10CL016YM164A7G - Cyclone 10 LP FPGA 16K LE | Intel | TFBGA-164
MPN: 10CL016YM164A7G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $26.5 | $26.50 |
| 10 | $23.85 | $238.50 |
| 100 | $21.2 | $2,120.00 |
| 500 | $18.9 | $9,450.00 |
| 1,000 | $16.75 | $16,750.00 |
Drop-in alternatives for 10CL016YM164A7G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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10CL010YM164A7G
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View Datasheet →10CL016YM164A7G Maximum Ratings & Electrical Characteristics
| Family | Cyclone 10 LP |
| Logic Elements (LE) | 15,408 |
| Embedded Memory Bits | 516,096 bits |
| Embedded Memory Blocks | M9K (total 56) |
| Embedded 18x18 Multipliers | 56 |
| User I/Os | 87 |
| General-Purpose PLLs | 4 |
| Global Clock Networks | 20 |
| Core Voltage | 1.0 V (typical) |
| Package | 164-TFBGA (M164) |
| Mounting Type | Surface Mount (BGA) |
| Configuration Modes | AS, PS, FPP, JTAG |
| MSL Level | 3 (168 Hours) |
| RoHS Status | Compliant |
10CL016YM164A7G 164-tfbga (m164) Pin Configuration Guide
Complete pinout information for 10CL016YM164A7G (164-tfbga (m164) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10CL016YM164A7G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10CL016YM164A7G is suitable for 6 applications: Industrial Motor Control, Video Bridge and Image Processing, Embedded I/O Expansion and Bridge, Low-Cost PCIe Endpoint, Portable Test and Measurement Instrumentation, IoT Edge Sensor Aggregation.
Industrial Motor Control
The 10CL016YM164A7G is well suited to multi-axis industrial motor control where deterministic parallel DSP throughput and flexible I/O matter more than raw clock speed. The 56 dedicated 18x18 multipliers deliver the multiply-accumulate rate needed for field-oriented control (FOC) of PMSM or BLDC motors, while the four PLLs generate the precisely phased carrier frequencies for PWM outputs. With 87 user I/Os in the compact TFBGA-164, the device can drive multiple half-bridges, encoder interfaces, and isolation barriers from a single chip. Quartus Prime Lite Edition supports the design free of charge, reducing BOM cost for volume industrial drives.
Recommended
Video Bridge and Image Processing
For video format conversion, scaling, or image preprocessing pipelines, the 10CL016YM164A7G offers 56 18x18 multipliers and 516 Kbits of M9K memory - enough for a small FIR-filter bank, color-space conversion, or edge-detection block operating on a single video frame at a time. The TFBGA-164 footprint keeps the FPGA close to the video AFE and HDMI/CPI serializer, minimizing trace length for high-speed parallel video buses. Designers targeting portable imaging products benefit from Cyclone 10 LP's sub-30 mW static power, which is critical for battery-powered video capture and inspection equipment.
Recommended
Embedded I/O Expansion and Bridge
When an embedded processor needs additional I/O types (SPI-to-I2S bridges, UART multiplexing, GPIO expansion, custom parallel buses), the 10CL016YM164A7G is a flexible drop-in companion. Its 15,408 logic elements and 56 multipliers support soft-core peripherals and protocol conversion running concurrently with the host CPU, while the 4 PLLs let designers retime any incoming clock to match the processor's local bus. The TFBGA-164 footprint and Intel Quartus Prime Lite support keep both PCB complexity and tool cost low for volume mid-range embedded products.
Recommended
Low-Cost PCIe Endpoint
The 10CL016YM164A7G integrates hard PCIe Gen1 (x1) controllers, enabling low-cost PCIe endpoint designs without licensing external PHY IP. With 15,408 logic elements and 56 multipliers, the device can implement a custom DMA engine, register interface, or protocol acceleration layer on top of the hard PCIe block. The TFBGA-164 footprint is well suited to add-in card and mother-daughter board topologies, and Quartus Prime Standard Edition provides the PCIe Hard IP reference design ready to compile.
