MPC8306VMABDCA vs MPC8306SCVMABDCA Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MPC8306VMABDCA disebabkan oleh NXP Semiconductors dan MPC8306SCVMABDCA disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
MPC8306VMABDCA - PowerQUICC II Pro SoC, e300, 133MHz | NXP
MPC8306VMABDCA ✗ Akhir HayatNXP Semiconductors
MPC8306SCVMABDCA - PowerQUICC II Pro SoC 133MHz | NXP
MPC8306SCVMABDCA ✗ Akhir HayatPengandingan Spesifikasi
| Parametr | MPC8306VMABDCA | MPC8306SCVMABDCA |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Akhir Hidup | Akhir Hidup |
| Core Processor | PowerPC e300c3 | — |
| Number of Cores | 1 | 1 |
| Lebar Bus Data | 32 bit | 32 bit |
| Core Frequency | 133 MHz | — |
| Memory Controller | DDR2 with ECC | DDR2 |
| Co-Processor / DSP | QUICC Engine (communications offload) | — |
| Ethernet | 2x 10/100 MAC with R/MII, IEEE 1588 v2 | Dual 10/100 MAC (R/MII) |
| USB | USB 2.0 Full-Speed | USB 2.0 Full-Speed |
| CAN | CAN 2.0 | — |
| Serial Protocols | HDLC, TDM (time-slot) | — |
| Graphics Acceleration | No | — |
| Kemasan | 369-LFBGA (19x19 mm) | 369-PBGA MAP-BGA (19x19 mm) |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Suhu Operasi | 0 °C to +105 °C | -40C to +105C (extended) |
| Status RoHS | [DATA_NEEDED: rohs status] | Compliant |
| Series | MPC83xx / PowerQUICC II Pro | — |
| Core | — | PowerPC e300c3 |
| Architecture | — | Power Architecture, 32-bit |
| Maximum Core Frequency | — | 133 MHz |
| Local Bus | — | 16-bit |
| Communications Engine | — | QUICC Engine (HDLC, TDM) |
| Time Synchronization | — | IEEE 1588 v2 |