MPC8306VMABDCA vs MPC8306SVMABDCA Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MPC8306VMABDCA disebabkan oleh NXP Semiconductors dan MPC8306SVMABDCA disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
MPC8306VMABDCA - PowerQUICC II Pro SoC, e300, 133MHz | NXP
MPC8306VMABDCA ✗ Akhir HayatNXP Semiconductors
MPC8306SVMABDCA - PowerQUICC II Pro MPU, e300, 133MHz | NXP
MPC8306SVMABDCA ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | MPC8306VMABDCA | MPC8306SVMABDCA |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Akhir Hidup | Masa Terakhir Dibeli |
| Core Processor | PowerPC e300c3 | — |
| Number of Cores | 1 | — |
| Lebar Bus Data | 32 bit | 32-bit |
| Core Frequency | 133 MHz | 133 MHz |
| Memory Controller | DDR2 with ECC | DDR2 up to 333 MHz data rate |
| Co-Processor / DSP | QUICC Engine (communications offload) | — |
| Ethernet | 2x 10/100 MAC with R/MII, IEEE 1588 v2 | Dual 10/100 MAC with MII/RMII |
| USB | USB 2.0 Full-Speed | USB 2.0 Full-Speed |
| CAN | CAN 2.0 | — |
| Serial Protocols | HDLC, TDM (time-slot) | — |
| Graphics Acceleration | No | — |
| Kemasan | 369-LFBGA (19x19 mm) | 369-MAPBGA (19x19 mm, 0.8 mm pitch) |
| Jenis Pemasangan | Surface Mount (BGA) | — |
| Suhu Operasi | 0 °C to +105 °C | 0C to +105C |
| Status RoHS | [DATA_NEEDED: rohs status] | Compliant (lead-free) |
| Series | MPC83xx / PowerQUICC II Pro | — |
| Core Architecture | — | PowerPC e300c3 (Power Architecture) |
| Core Count | — | 1 |
| On-chip Cache | — | 32 KB instruction / 32 KB data |
| Connectivity | — | QUICC Engine (HDLC, TDM), 2x UART |
| Tegangan Pemberi Arus | — | 1.0 V core / 1.8 V, 2.5 V, 3.3 V I/O |
| Lead-Free | — | Yes |
| Aras MSL | — | [DATA_NEEDED: MSL level] |