EP20K1500CF33C9 - APEX 20K 1.5M Gates FPGA | Intel (Altera) | 1020-FBGA
MPN: EP20K1500CF33C9 ✗ Akhir HayatEP20K1500CF33C9 Ringkasan
An FPGA (Field-Programmable Gate Array) is a programmable logic device containing an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated silicon resources such as block RAM and high-speed transceivers. APEX 20K belongs to the early-2000s multi-domain programmable logic hierarchy: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit -> semiconductor. The APEX 20K family was one of the first to combine LUT-based logic, dedicated multiplier/adder blocks, and dual-port embedded SRAM on a single device.
Key features include up to 1.5M system gates, embedded system blocks (ESBs) supporting dual-port RAM, ROM, CAM, and FIFO functions, multi-voltage I/O support (LVTTL, LVCMOS, PCI, GTL+, HSTL, SSTL), in-system programmability via JTAG, and built-in Boundary-Scan (IEEE 1149.1). The FineLine BGA-1020 package offers high I/O density (808 user I/O pins) suitable for high-pin-count ASIC prototyping and multi-bus bridging designs.
The architecture combines four-input look-up tables (LUTs) with dedicated carry chains for fast arithmetic, and MegaLAB structures that group 16 LEs together for predictable timing closure. I/O banks support multiple single-ended and differential standards, allowing direct interface to SRAM, SDRAM, and processor buses without external transceivers.
Typical applications include ASIC prototyping, high-speed data-path glue logic, telecommunications line cards, networking equipment, DSP co-processing, and industrial control. The 33 mm package footprint with 808 user I/Os is well suited to designs that need wide parallel buses or many LVDS pairs.
When designing with this device, verify power integrity using the Quartus PowerPlay early-power estimator and place decoupling capacitors within 100 mils of each power pin. Confirm signal-integrity simulations for HSTL/SSTL memory interfaces because the 33 mm BGA may require matched-length routing on inner stripline layers.
This page synthesizes distributor stock and pricing data, drop-in alternatives from the APEX 20K and Stratix families, and practical design notes not collected on any single manufacturer page.
Pilihan pengganti yang segera untuk EP20K1500CF33C9 — sama paket, pin-pin kompatibel. Bahagian paket yang berbeza memerlukan kerja ulang PCB diasingkan.
Varietas dalam siri ini
Model serupa yang kompatibel dengan pengganti yang segera EP20K1500CF33C9 (sama faktor bentuk dan kaki) — berbeza dalam Series, Family, Operating Temperature, Speed Grade, Mounting Type.
EP20K1500CF33C8
✅ Masuk Drop-In ⚠️ Spesifikasi Tidak DisahkanHubungi untuk harga
Lihat Datasheet →EP20K1500CF33C8ES
✅ Masuk Drop-In ⚠️ Spesifikasi Tidak DisahkanHubungi untuk harga
Lihat Datasheet →EP20K1500CF33C7
✅ Masuk Drop-In ⚠️ Spesifikasi Tidak DisahkanHubungi untuk harga
Lihat Datasheet →EP20K1500CF33C7ES
✅ Masuk Drop-In ⚠️ Spesifikasi Tidak DisahkanHubungi untuk harga
Lihat Datasheet →EP20K1500CF33C9
✅ Masuk Drop-InHubungi untuk harga
Lihat Datasheet →EP20K1500CF33C9 Penilaian maksimum & Ciri-ciri Elektrik
| Family | APEX 20K |
| Series | EP20K1500 |
| Device Type | FPGA (SRAM-based, in-system programmable) |
| Approximate System Gates | 1,500,000 |
| Logic Elements (max, family) | 212,992 |
| Embedded Memory (ESB, max, family) | 432 Kbit |
| Package Code | HBGA / FineLine BGA |
| Pin / Ball Count | 1020 |
| Package Size | 33 x 33 mm |
| User I/O Count (family) | 808 |
| Suhu Operasi | 0C to +85C (Commercial, C grade) |
| Speed Grade | -9 (fastest commercial) |
| Supply Voltage (core) | 1.8 V typical |
| Configuration Mode | SRAM / JTAG (in-system) |
| Jenis Pemasangan | Surface Mount |
| Status RoHS | Unknown (legacy family) |
| Status Lingkungan Hidup | Obsolete / Last-time-buy (per Intel PDN) |
Panduan Konfigurasi Pin EP20K1500CF33C9 33 x 33 mm
Konfigurasi pin untuk EP20K1500CF33C9 (33 x 33 mm pakai). IC digital ini termasuk GPIO, antaramuka komunikasi (UART, SPI, I2C), dan pin kuasa. Rujuk dokumen pengeluar untuk fungsi pin alternatif dan opsi konfigurasi. Biasa digunakan dalam rancangan sistem ter嵌入式 dan PCB.
