A3P1000-1FG484T - ProASIC3 FPGA, 1M Gates, 300 I/O | Microchip
MPN: A3P1000-1FG484T β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $233.66 | $233.66 |
| 10 | $220 | $2,200.00 |
| 100 | $200 | $20,000.00 |
| 500 | $180 | $90,000.00 |
| 1,000 | $160 | $160,000.00 |
Drop-in alternatives for A3P1000-1FG484T β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
A3P1000-1FG484I
β Drop-Inπ Reference alternative (not in catalog)
A3P1000-FG484T
β Drop-Inπ Reference alternative (not in catalog)
A3P1000-FG484I
β Drop-Inπ Reference alternative (not in catalog)
A3P1000-1FG256T
β Drop-Inβ In Stock
$89.64 / Unit
View Datasheet βA3P1000L-1FGG484I
β Drop-Inβ In Stock
$28.8 / Unit
View Datasheet βA3P1000-1FG484T Maximum Ratings & Electrical Characteristics
| Family | ProASIC3 |
| System Gates | 1,000,000 |
| Logic Elements | 11K |
| Number of I/Os | 300 |
| RAM Bits | 147,456 |
| Core Voltage | 1.5 V |
| Maximum System Performance | 272 MHz |
| Technology | 130nm Flash |
| Package | 484-FBGA |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +125C (automotive) |
| I/O Banks | 4 |
| Automotive Grade | Yes (AEC-Q100) |
| RoHS Status | Compliant |
| Configuration | Flash-based, non-volatile |
A3P1000-1FG484T 484-fbga Pin Configuration Guide
Complete pinout information for A3P1000-1FG484T (484-fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3P1000-1FG484T.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3P1000-1FG484T is suitable for 6 applications: Automotive Infotainment, Industrial Control Systems, Aerospace and Defense, Communications Infrastructure, Medical Electronics, Test and Measurement.
Automotive Infotainment
The A3P1000-1FG484T is ideal for automotive infotainment systems due to its automotive-grade qualification (AEC-Q100) and extended temperature range (-40C to +125C). With 1M gates and 300 I/Os, it can handle video processing, audio routing, and connectivity interfaces. Its flash-based configuration ensures instant-on operation, which is critical for head-unit boot-up. The device's low power consumption and high reliability make it suitable for the harsh automotive environment. Designers can use its 4 I/O banks to interface with various display and sensor modules, while the 147,456 bits of RAM support buffering for multimedia streams. The non-volatile configuration also provides secure boot, protecting against unauthorized access.
Recommended
Industrial Control Systems
In industrial control, the A3P1000-1FG484T provides a reliable, reprogrammable platform for motor control, PLCs, and robotics. Its 1M gates allow implementation of complex control algorithms, while 300 I/Os interface with sensors, actuators, and communication buses. The flash-based FPGA offers instant-on and high security, preventing unauthorized copying of proprietary algorithms. The device operates at 1.5V core, reducing power consumption in always-on industrial equipment. With 272 MHz performance, it can handle real-time processing tasks. The 484-FBGA package is suitable for compact industrial PCBs, and the automotive temperature range ensures operation in factory environments without active cooling. Designers can leverage the 4 I/O banks to support multiple voltage standards, simplifying interface design.
Recommended
Aerospace and Defense
The A3P1000-1FG484T is well-suited for aerospace and defense applications due to its flash-based, non-volatile configuration that provides inherent security against reverse engineering and bitstream tampering. With 1M gates and 300 I/Os, it can implement secure communication protocols, radar signal processing, and flight control logic. The device's radiation tolerance (though not explicitly rated) and wide temperature range make it a candidate for avionics. Its instant-on capability is crucial for mission-critical systems that must start immediately. The 484-FBGA package offers a compact footprint for space-constrained avionics boards. Designers can use the 147,456 bits of RAM for data buffering and the 272 MHz performance for high-speed processing. The automotive-grade qualification also implies robust reliability standards.
Recommended
Communications Infrastructure
In communications infrastructure, the A3P1000-1FG484T can be used for protocol bridging, packet processing, and interface conversion. Its 1M gates provide ample logic for implementing Ethernet, PCIe, or other protocol stacks, while 300 I/Os connect to PHYs and backplane interfaces. The flash-based FPGA offers low latency and deterministic behavior, essential for real-time communication. With 272 MHz performance, it can handle high-speed data paths. The 147,456 bits of RAM support FIFOs and packet buffers. The device's 1.5V core reduces power in dense networking equipment. The 484-FBGA package is suitable for line cards and switches. The automotive temperature range ensures operation in uncontrolled environments, and the non-volatile configuration allows secure field updates.
