MCIMX6L2EVN10AA - i.MX6SL 1GHz Cortex-A9 MPU | NXP | 432-MAPBGA
MPN： MCIMX6L2EVN10AA ✓ 啟用中MCIMX6L2EVN10AA 概覽
A microprocessor (MPU) is a CPU-centric integrated circuit that integrates one or more processor cores, cache, memory controller, and a wide range of peripheral controllers into a single System-on-Chip package, sitting one level above a microcontroller (which typically integrates on-chip flash) and below a fully discrete CPU. Within the i.MX family hierarchy, the i.MX6SL places below the dual-core i.MX6DL and quad-core i.MX6Q/6QP variants, targeting read-intensive HMI, e-reader, and portable multimedia designs.
Key features include a 32-bit ARM Cortex-A9 core with NEON media extensions, an integrated L1/L2 cache hierarchy, hardware video accelerators for H.264 decode and 2D graphics, multiple display and camera interfaces, USB 2.0 with integrated PHY, Gigabit Ethernet MAC, and rich connectivity (UART, SPI, I2C, I2S, PWM, SD/eMMC). The 432-MAPBGA package provides a low-impedance power/ground network for the high-frequency core logic.
The part uses a 40 nm low-power CMOS process with integrated power management that supports dynamic voltage and frequency scaling (DVFS), multiple low-power states including ARM Cortex-A9 retention, and peripheral clock gating for deep-sleep power optimization. The architecture separates the application domain (running Linux, Android, or RTOS), the HMI domain (display controller, GPU, video pipeline), and the low-power domain (always-on GPIOs and RTC). This separation lets designers gate high-current domains independently and keep only the wake logic alive for sub-mW standby budgets.
Typical applications include industrial HMI panels, smart appliance control boards, portable medical tablets, e-readers, single-display infotainment secondary screens, POS terminals, and cost-optimized smart-home gateways. The wide peripheral mix supports direct connection to capacitive touch controllers, LVDS/MIPI-DSI panels, camera sensors, and wireless modules.
When designing with this part, allocate at least 4 PCB layers with dedicated power and ground planes to meet the simultaneous-switching current demands of the 432-ball BGA. A two-stage regulator architecture (PMU + point-of-load LDOs/DDCMs) is recommended to feed the core and analog supplies cleanly; the part is not 5V-tolerant on most I/O, so a level shifter may be needed for legacy 5V peripherals.
This page synthesizes distributor pricing, same-family drop-in alternatives in the 432-MAPBGA footprint, and HMI-oriented design notes not aggregated on the manufacturer datasheet alone.
直接替換替代品，適用於 MCIMX6L2EVN10AA — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： MCIMX6L2EVN10AA （相同外形與佔位） — 差異在於 Core Architecture, Package, Series, Mounting Type, Display Interface.
MCIMX6L2DVN10AA
✅ 直接替換聯絡詢價
查看資料表 →MCIMX6L2EVN10AB
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
MCIMX6L3DVN10AB
✅ 直接替換📋 參考替代品（不在目錄中）
MCIMX6L7DVN10AB
✅ 直接替換聯絡詢價
查看資料表 →MCIMX6L5DVN10AB
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
MCIMX6L4DVN10AB
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
MCIMX6L2EVN10AA 最大額定值與電氣特性
| Core Architecture | ARM Cortex-A9 (32-bit) |
| Core Count | 1 |
| Maximum CPU Clock | 1.0 GHz |
| Series | i.MX 6SoloLite (i.MX6SL) - Megrez |
| 封裝 | 432-MAPBGA (13 mm x 13 mm) |
| 安裝類型 | Surface Mount |
| Process Technology | 40 nm CMOS (per i.MX6 family) |
| L1 Instruction Cache | 32 KB |
| L1 Data Cache | 32 KB |
| L2 Cache | 256 KB |
| NEON Media Engine | Yes (ARM NEON SIMD) |
| Hardware Video Decoder | Yes (H.264 BP/HP, MPEG-4, VC-1) |
| Display Interfaces | Parallel LCD, LVDS, MIPI-DSI (per i.MX6SL datasheet) |
| USB | USB 2.0 with integrated HS PHY |
| Ethernet | Gigabit Ethernet MAC (with external PHY) |
| Storage | SD/MMC, eMMC, NAND, SPI NOR, Quad-SPI |
| RoHS 狀態 | Compliant |
MCIMX6L2EVN10AA 432-mapbga (13 mm x 13 mm) 腳位配置指南
MCIMX6L2EVN10AA（432-mapbga (13 mm x 13 mm) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： MCIMX6L2EVN10AA.