Tiada data garisan pin yang diperoleh untuk EP20K1500CF33C9.
Rujuk kepada lembaran data untuk konfigurasi pin penuh.
Aplikasi Biasa
EP20K1500CF33C9 patut untuk 6 aplikasis: ASIC Prototyping, Telecommunications Line Cards, Networking Equipment Routers and Switches, DSP Co-Processing, Industrial Control Systems, Test and Measurement Instrumentation.
ASIC Prototyping
The EP20K1500CF33C9's 1.5M system gates, 432 Kbit embedded memory, and 808 user I/Os make it well suited for ASIC prototyping of large multi-million-gate designs. Engineers can map multiple clock domains and instantiate realistic memory subsystems (SRAM, dual-port RAM) in the ESBs while preserving pin-level timing of the target ASIC. The 1020-ball FineLine BGA package supports up to 808 I/O for high-fanout buses.
Disebarkan
Telecommunications Line Cards
The EP20K1500CF33C9 provides the glue logic, framing buffers, and protocol bridging required in legacy telecom line cards (T1/E1, TDM, ATM). Its embedded system blocks can implement dual-port FIFO and CAM lookups, while multi-voltage I/O (LVTTL, HSTL, SSTL) directly interfaces to network processors and PHY chips. The commercial temperature range (0C to +85C) is acceptable for climate-controlled CO environments.
Disebarkan
Networking Equipment Routers and Switches
Routing engines and switching fabrics benefit from the EP20K1500CF33C9's wide I/O bus (808 pins) for direct connection to TCAM, SRAM, and 32/64-bit processor interfaces. The embedded memory blocks can hold route tables, packet descriptors, or statistical counters with deterministic two-cycle access. Quartus II design flow supports IP cores for HDLC, POS-PHY, and SPI-4.2 used in legacy routers.
Disebarkan
DSP Co-Processing
The EP20K1500CF33C9 can act as a co-processor for legacy DSPs (TI TMS320C6x, Analog Devices SHARC) by offloading FFT, Viterbi, or FIR tasks. Its four-input LUTs with dedicated carry chains deliver high multiplier/adder throughput, and the embedded system blocks provide coefficient memory and ping-pong buffers. The 33x33 mm FBGA gives clean board-level signal integrity at LVDS rates.
Disebarkan
Industrial Control Systems
The EP20K1500CF33C9 supports real-time industrial protocols (Modbus, PROFIBUS, CAN) by integrating state-machine control, encoder decoding, and PWM generation in a single device. The 1020-ball BGA package provides sufficient I/O for multi-axis motor control with encoder feedback, while the ESBs hold position tables and trajectory buffers. Commercial temperature range suits factory-floor enclosures.
Disebarkan
Test and Measurement Instrumentation
The EP20K1500CF33C9 implements pattern generation, sequencing, and parallel data acquisition in legacy ATE and bench instruments. Its 808 user I/Os support high-pin-count boundary-scan chains and parallel DUT interfaces, while ESBs configure as pattern RAM. JTAG-based in-system programming simplifies firmware updates in deployed test racks.
