Intel

EP3SL340H1152I3N - Stratix III L FPGA, 337.5K LEs, 1152-BGA | Intel

MPN: EP3SL340H1152I3N ✗ Cuối đời

1.1 V Vdss 1152-BBGA, FCBGA Package 18,822,144 bits Memory

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EP3SL340H1152I3N Tóm tắt

The Intel (formerly Altera) EP3SL340H1152I3N is a high-density, low-power Stratix® III L family Field-Programmable Gate Array (FPGA) housed in a 1152-ball FineLine Ball-Grid Array (FCBGA) package. The device integrates 337,500 logic elements (LEs), approximately 18.8 Mbits of embedded memory, 744 user I/O pins, and high-speed transceivers/PLLs targeted at bandwidth-intensive ASIC-prototyping, DSP, and wireline communication designs.

An FPGA (Field-Programmable Gate Array) is a class of programmable logic device containing an array of configurable logic blocks (LBs), programmable interconnect, embedded memory, DSP blocks, and hardened I/O serdes. FPGAs sit at the top of the digital semiconductor hierarchy below ASICs, allowing hardware designers to implement custom parallel processing pipelines, state machines, and high-speed interfaces without the NRE cost of a custom ASIC. The Stratix III family uses TSMC's 65 nm process and emphasizes a low-power "L" variant tuned for power-sensitive applications.

Key features of the EP3SL340H1152I3N include 337,500 logic elements, 18,822,144 bits of embedded RAM, 744 maximum user I/O, programmable power technology with logic-array clocking, on-chip termination (OCT), and DSP blocks supporting high-throughput fixed- and floating-point arithmetic. The device is specified for the industrial temperature grade (-40 °C to +100 °C) and supports multiple high-speed serial protocols through its transceiver channels.

Architecturally, the Stratix III L uses a tile-based logic structure with dedicated carry chains, 8-input adaptive logic modules (ALMs), TriMatrix embedded memory blocks (MLAB, M9K, M144K), and DSP block slices that accelerate IEEE-754 single-precision floating-point operations. The 1152-BGA package exposes the full device periphery for maximum user I/O, making this part the preferred package option when a design needs 500+ board-level signals.

Typical applications include wireline telecom line cards, ASIC prototyping, high-performance DSP pipelines for radar/medical imaging, broadcast video processing, and military/aerospace signal processing. Designers also deploy the EP3SL340H1152I3N in test & measurement instrumentation where its combination of logic density and high I/O count enables a single-chip acquisition/processing backend.

When designing with this FPGA, careful attention to power integrity is required. Programmable power technology combined with on-chip temperature sensors helps dynamic power management, but multi-rail decoupling, bulk bypassing, and a thermal solution sized for the FCBGA's theta-JA are mandatory for reliable industrial operation.

This page synthesizes distributor inventory, drop-in pin-compatible Stratix III L alternatives, application recommendations, and PCB-thermal design notes that the manufacturer datasheet alone does not provide.

Bộ thay thế dễ dàng lắp đặt cho EP3SL340H1152I3N — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.

Các biến thể trong loạt này

Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP3SL340H1152I3N (cùng hình factor và footprint) — khác nhau ở Package, Speed Grade, Operating Temperature, Embedded Memory, Core Voltage.

EP3SE260F1152I3N

Intel

Operating Temperature: -40C to +100C (industrial)

Core Voltage: 0.9 V to 1.1 V selectable