請參閱 資料表 以查看完整腳位配置。
典型應用
MCIMX6L2EVN10AA 適用於 7 應用s: Industrial HMI Panels, Smart Appliance Control Boards, Portable Medical Tablets, POS Terminals and Retail Pinpads, E-Reader and Low-Power Multimedia, Smart Home Gateways and Home Automation Hubs, Single-Display Automotive Infotainment (Secondary).
Industrial HMI Panels
The MCIMX6L2EVN10AA fits industrial HMI panels thanks to its 1.0 GHz Cortex-A9 core, integrated 2D graphics engine, and direct interface support for parallel RGB, LVDS, and MIPI-DSI LCDs. Pairing the SoC with a 7-12 inch capacitive touch panel and a DDR3L memory stack gives designers fluid 60 fps multi-widget GUIs under Qt/Embedded or Linux framebuffers. Compared to discrete host MCU + external graphics solutions, the integrated display controller and PCIe/USB peripherals reduce BOM cost by 20-30% on a typical 10-inch panel.
推薦
Smart Appliance Control Boards
In smart appliance control boards (HVAC, washing machine, induction cooktop with touch UI), the MCIMX6L2EVN10AA's low-power DSM mode and broad I/O set eliminate an external MCU. Its 1.0 GHz single core runs Yocto Linux for connectivity stacks (Wi-Fi, BLE, MQTT) while one of the Cortex-A9 NEON pipes accelerates touch gesture recognition. Pin-compatibility with the dual-core MCIMX6L3DVN10AB lets the same PCB serve entry-tier and mid-tier SKUs without rework.
推薦
Portable Medical Tablets
The MCIMX6L2EVN10AA powers portable medical tablets used for bedside charting, patient intake, and EMR entry. Its hardware H.264 decoder accelerates telehealth video calls, the integrated USB 2.0 HS PHY drives barcode scanners and biometric peripherals, and the capacitive touch controller interface delivers accurate signature capture. Medical-grade builds add isolation barriers and a galvanically isolated USB; developers typically run a TrustZone-aware Linux distribution with HIPAA-friendly crypto policy.
推薦
POS Terminals and Retail Pinpads
Cash registers, POS pinpads, and retail kiosks benefit from the MCIMX6L2EVN10AA's integrated gigabit Ethernet MAC, multiple USB ports, hardware AES for PCI-PTS encryption, and dual display support (operator + customer-facing screens). A merchant can drive two 1280 x 800 panels from the single SoC while keeping price/performance above legacy ARM11 designs. The 40 nm process keeps thermal output compatible with the small fan-less chassis typical of a counter-top PIN entry device.
推薦
E-Reader and Low-Power Multimedia
E-readers, A4-sized e-notebooks, and low-power multimedia tablets use the MCIMX6L2EVN10AA to drive E-ink or color reflective displays at low refresh rates with multi-week standby time. The i.MX6SL's NEON engine accelerates EPUB/PDF rasterization while the integrated 2D pipeline handles partial screen updates that preserve energy on E-ink panels. Combined with a 2 GB DDR3L + 8 GB eMMC subsystem, the SoC delivers competitive performance at sub-$25 BoM.
推薦
Smart Home Gateways and Home Automation Hubs
A sub-$30 BOM gateway with a 1.0 GHz Cortex-A9 host can run Zigbee, BLE, Wi-Fi, and Matter/Thread bridging stacks on the MCIMX6L2EVN10AA. The SoC's integrated Gigabit Ethernet MAC, USB 2.0, multiple UARTs, and SD/eMMC storage host a Linux container environment while leaving one core free for crypto offload. Designers typically pair the MCIMX6L2 with 256 MB DDR3 + 256 MB NAND and a fan-less plastic enclosure rated for home-automation environments.
推薦
Single-Display Automotive Infotainment (Secondary)
For secondary / rear-seat automotive entertainment displays, the MCIMX6L2EVN10AA drives a 720p LVDS panel with hardware H.264 decode, USB media ingest, and HDMI/analog A/V inputs. While not AEC-Q100 qualified, industrial-rev silicon has been deployed in non-critical in-cabin displays. Designs always mirror the SoC's temperature with derating; over-temperature will trigger the on-chip thermal warning and gracefully gate display refresh.
