MPC8306VMABDCA - PowerQUICC II Pro SoC, e300, 133MHz | NXP
MPN: MPC8306VMABDCA ✗ Akhir HayatMPC8306VMABDCA Ringkasan
What is a PowerQUICC communications processor? The PowerQUICC family is NXP's (formerly Freescale's) line of Power-Architecture-based system-on-chips that integrate a general-purpose CPU with a hardware protocol offload engine called the QUICC Engine. This category sits within the broader taxonomy of microprocessors -> embedded microprocessors -> communications processors -> SoC. The QUICC Engine handles HDLC, TDM and 10/100 Ethernet MACs (R/MII), letting the CPU focus on application and control-plane tasks instead of bit-banging protocols.
Key features include a single 32-bit e300c3 core at 133 MHz, DDR2 memory controller with ECC, dual 10/100 Ethernet MACs with R/MII, USB 2.0 Full-Speed, CAN 2.0, HDLC and TDM time-slot support, an integrated security engine, and IEEE 1588 v2 hardware time stamping on the MPC8306 (versus the MPC8306S, which omits 1588). The part is supplied in a 369-pin LFBGA measuring 19x19 mm and operates from a 0 to 105 °C industrial temperature range. Power is typically delivered through a multi-rail scheme with core, I/O and DDR2 supplies around 1.0 V / 1.8 V / 3.3 V.
From an integration standpoint, the device integrates the DDR2 controller, Ethernet MACs, TDM/HDLC channels, USB, CAN, I²C, SPI, UARTs, timers, GPIO, and a DMA engine on a single die. Eliminating a companion protocol chip reduces BOM cost and PCB area, while the QUICC Engine's hardware acceleration preserves CPU bandwidth for routing, security or industrial-protocol stacks.
Typical applications include industrial Ethernet gateways, factory-automation PLCs, building-automation controllers, smart-grid concentrators, branch-office routers, VoIP access equipment, and serial-protocol concentrators (HDLC/TDM). The combination of QUICC Engine protocol offload and DDR2 memory makes it suitable for medium-throughput control-plane workloads.
A key design consideration is power-rail sequencing: the core, I/O and DDR2 rails must be brought up in the correct order to avoid latch-up. Follow the sequencing and decoupling guidance in the hardware documentation, and ensure the LFBGA PCB layout meets the 19x19 mm BGA escape and thermal-coupling rules.
This page consolidates NXP and distributor data, drop-in alternatives, and design notes that streamline evaluation of the MPC8306VMABDCA for new designs and legacy refurbishment alike.
Pilihan pengganti yang segera untuk MPC8306VMABDCA — sama paket, pin-pin kompatibel. Bahagian paket yang berbeza memerlukan kerja ulang PCB diasingkan.
Varietas dalam siri ini
Model serupa yang kompatibel dengan pengganti yang segera MPC8306VMABDCA (sama faktor bentuk dan kaki) — berbeza dalam Ethernet, Memory Controller, Operating Temperature, Package, Data Bus Width.
MPC8306CVMABDCA
✅ Masuk Drop-In📋 Alternatif rujukan (tidak dalam katalog)
MPC8306SVMABDCA
✅ Masuk Drop-InHubungi untuk harga
Lihat Datasheet →MPC8308VMABDCA
✅ Masuk Drop-In ⚠️ Spesifikasi Tidak Disahkan📋 Alternatif rujukan (tidak dalam katalog)
MPC8309VMAGDGA
✅ Masuk Drop-In ⚠️ Spesifikasi Tidak Disahkan📋 Alternatif rujukan (tidak dalam katalog)
MPC8306VMABDCA Penilaian maksimum & Ciri-ciri Elektrik
| Core Processor | PowerPC e300c3 |
| Number of Cores | 1 |
| Lebar Bus Data | 32 bit |
| Core Frequency | 133 MHz |
| Memory Controller | DDR2 with ECC |
| Co-Processor / DSP | QUICC Engine (communications offload) |
| Ethernet | 2x 10/100 MAC with R/MII, IEEE 1588 v2 |
| USB | USB 2.0 Full-Speed |
| CAN | CAN 2.0 |
| Serial Protocols | HDLC, TDM (time-slot) |
| Graphics Acceleration | No |
| Kemasan | 369-LFBGA (19x19 mm) |
| Jenis Pemasangan | Surface Mount (BGA) |
| Suhu Operasi | 0 °C to +105 °C |
| Series | MPC83xx / PowerQUICC II Pro |
Panduan Konfigurasi Pin MPC8306VMABDCA 369-lfbga (19x19 mm)
Konfigurasi pin untuk MPC8306VMABDCA (369-lfbga (19x19 mm) pakai). IC digital ini termasuk GPIO, antaramuka komunikasi (UART, SPI, I2C), dan pin kuasa. Rujuk dokumen pengeluar untuk fungsi pin alternatif dan opsi konfigurasi. Biasa digunakan dalam rancangan sistem ter嵌入式 dan PCB.