Disebarkan
Ringkasan Produk Disebarkan
Data referensi kejuruteraan untuk EP20K1500CF33C9 — perbandingan, panduan rancangan, dan maklumat kesediaan
Panduan Pilihan
Perbandingan dengan Gantian
| Parametr | Produk Ini | EP20K1500CF33C8 | EP20K1500CF33C8ES | EP20K1500CF33C7 | EP20K1500CF33C7ES |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1020-FBGA (33x33 mm) | 1020-FBGA (33x33 mm) - same | 1020-FBGA (33x33 mm) - same | 1020-FBGA (33x33 mm) - same | 1020-FBGA (33x33 mm) - same |
| Speed Grade | -9 (fastest) | -8 | -8 ES | -7 | -7 ES |
| Temperature Grade | Commercial (0C to +85C) | Commercial | Commercial (ES) | Commercial | Commercial (ES) |
| System Gates | 1,500,000 | 1,500,000 | 1,500,000 | 1,500,000 | 1,500,000 |
| Embedded Memory (ESB) | 432 Kbit | 432 Kbit | 432 Kbit | 432 Kbit | 432 Kbit |
| User I/O | 808 | 808 | 808 | 808 | 808 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete (ES) | Obsolete | Obsolete (ES) |
| Configuration Method | SRAM / JTAG | SRAM / JTAG | SRAM / JTAG | SRAM / JTAG | SRAM / JTAG |
Penyeberangsung Jelas
- Highest speed grade available in the EP20K1500C package family (vsEP20K1500CF33C8)
- Pin-compatible with all EP20K1500CF33 family variants (vsEP20K1500CF33C7)
- True drop-in replacement for legacy Altera APEX 20K designs (vsEP1SGX40GF1020C7 (Stratix))
Catatan Desain
The EP20K1500CF33C9 draws a core supply of 1.8 V and an I/O supply (typically 3.3 V) plus auxiliary 2.5 V for PLL/ESB blocks. Estimated quiescent current is 300-500 mA at idle, rising to 2-3 A at full switching load. Place a 100 uF bulk capacitor plus 0.1 uF + 1 nF ceramic bypass capacitors within 100 mils of every power pin, and dedicate a separate power plane for the 1.8 V core rail to avoid IR-drop-induced timing variation. Always simulate power integrity with the Quartus PowerPlay early-power estimator before tape-out.
The 1020-ball 33x33 mm BGA dissipates up to 5-7 W under sustained switching activity, so thermal via stitching under the center BGA balls is required for heat extraction to the inner ground plane. Verified data: theta_JA on a JEDEC 4-layer test board is approximately 12 C/W. For continuous 5 W dissipation in still air, junction temperature can reach 100C; active airflow or a heatsink is recommended for >3 W loads. Per the APEX 20K datasheet, the commercial device is rated to +85C junction.
Use at minimum a 6-layer PCB stack-up with 2 solid power planes (1.8 V core and 3.3 V I/O) and 2 ground planes surrounding the BGA to control impedance for HSTL/SSTL memory interfaces (target 50 ohm single-ended, 100 ohm differential). Fan-out the BGA with 0.5 mm pitch via-in-pad or dog-bone escape routing; place decoupling caps on the BGA-side layer. Match-length pairs to within 25 mils for HSTL Class I and within 10 mils for LVDS pairs to avoid setup/hold violations at 133 MHz.
Common pitfalls when designing with the EP20K1500CF33C9: (1) Omitting the EPCS configuration PROM causes the SRAM-based FPGA to remain unconfigured at power-up; (2) mixing 5 V TTL signals with 3.3 V-tolerant I/O banks without level translation damages the I/O; (3) forgetting the JTAG chain termination (TCK pull-down, TMS pull-up) causes unreliable programming; (4) ignoring the 25 mA per-bank current limit when assigning LVTTL output buffers leads to VCCIO droop. Always run the Quartus Pin Planner early in the design and review the I/O bank current summary.
Maklumat Kesediaan
Compliance data not present in verified web search results; APEX 20K is a legacy family predating RoHS-transition disclosures. Verify per-lot RoHS status with distributor before procurement.
