MCIMX6L2EVN10AA - i.MX6SL 1GHz Cortex-A9 MPU | NXP | 432-MAPBGA
MPN: MCIMX6L2EVN10AA ✓ AktifMCIMX6L2EVN10AA Ringkasan
A microprocessor (MPU) is a CPU-centric integrated circuit that integrates one or more processor cores, cache, memory controller, and a wide range of peripheral controllers into a single System-on-Chip package, sitting one level above a microcontroller (which typically integrates on-chip flash) and below a fully discrete CPU. Within the i.MX family hierarchy, the i.MX6SL places below the dual-core i.MX6DL and quad-core i.MX6Q/6QP variants, targeting read-intensive HMI, e-reader, and portable multimedia designs.
Key features include a 32-bit ARM Cortex-A9 core with NEON media extensions, an integrated L1/L2 cache hierarchy, hardware video accelerators for H.264 decode and 2D graphics, multiple display and camera interfaces, USB 2.0 with integrated PHY, Gigabit Ethernet MAC, and rich connectivity (UART, SPI, I2C, I2S, PWM, SD/eMMC). The 432-MAPBGA package provides a low-impedance power/ground network for the high-frequency core logic.
The part uses a 40 nm low-power CMOS process with integrated power management that supports dynamic voltage and frequency scaling (DVFS), multiple low-power states including ARM Cortex-A9 retention, and peripheral clock gating for deep-sleep power optimization. The architecture separates the application domain (running Linux, Android, or RTOS), the HMI domain (display controller, GPU, video pipeline), and the low-power domain (always-on GPIOs and RTC). This separation lets designers gate high-current domains independently and keep only the wake logic alive for sub-mW standby budgets.
Typical applications include industrial HMI panels, smart appliance control boards, portable medical tablets, e-readers, single-display infotainment secondary screens, POS terminals, and cost-optimized smart-home gateways. The wide peripheral mix supports direct connection to capacitive touch controllers, LVDS/MIPI-DSI panels, camera sensors, and wireless modules.
When designing with this part, allocate at least 4 PCB layers with dedicated power and ground planes to meet the simultaneous-switching current demands of the 432-ball BGA. A two-stage regulator architecture (PMU + point-of-load LDOs/DDCMs) is recommended to feed the core and analog supplies cleanly; the part is not 5V-tolerant on most I/O, so a level shifter may be needed for legacy 5V peripherals.
This page synthesizes distributor pricing, same-family drop-in alternatives in the 432-MAPBGA footprint, and HMI-oriented design notes not aggregated on the manufacturer datasheet alone.
Pilihan pengganti yang segera untuk MCIMX6L2EVN10AA — sama paket, pin-pin kompatibel. Bahagian paket yang berbeza memerlukan kerja ulang PCB diasingkan.
Varietas dalam siri ini
Model serupa yang kompatibel dengan pengganti yang segera MCIMX6L2EVN10AA (sama faktor bentuk dan kaki) — berbeza dalam Core Architecture, Package, Series, Mounting Type, Display Interface.
MCIMX6L2DVN10AA
✅ Masuk Drop-InHubungi untuk harga
Lihat Datasheet →MCIMX6L2EVN10AB
✅ Masuk Drop-In ⚠️ Spesifikasi Tidak Disahkan📋 Alternatif rujukan (tidak dalam katalog)
MCIMX6L3DVN10AB
✅ Masuk Drop-In📋 Alternatif rujukan (tidak dalam katalog)
MCIMX6L7DVN10AB
✅ Masuk Drop-InHubungi untuk harga
Lihat Datasheet →MCIMX6L5DVN10AB
✅ Masuk Drop-In ⚠️ Spesifikasi Tidak Disahkan📋 Alternatif rujukan (tidak dalam katalog)
MCIMX6L4DVN10AB
✅ Masuk Drop-In ⚠️ Spesifikasi Tidak Disahkan📋 Alternatif rujukan (tidak dalam katalog)
MCIMX6L2EVN10AA Penilaian maksimum & Ciri-ciri Elektrik
| Core Architecture | ARM Cortex-A9 (32-bit) |
| Core Count | 1 |
| Maximum CPU Clock | 1.0 GHz |
| Series | i.MX 6SoloLite (i.MX6SL) - Megrez |
| Kemasan | 432-MAPBGA (13 mm x 13 mm) |
| Jenis Pemasangan | Surface Mount |
| Process Technology | 40 nm CMOS (per i.MX6 family) |
| L1 Instruction Cache | 32 KB |
| L1 Data Cache | 32 KB |
| L2 Cache | 256 KB |
| NEON Media Engine | Yes (ARM NEON SIMD) |
| Hardware Video Decoder | Yes (H.264 BP/HP, MPEG-4, VC-1) |
| Display Interfaces | Parallel LCD, LVDS, MIPI-DSI (per i.MX6SL datasheet) |
| USB | USB 2.0 with integrated HS PHY |
| Ethernet | Gigabit Ethernet MAC (with external PHY) |
| Storage | SD/MMC, eMMC, NAND, SPI NOR, Quad-SPI |
| Status RoHS | Compliant |
Panduan Konfigurasi Pin MCIMX6L2EVN10AA 432-mapbga (13 mm x 13 mm)
Konfigurasi pin untuk MCIMX6L2EVN10AA (432-mapbga (13 mm x 13 mm) pakai). IC digital ini termasuk GPIO, antaramuka komunikasi (UART, SPI, I2C), dan pin kuasa. Rujuk dokumen pengeluar untuk fungsi pin alternatif dan opsi konfigurasi. Biasa digunakan dalam rancangan sistem ter嵌入式 dan PCB.