Tiada data garisan pin yang diperoleh untuk MPC8306VMABDCA.
Rujuk kepada lembaran data untuk konfigurasi pin penuh.
Aplikasi Biasa
MPC8306VMABDCA patut untuk 7 aplikasis: Industrial Ethernet Gateway, Factory Automation PLC and Controller, Smart-Grid Concentrator and Substation IED, Branch-Office Router and VoIP Access, Building-Automation Controller, HDLC/TDM Protocol Concentrator, Legacy System Refurbishment and Aftermarket.
Industrial Ethernet Gateway
The MPC8306VMABDCA's dual 10/100 Ethernet MACs with IEEE 1588 v2 hardware time stamping make it well suited to industrial Ethernet gateways that bridge PROFINET, EtherNet/IP or Modbus TCP networks. The QUICC Engine offloads HDLC and TDM bit processing while the e300c3 core runs the routing and protocol-conversion stacks. DDR2 memory with ECC supplies the bandwidth required for sustained packet forwarding, and the 0 to 105 °C operating range covers factory-floor cabinet environments.
Disebarkan
Factory Automation PLC and Controller
In factory-automation controllers, the MPC8306VMABDCA combines CAN 2.0, RS-485-capable UARTs, and Ethernet on a single die, eliminating the need for a companion protocol chip. The 133 MHz e300c3 core runs the PLC scan loop and HMI logic, while the QUICC Engine handles time-critical serial-protocol traffic. With DDR2 memory, the device can buffer I/O images and recipe data, and the industrial temperature rating ensures reliability on the shop floor.
Disebarkan
Smart-Grid Concentrator and Substation IED
Smart-grid concentrators and substation intelligent electronic devices (IEDs) benefit from the MPC8306VMABDCA's integrated Ethernet, CAN, HDLC and TDM peripherals, which cover legacy substation buses and modern IP networks in one part. IEEE 1588 v2 time stamping allows precise event correlation across the substation LAN. The QUICC Engine's hardware protocol offload frees the CPU for DNP3, IEC 61850 or proprietary concentrator stacks running over DDR2 memory.
Disebarkan
Branch-Office Router and VoIP Access
Branch-office routers and VoIP access equipment require a balance of CPU performance and integrated peripherals. The MPC8306VMABDCA delivers 133 MHz of PowerPC performance plus Ethernet, USB, HDLC and TDM channels on-die, so the board can omit an external protocol processor. DDR2 memory provides packet-buffer capacity, and the QUICC Engine accelerates WAN encapsulation, making the part suitable for small-to-medium branch-office routing platforms.
Disebarkan
Building-Automation Controller
Building-automation controllers integrate lighting, HVAC and access-control subsystems over BACnet, Modbus and proprietary serial links. The MPC8306VMABDCA's on-chip Ethernet, CAN and HDLC/TDM peripherals consolidate those interfaces into a single SoC, while the e300c3 core runs the scheduling and event-handling firmware. The 369-LFBGA package keeps the controller board compact, and the 0 to 105 °C temperature rating supports mechanical-room installations.
