Intel

EP3SL340H1152I3N - Stratix III L FPGA, 337.5K LEs, 1152-BGA | Intel

MPN: EP3SL340H1152I3N ✗ Akhir Hayat

1.1 V Vdss 1152-BBGA, FCBGA Package 18,822,144 bits Memory

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EP3SL340H1152I3N Ringkasan

The Intel (formerly Altera) EP3SL340H1152I3N is a high-density, low-power Stratix® III L family Field-Programmable Gate Array (FPGA) housed in a 1152-ball FineLine Ball-Grid Array (FCBGA) package. The device integrates 337,500 logic elements (LEs), approximately 18.8 Mbits of embedded memory, 744 user I/O pins, and high-speed transceivers/PLLs targeted at bandwidth-intensive ASIC-prototyping, DSP, and wireline communication designs.

An FPGA (Field-Programmable Gate Array) is a class of programmable logic device containing an array of configurable logic blocks (LBs), programmable interconnect, embedded memory, DSP blocks, and hardened I/O serdes. FPGAs sit at the top of the digital semiconductor hierarchy below ASICs, allowing hardware designers to implement custom parallel processing pipelines, state machines, and high-speed interfaces without the NRE cost of a custom ASIC. The Stratix III family uses TSMC's 65 nm process and emphasizes a low-power "L" variant tuned for power-sensitive applications.

Key features of the EP3SL340H1152I3N include 337,500 logic elements, 18,822,144 bits of embedded RAM, 744 maximum user I/O, programmable power technology with logic-array clocking, on-chip termination (OCT), and DSP blocks supporting high-throughput fixed- and floating-point arithmetic. The device is specified for the industrial temperature grade (-40 °C to +100 °C) and supports multiple high-speed serial protocols through its transceiver channels.

Architecturally, the Stratix III L uses a tile-based logic structure with dedicated carry chains, 8-input adaptive logic modules (ALMs), TriMatrix embedded memory blocks (MLAB, M9K, M144K), and DSP block slices that accelerate IEEE-754 single-precision floating-point operations. The 1152-BGA package exposes the full device periphery for maximum user I/O, making this part the preferred package option when a design needs 500+ board-level signals.

Typical applications include wireline telecom line cards, ASIC prototyping, high-performance DSP pipelines for radar/medical imaging, broadcast video processing, and military/aerospace signal processing. Designers also deploy the EP3SL340H1152I3N in test & measurement instrumentation where its combination of logic density and high I/O count enables a single-chip acquisition/processing backend.

When designing with this FPGA, careful attention to power integrity is required. Programmable power technology combined with on-chip temperature sensors helps dynamic power management, but multi-rail decoupling, bulk bypassing, and a thermal solution sized for the FCBGA's theta-JA are mandatory for reliable industrial operation.

This page synthesizes distributor inventory, drop-in pin-compatible Stratix III L alternatives, application recommendations, and PCB-thermal design notes that the manufacturer datasheet alone does not provide.

Pilihan pengganti yang segera untuk EP3SL340H1152I3N — sama paket, pin-pin kompatibel. Bahagian paket yang berbeza memerlukan kerja ulang PCB diasingkan.

Varietas dalam siri ini

Model serupa yang kompatibel dengan pengganti yang segera EP3SL340H1152I3N (sama faktor bentuk dan kaki) — berbeza dalam Package, Speed Grade, Operating Temperature, Embedded Memory, Core Voltage.

EP3SE260F1152I3N

Intel

Operating Temperature: -40C to +100C (industrial)

Core Voltage: 0.9 V to 1.1 V selectable