Tiada data garisan pin yang diperoleh untuk MCIMX6L2EVN10AA.
Rujuk kepada lembaran data untuk konfigurasi pin penuh.
Aplikasi Biasa
MCIMX6L2EVN10AA patut untuk 7 aplikasis: Industrial HMI Panels, Smart Appliance Control Boards, Portable Medical Tablets, POS Terminals and Retail Pinpads, E-Reader and Low-Power Multimedia, Smart Home Gateways and Home Automation Hubs, Single-Display Automotive Infotainment (Secondary).
Industrial HMI Panels
The MCIMX6L2EVN10AA fits industrial HMI panels thanks to its 1.0 GHz Cortex-A9 core, integrated 2D graphics engine, and direct interface support for parallel RGB, LVDS, and MIPI-DSI LCDs. Pairing the SoC with a 7-12 inch capacitive touch panel and a DDR3L memory stack gives designers fluid 60 fps multi-widget GUIs under Qt/Embedded or Linux framebuffers. Compared to discrete host MCU + external graphics solutions, the integrated display controller and PCIe/USB peripherals reduce BOM cost by 20-30% on a typical 10-inch panel.
Disebarkan
Smart Appliance Control Boards
In smart appliance control boards (HVAC, washing machine, induction cooktop with touch UI), the MCIMX6L2EVN10AA's low-power DSM mode and broad I/O set eliminate an external MCU. Its 1.0 GHz single core runs Yocto Linux for connectivity stacks (Wi-Fi, BLE, MQTT) while one of the Cortex-A9 NEON pipes accelerates touch gesture recognition. Pin-compatibility with the dual-core MCIMX6L3DVN10AB lets the same PCB serve entry-tier and mid-tier SKUs without rework.
Disebarkan
Portable Medical Tablets
The MCIMX6L2EVN10AA powers portable medical tablets used for bedside charting, patient intake, and EMR entry. Its hardware H.264 decoder accelerates telehealth video calls, the integrated USB 2.0 HS PHY drives barcode scanners and biometric peripherals, and the capacitive touch controller interface delivers accurate signature capture. Medical-grade builds add isolation barriers and a galvanically isolated USB; developers typically run a TrustZone-aware Linux distribution with HIPAA-friendly crypto policy.
Disebarkan
POS Terminals and Retail Pinpads
Cash registers, POS pinpads, and retail kiosks benefit from the MCIMX6L2EVN10AA's integrated gigabit Ethernet MAC, multiple USB ports, hardware AES for PCI-PTS encryption, and dual display support (operator + customer-facing screens). A merchant can drive two 1280 x 800 panels from the single SoC while keeping price/performance above legacy ARM11 designs. The 40 nm process keeps thermal output compatible with the small fan-less chassis typical of a counter-top PIN entry device.
Disebarkan
E-Reader and Low-Power Multimedia
E-readers, A4-sized e-notebooks, and low-power multimedia tablets use the MCIMX6L2EVN10AA to drive E-ink or color reflective displays at low refresh rates with multi-week standby time. The i.MX6SL's NEON engine accelerates EPUB/PDF rasterization while the integrated 2D pipeline handles partial screen updates that preserve energy on E-ink panels. Combined with a 2 GB DDR3L + 8 GB eMMC subsystem, the SoC delivers competitive performance at sub-$25 BoM.
Disebarkan
Smart Home Gateways and Home Automation Hubs
A sub-$30 BOM gateway with a 1.0 GHz Cortex-A9 host can run Zigbee, BLE, Wi-Fi, and Matter/Thread bridging stacks on the MCIMX6L2EVN10AA. The SoC's integrated Gigabit Ethernet MAC, USB 2.0, multiple UARTs, and SD/eMMC storage host a Linux container environment while leaving one core free for crypto offload. Designers typically pair the MCIMX6L2 with 256 MB DDR3 + 256 MB NAND and a fan-less plastic enclosure rated for home-automation environments.
Disebarkan
Single-Display Automotive Infotainment (Secondary)
For secondary / rear-seat automotive entertainment displays, the MCIMX6L2EVN10AA drives a 720p LVDS panel with hardware H.264 decode, USB media ingest, and HDMI/analog A/V inputs. While not AEC-Q100 qualified, industrial-rev silicon has been deployed in non-critical in-cabin displays. Designs always mirror the SoC's temperature with derating; over-temperature will trigger the on-chip thermal warning and gracefully gate display refresh.