Disebarkan
HDLC/TDM Protocol Concentrator
Telecom and industrial sites require equipment that aggregates multiple HDLC or TDM links onto Ethernet backbones. The MPC8306VMABDCA's QUICC Engine implements HDLC and TDM time-slot handling in hardware, offloading the e300c3 core so it can focus on management and aggregation logic. DDR2 memory buffers framed traffic, and the two Ethernet MACs with IEEE 1588 v2 provide the uplink with precise timing, ideal for legacy-to-IP migration gateways.
Disebarkan
Legacy System Refurbishment and Aftermarket
Because the MPC8306VMABDCA has reached NXP end-of-life, industrial OEMs often need continuing supply for field refurbishment. Authorized aftermarket specialists such as Rochester Electronics carry the original NXP die in the original 369-LFBGA package, enabling form-fit-function replacement without PCB redesign. Designers should validate date code and traceability, then confirm lead time with the distributor before committing to production volumes.
Disebarkan
Ringkasan Produk Disebarkan
Data referensi kejuruteraan untuk MPC8306VMABDCA — perbandingan, panduan rancangan, dan maklumat kesediaan
Panduan Pilihan
Perbandingan dengan Gantian
| Parametr | Produk Ini | MPC8306CVMABDCA | MPC8306SVMABDCA | MPC8308VMABDCA | MPC8309VMAGDGA |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 369-LFBGA (19x19 mm) | 369-LFBGA (19x19 mm) - same | 369-LFBGA (19x19 mm) - same | 369-LFBGA (19x19 mm) - same | 369-LFBGA (19x19 mm) - same |
| Core Processor | PowerPC e300c3, 1 core, 32-bit | PowerPC e300c3, 1 core, 32-bit | PowerPC e300c3, 1 core, 32-bit | PowerPC e300c3, 1 core, 32-bit | PowerPC e300, 2 cores, 32-bit |
| Memory Controller | DDR2 with ECC | DDR2 with ECC | DDR2 with ECC | DDR2 with ECC | DDR2 with ECC |
| Ethernet MACs | 2x 10/100 | 2x 10/100 | 2x 10/100 | Gigabit capable | 2x 10/100 |
Penyeberangsung Jelas
- IEEE 1588 v2 hardware time stamping on the Ethernet MACs (vsMPC8306SVMABDCA)
- Silicon revision drop-in alternative available (vsMPC8306CVMABDCA)
- QUICC Engine hardware protocol offload (vsMPC8308VMABDCA)
Catatan Desain
The MPC8306VMABDCA requires multi-rail sequencing (typically 1.0 V core, 1.8 V DDR2, and 3.3 V I/O). Follow the sequence defined in the hardware documentation: bring up the core supply first, then DDR2, then I/O. Use independent LDO rails or a sequencing controller to avoid latch-up; verify power-rail monotonicity with an oscilloscope at first prototype bring-up.
The 369-LFBGA package at 19x19 mm requires a multi-layer PCB with a continuous ground-reference plane beneath the BGA escape and matched-length DDR2 traces (typically within ±25 ps). Use 0.8 mm pitch BGA escape with microvias to internal signal layers. Place at least one decoupling capacitor per power-ball pair within 2 mm of the package to control switching noise on the core rail.
Because the MPC8306VMABDCA is NXP end-of-life, sourcing from unauthorized brokers risks counterfeit or remarked parts. Validate date code, lot trace, and country of origin against the Rochester Electronics or NXP authorized-channel paperwork. For new designs, plan a migration path to the QorIQ or Layerscape families to avoid future obsolescence.
Estimated: at 133 MHz and 1.0 V core, the typical core power is around 0.8 to 1.2 W; combined with I/O and DDR2 I/O power, the BGA junction-to-ambient thermal resistance usually requires at least four thermal vias in a 3x3 array under the die and a copper pour on top and bottom layers to stay within the 0 to 105 °C operating range. Verify with the hardware thermal model.
Maklumat Kesediaan
Compliance data not present in the verified web data; RoHS/REACH/lead-free status to be confirmed from the NXP product page or via the manufacturer's compliance letter before placing a new design into production.