Recommended
Medical Electronics
The A3P1000-1FG484T is suitable for medical electronics such as patient monitors, imaging systems, and diagnostic equipment. Its flash-based configuration provides secure, non-volatile programming that can be updated in the field, ensuring compliance with evolving medical standards. With 1M gates and 300 I/Os, it can handle sensor interfacing, signal processing, and display control. The device's low power consumption is beneficial for portable medical devices. The 272 MHz performance supports real-time processing of physiological signals. The 484-FBGA package is compact for medical PCBs. The automotive temperature range (-40C to +125C) exceeds typical medical requirements, ensuring reliability. The 147,456 bits of RAM can buffer data for analysis. Designers can use the 4 I/O banks to interface with various analog front-ends.
Recommended
Test and Measurement
In test and measurement equipment, the A3P1000-1FG484T provides a flexible platform for implementing custom triggering, data acquisition, and signal analysis. Its 1M gates allow integration of multiple test functions into a single FPGA, reducing board space. With 300 I/Os, it can interface with ADCs, DACs, and external triggers. The flash-based FPGA offers fast configuration and secure IP protection. The 272 MHz performance enables high-speed data capture. The 147,456 bits of RAM support deep buffers for waveform storage. The device's 1.5V core minimizes power in benchtop instruments. The 484-FBGA package is suitable for modular test cards. The automotive temperature range ensures stable operation in lab environments. Designers can use the 4 I/O banks to support various logic levels.
Recommended
Recommended Products Summary
Engineering reference data for A3P1000-1FG484T β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3P1000-1FG484I | A3P1000-FG484T | A3P1000-FG484I | A3P1000-1FG256T | A3P1000L-1FGG484I |
|---|---|---|---|---|---|---|
| Package | 484-FBGA | 484-FBGA | 484-FBGA | 484-FBGA | 256-FBGA | 484-FBGA |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 |
| Number of I/Os | 300 | 300 | 300 | 300 | 177 | 300 |
| RAM Bits | 147,456 | 147,456 | 147,456 | 147,456 | 147,456 | 147,456 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Temperature Grade | Automotive (-40C to +125C) | Industrial (-40C to +100C) | Automotive (-40C to +125C) | Industrial (-40C to +100C) | Automotive (-40C to +125C) | Industrial (-40C to +100C) |
| Speed Grade | 1 (standard) | 1 (standard) | [DATA_NEEDED] | [DATA_NEEDED] | 1 (standard) | 1 (standard) |
Key Differentiators
- Automotive-grade qualification (AEC-Q100) (vs A3P1000-1FG484I)
- Flash-based non-volatile configuration (vs SRAM-based FPGAs)
- High I/O count in 484-FBGA package (vs A3P1000-1FG256T)
Design Notes
The A3P1000-1FG484T requires a 1.5V core supply. Use a low-dropout regulator (LDO) or a switching regulator with low ripple to provide this rail. Decouple each VCC pin with a 0.1uF ceramic capacitor and add bulk capacitance (10uF) near the FPGA. The I/O banks have dedicated VCCIBx supplies; ensure each bank's voltage matches the connected I/O standard. Refer to the ProASIC3 datasheet for recommended power-up sequencing.
The 484-FBGA package has a thermal resistance that depends on airflow and PCB design. For high-density designs, ensure adequate copper pour and thermal vias under the package. The automotive temperature range (-40C to +125C) allows operation in harsh environments, but power dissipation must be managed. Estimate junction temperature using the formula Tj = Ta + (theta_JA * P), where P is the total power consumption. For typical designs with 1W dissipation, a theta_JA of 20C/W results in a 20C rise, which is acceptable.
For the 484-FBGA package, use a 4-layer or more PCB with dedicated power and ground planes. Place decoupling capacitors as close to the FPGA pins as possible. Route high-speed signals with controlled impedance and minimize trace lengths. Follow the layout guidelines in the ProASIC3 datasheet, including via placement and ground stitching. Ensure the BGA footprint matches the recommended land pattern to avoid solder joint issues.
Compliance Information
Automotive grade (AEC-Q100) per part number suffix 'T'. RoHS compliance indicated by distributor listings. Other compliance details not explicitly stated in provided data.
