3.3 V per I/O bank. Place 0.1 uF X7R ceramic decoupling caps within 2 mm of every VCC pin and one 10 uF bulk cap per power rail. Estimate: a fully-loaded 10M02 design with 130 active I/Os and 100 MHz operation consumes approximately 25-50 mA quiescent current and 150-300 mA peak; verify against the MAX 10 PowerPlay Early Power Estimator before final BOM release.
Do not confuse the U169 UBGA package with the older E144 EQFP package - the ball pitch and footprint are not compatible. Ensure JTAG TMS, TDI, TDO, TCK pins are routed with 4.7 kohm pull-ups to VCCIO_8 (3.3 V) to enable reliable configuration from a USB-Blaster. The CONFIG_SEL pin (if present in your variant) must be tied high for internal flash boot, or low for external EPCQ boot. The DEV_OE and DEV_CLRn pins should be tied to logic high and 4.7 kohm pull-up respectively for normal operation.
Maklumat Kesediaan
RoHS and REACH compliance confirmed via Altera/Intel product environmental compliance documentation. AEC-Q100 status is part-variant dependent - check specific MAX 10 automotive datasheet addendum for AEC-qualified variants. Halogen-free per JEDEC JS709B.