推薦
推薦產品摘要
工程參考資料，適用於 MCIMX6L2EVN10AA — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | MCIMX6L2DVN10AA | MCIMX6L2EVN10AB | MCIMX6L3DVN10AB | MCIMX6L7DVN10AB | MCIMX6L5DVN10AB |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 432-MAPBGA (13x13) | 432-MAPBGA (13x13) - same | 432-MAPBGA (13x13) - same | 432-MAPBGA (13x13) - same | 432-MAPBGA (13x13) - same | 432-MAPBGA (13x13) - same |
| CPU Cores | 1 x Cortex-A9 | 1 x Cortex-A9 | 1 x Cortex-A9 | 2 x Cortex-A9 | 2 x Cortex-A9 | 1 x Cortex-A9 |
| Max CPU Frequency | 1.0 GHz | 1.0 GHz | 1.0 GHz | 1.0 GHz | 1.0 GHz | 1.0 GHz |
| L2 Cache | 256 KB | 256 KB | 256 KB | 1 MB (dual-core L2) | 1 MB (dual-core L2) | 256 KB |
| i.MX Series | i.MX 6SoloLite (Megrez) | i.MX 6SoloLite (Megrez) | i.MX 6SoloLite (Megrez) | i.MX 6DualLite | i.MX 6DualLite | i.MX 6SoloLite (Megrez) |
| Hardware Video Decoder | Yes (H.264 BP/HP, MPEG-4, VC-1) | Yes | Yes | Yes (higher performance) | Yes (higher performance) | Yes |
| Display Controller | Parallel RGB, LVDS, MIPI-DSI | Same controller set | Same controller set | Same + HDMI/eDP | Same + HDMI/eDP | Same controller set |
| USB 2.0 HS PHY | Integrated | Integrated | Integrated | Integrated | Integrated | Integrated |
| Gigabit Ethernet MAC | Yes | Yes | Yes | Yes | Yes | Yes |
| Unit Price (1 pc, indicative) | $28.60 | ~$26.50 | ~$28.60 | ~$45.00 | ~$48.00 | ~$30.00 |
主要差異化特點
- Single-core i.MX 6SoloLite is the lowest-cost member of the i.MX6 432-MAPBGA family (對比MCIMX6L3DVN10AB)
- Same footprint as the dual-core i.MX6DL family, enabling PCB reuse between SKUs (對比MCIMX6U7CVM08AD)
- Integrated USB 2.0 HS PHY and Gigabit Ethernet MAC reduce BoM cost (對比MCIMX6L5DVN10AB)
設計說明
Use a minimum 4-layer PCB with continuous ground plane directly under the 432-MAPBGA. The 0.5 mm pitch demand microvia-compatible HDI stack-ups (any-layer or stacked microvias) for BGA escape; laser-drilled microvias at the top layer land onto the BGA balls, with deeper vias stitching planes. Keep power-plane cutouts away from the high-speed DDR3L area (SDRAM nets switch up to 1.6 GHz) and NXP's i.MX6 hardware design guide escape pattern verbatim for first-pass success.
Pair the MCIMX6L2EVN10AA with an NXP PF0100 or PF3001 PMIC to manage core, system, and DDR rails in the correct sequence during power-up and emergency shutdown. The 40 nm process means core current can spike above 1 A during H.264 decode; bulk ceramic bypass (220 µF tantalum + 4 x 22 µF ceramic) is required near the BGA. Estimate: with VIN 3.3 V and full Android workload, SoC + DDR3L BoM budget ~3.5 W, requiring 25 x 25 mm of unbroken inner ground copper for 4-layer thermal relief.
1) Do not connect 5V peripherals directly to the SoC I/O - the part is 3.3 V maximum and is NOT 5V tolerant on most pins; use PCA9410 or PCA9306 level shifters. 2) Use of an LPDDR2 instead of DDR3L requires different timing/calibration firmware and a different board bring-up image. 3) The BGA has no easily accessible GND balls for probing - lay out test pads on the outside perimeter that map to all supply rails before layout freeze.
Estimated: at 1.0 GHz and full H.264 decode workload, the SoC junction dissipates ~2.8 W; with a four-layer PCB and 25 x 25 mm of unbroken inner-plane copper the junction-to-ambient thermal resistance is ~22 C/W, giving 61.6 C junction temperature rise above 25 C ambient. For an industrial-grade 85 C ambient target, set design margins so the worst-case junction does not exceed 100 C - aim for under 70 C ambient. Add a small aluminum heat-spreader or thermal pad under the BGA if the chassis is fanless but enclosed.
合規資訊
RoHS and lead-free per NXP product marking. Not AEC-Q100 qualified - the i.MX6 automotive-family variants are different SKUs (not the Megrez i.MX6SL family). Full REACH and CMTA documentation available from NXP environmental compliance portal.
