10M50SAE144C8G vs 10M50SCE144A7G Comparison
Detailed side-by-side comparison of 10M50SAE144C8G by Intel and 10M50SCE144A7G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | 10M50SAE144C8G | 10M50SCE144A7G |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $47.90 | $12.85 |
| Series | MAX 10 | MAX 10 |
| Family | MAX 10 FPGA | — |
| Logic Elements (LE) | 50000 | 50,000 |
| Embedded Memory | 1677312 bits (approx. 1.6 Mbit) | — |
| Maximum User I/Os | 101 | — |
| Package | 144-LQFP Exposed Pad (EQFP-144) | — |
| Package Dimensions | 22 x 22 mm, 0.50 mm pitch | — |
| Operating Temperature | 0C to +85C (Commercial, "C8" grade) | -40C to +100C (industrial) |
| Supply Voltage - Core | [DATA_NEEDED: core Vcc] | 1.2 V (internal) |
| Process Technology | 55 nm embedded flash CMOS | TSMC 55 nm NOR-flash + SRAM |
| Configuration | Non-volatile, single-chip (on-chip flash) | — |
| On-chip User Flash | Up to 1.4 Mbit | — |
| ADC | 12-bit successive-approximation, up to 17 channels | — |
| Embedded Multipliers (18x18) | [DATA_NEEDED: 18x18 multiplier count] | — |
| I/O Standards | LVCMOS, LVDS, SSTL, RSDS, PCI | — |
| Hot Socketing | Yes | — |
| Mounting Type | Surface Mount | Surface Mount |
| RoHS Status | Compliant | Compliant |
| MSL Level | 3 | 3 (per JEDEC J-STD-020) |
| Thermal Resistance (Theta-JA) | [DATA_NEEDED: theta-JA C/W] | — |
| Embedded Memory (M9K blocks) | — | [DATA_NEEDED: M9K block count and total bits] |
| Total User Flash Bits | — | 1,677,312 bits |
| User I/O Count | — | 101 |
| Number of LABs/CLBs | — | 3,125 |
| Supply Voltage - I/O | — | 3.0 V / 3.3 V LVCMOS/LVTTL |
| Package / Case | — | 144-LQFP Exposed Pad (EQFP-144) |
| Number of PLLs | — | 2 |
| Integrated ADC | — | 12-bit, 1 MSPS (analog inputs package-dependent) |
| Configuration Method | — | On-chip non-volatile flash (instant-on, no external boot PROM) |