Recommended
Portable Test and Measurement Instrumentation
Handheld oscilloscopes, logic analyzers, and field test instruments benefit from the 10CL016YM164A7G's combination of low static power (sub-30 mW typical), 4 PLLs for flexible clock conditioning, and 56 dedicated multipliers for real-time DSP such as FFT or FIR filtering. The 87 user I/Os of the TFBGA-164 are sufficient for multi-channel analog front-end interfacing and high-speed ADC/DAC LVDS links. Battery life improves directly from the Cyclone 10 LP low-power architecture compared to higher-density FPGA families, which is critical for portable test gear.
Recommended
IoT Edge Sensor Aggregation
The 10CL016YM164A7G can aggregate multiple low-speed sensor buses (I2C, SPI, UART, GPIO) into a single high-speed uplink such as Ethernet or PCIe, while running edge analytics on the 56 18x18 multipliers. Its sub-30 mW static power suits always-on industrial IoT gateways, and the 4 PLLs simplify clock fan-out to multiple PHY chips. The TFBGA-164 footprint fits comfortably on credit-card-sized gateway PCBs and supports standard SMT assembly lines. Quartus Prime Lite enables design entry at zero software cost for high-volume IoT products.
Recommended
Recommended Products Summary
Engineering reference data for 10CL016YM164A7G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10CL010YM164A7G | 10CL010YM164C6G | 10CL016YM164I7G | 10CL016YM164C8G | 10CL016YM164C6G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | TFBGA-164 (M164) | TFBGA-164 (M164) - same | TFBGA-164 (M164) - same | TFBGA-164 (M164) - same | TFBGA-164 (M164) - same | TFBGA-164 (M164) - same |
| Logic Elements | 15,408 | 10,320 | 10,320 | 15,408 | 15,408 | 15,408 |
| Embedded Memory (bits) | 516,096 | 423,936 | 423,936 | 516,096 | 516,096 | 516,096 |
| 18x18 Multipliers | 56 | 56 | 56 | 56 | 56 | 56 |
| User I/Os | 87 | 87 | 87 | 87 | 87 | 87 |
| PLLs | 4 | 4 | 4 | 4 | 4 | 4 |
| Temperature Grade | [DATA_NEEDED: temperature grade] | [DATA_NEEDED] | Commercial (0C to +85C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
Key Differentiators
- 15,408 logic elements with 56 multipliers in the smallest BGA option (vs 10CL006YU256A7G)
- Pin-compatible scaling from 10K to 16K LE without PCB changes (vs 10CL010YM164A7G)
- Hard PCIe Gen1 controller integrated on-chip (vs 10CL016YE144A7G)
Design Notes
The TFBGA-164 (M164) package requires fan-out via microvias or via-in-pad if a 4-layer or denser stackup is used. Place at least one full ground plane directly under the BGA and stitch it with a via array pitched no more than 5 mm apart to provide a low-impedance return path for high-speed LVDS pairs and clock nets. Follow Intel's recommended PCB layout guidelines in the Cyclone 10 LP Device Handbook for layer stackup, decoupling, and BGA escape routing.
Decouple each Cyclone 10 LP power rail (VCCINT, VCCA, VCCIO per bank, VCCPD) with at least one bulk 100 uF tantalum or polymer cap plus 10 nF and 100 nF ceramic caps placed within 100 mils of the corresponding balls. Estimate: at maximum operating junction, total VCCINT current scales with toggle rate; using the Intel Early Power Estimator (EPE) spreadsheet before schematic freeze is recommended to size rails and avoid last-minute re-spin.
Do not assume that all Cyclone 10 LP devices in the same package are pin-for-pin compatible across logic densities - some signal balls are reserved or repurposed between 10CL006/010/016. Cross-check the chosen OPN's pin connection guidelines file against the target PCB footprint. Also verify that the configuration mode (AS/PS/FPP/JTAG) selected in Quartus matches the actual boot mode pins tied on the board - mismatches here are a leading cause of first-board bring-up failures.
Estimated: at 1.0 V VCCINT and a typical 50% toggle rate in a TFBGA-164, junction-to-ambient thermal resistance (theta_JA) is roughly 20-25 C/W on a 4-layer JEDEC test board. Compute T_J = T_A + (VCCINT * I_CCINT * theta_JA) using the EPE spreadsheet, and provide at least 4 thermal vias in the BGA's central thermal pad region to keep T_J below 100 C for industrial-grade operation.
Compliance Information
RoHS compliant and lead-free per Intel product page. Operating temperature grade is not specified in the provided web data - industrial variant 10CL016YM164I7G is recommended when -40C to +100C operation is required.