Disebarkan
Ringkasan Produk Disebarkan
Data referensi kejuruteraan untuk MCIMX6L2EVN10AA — perbandingan, panduan rancangan, dan maklumat kesediaan
Panduan Pilihan
Perbandingan dengan Gantian
| Parametr | Produk Ini | MCIMX6L2DVN10AA | MCIMX6L2EVN10AB | MCIMX6L3DVN10AB | MCIMX6L7DVN10AB | MCIMX6L5DVN10AB |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 432-MAPBGA (13x13) | 432-MAPBGA (13x13) - same | 432-MAPBGA (13x13) - same | 432-MAPBGA (13x13) - same | 432-MAPBGA (13x13) - same | 432-MAPBGA (13x13) - same |
| CPU Cores | 1 x Cortex-A9 | 1 x Cortex-A9 | 1 x Cortex-A9 | 2 x Cortex-A9 | 2 x Cortex-A9 | 1 x Cortex-A9 |
| Max CPU Frequency | 1.0 GHz | 1.0 GHz | 1.0 GHz | 1.0 GHz | 1.0 GHz | 1.0 GHz |
| L2 Cache | 256 KB | 256 KB | 256 KB | 1 MB (dual-core L2) | 1 MB (dual-core L2) | 256 KB |
| i.MX Series | i.MX 6SoloLite (Megrez) | i.MX 6SoloLite (Megrez) | i.MX 6SoloLite (Megrez) | i.MX 6DualLite | i.MX 6DualLite | i.MX 6SoloLite (Megrez) |
| Hardware Video Decoder | Yes (H.264 BP/HP, MPEG-4, VC-1) | Yes | Yes | Yes (higher performance) | Yes (higher performance) | Yes |
| Display Controller | Parallel RGB, LVDS, MIPI-DSI | Same controller set | Same controller set | Same + HDMI/eDP | Same + HDMI/eDP | Same controller set |
| USB 2.0 HS PHY | Integrated | Integrated | Integrated | Integrated | Integrated | Integrated |
| Gigabit Ethernet MAC | Yes | Yes | Yes | Yes | Yes | Yes |
| Unit Price (1 pc, indicative) | $28.60 | ~$26.50 | ~$28.60 | ~$45.00 | ~$48.00 | ~$30.00 |
Penyeberangsung Jelas
- Single-core i.MX 6SoloLite is the lowest-cost member of the i.MX6 432-MAPBGA family (vsMCIMX6L3DVN10AB)
- Same footprint as the dual-core i.MX6DL family, enabling PCB reuse between SKUs (vsMCIMX6U7CVM08AD)
- Integrated USB 2.0 HS PHY and Gigabit Ethernet MAC reduce BoM cost (vsMCIMX6L5DVN10AB)
Catatan Desain
Use a minimum 4-layer PCB with continuous ground plane directly under the 432-MAPBGA. The 0.5 mm pitch demand microvia-compatible HDI stack-ups (any-layer or stacked microvias) for BGA escape; laser-drilled microvias at the top layer land onto the BGA balls, with deeper vias stitching planes. Keep power-plane cutouts away from the high-speed DDR3L area (SDRAM nets switch up to 1.6 GHz) and NXP's i.MX6 hardware design guide escape pattern verbatim for first-pass success.
Pair the MCIMX6L2EVN10AA with an NXP PF0100 or PF3001 PMIC to manage core, system, and DDR rails in the correct sequence during power-up and emergency shutdown. The 40 nm process means core current can spike above 1 A during H.264 decode; bulk ceramic bypass (220 µF tantalum + 4 x 22 µF ceramic) is required near the BGA. Estimate: with VIN 3.3 V and full Android workload, SoC + DDR3L BoM budget ~3.5 W, requiring 25 x 25 mm of unbroken inner ground copper for 4-layer thermal relief.
1) Do not connect 5V peripherals directly to the SoC I/O - the part is 3.3 V maximum and is NOT 5V tolerant on most pins; use PCA9410 or PCA9306 level shifters. 2) Use of an LPDDR2 instead of DDR3L requires different timing/calibration firmware and a different board bring-up image. 3) The BGA has no easily accessible GND balls for probing - lay out test pads on the outside perimeter that map to all supply rails before layout freeze.
Estimated: at 1.0 GHz and full H.264 decode workload, the SoC junction dissipates ~2.8 W; with a four-layer PCB and 25 x 25 mm of unbroken inner-plane copper the junction-to-ambient thermal resistance is ~22 C/W, giving 61.6 C junction temperature rise above 25 C ambient. For an industrial-grade 85 C ambient target, set design margins so the worst-case junction does not exceed 100 C - aim for under 70 C ambient. Add a small aluminum heat-spreader or thermal pad under the BGA if the chassis is fanless but enclosed.
Maklumat Kesediaan
RoHS and lead-free per NXP product marking. Not AEC-Q100 qualified - the i.MX6 automotive-family variants are different SKUs (not the Megrez i.MX6SL family). Full REACH and CMTA documentation available from NXP environmental compliance portal.
