A54SX16-TQG176I - SX FPGA 24K Gates 176-TQFP | Microchip
MPN: A54SX16-TQG176I ✓ Active| Qty | Unit Price | Extended |
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Drop-in alternatives for A54SX16-TQG176I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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A54SX16-TQG176
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$203.14 / Unit
View Datasheet →A54SX16-1TQG176I
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Contact for price
View Datasheet →A54SX16-2TQG176I
✅ Drop-In✓ In Stock
$20.8 / Unit
View Datasheet →A54SX16-2TQG176
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$339.14 / Unit
View Datasheet →A54SX16P-TQG176I
✅ Drop-In✓ In Stock
$26.4 / Unit
View Datasheet →A54SX16P-1TQG176I
✅ Drop-In✓ In Stock
$30.4 / Unit
View Datasheet →A54SX16P-2TQG176I
✅ Drop-In✓ In Stock
$42 / Unit
View Datasheet →A54SX16P-1TQG176
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$28.6 / Unit
View Datasheet →A54SX16-TQG176I Maximum Ratings & Electrical Characteristics
| Series | SX |
| System Gates | 24000 |
| Logic Cells / Modules | 924 |
| Number of I/O | 147 |
| Maximum System Frequency | 240 MHz |
| Process Technology | 0.35 um antifuse CMOS |
| Supply Voltage (Core) | 3 V to 3.6 V |
| Supply Voltage (I/O) | 4.75 V to 5.25 V |
| Operating Temperature | -40C to +85C (TA) |
| Package / Case | 176-TQFP (24x24 mm) |
| Mounting Type | Surface Mount |
| Programmability | One-time programmable (antifuse) |
| Packaging | Tray |
| RoHS Status | ROHS3 Compliant |
| Lead Time | 10 weeks |
| Product Status | Active |
A54SX16-TQG176I 176-tqfp (24x24 mm) Pin Configuration Guide
Complete pinout information for A54SX16-TQG176I (176-tqfp (24x24 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A54SX16-TQG176I.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A54SX16-TQG176I is suitable for 6 applications: Industrial Control and Automation, Design-Secure Control Logic, Communication Interface Glue Logic, Aerospace and Defense Subsystems, Legacy System Obsolescence Redesign, Test and Measurement Instrumentation.
Industrial Control and Automation
The A54SX16-TQG176I fits industrial control logic because its 4.75-5.25V I/O supply drives legacy 5V TTL/CMOS sensors, PLC backplanes, and relay driver interfaces directly, eliminating level-shifting circuitry that SRAM FPGAs running at 1.2-3.3V would require. The 24K-gate capacity and 924 cells accommodate state machines, encoders, and glue logic at up to 240 MHz, far exceeding CPLD capability. The antifuse configuration powers up instantly with no configuration device, critical for equipment that must be operational immediately after power loss recovery. The -40C to +85C industrial rating and RoHS3-compliant 176-TQFP package support standard SMT production on industrial PCBs. Trade-off: one-time programming requires finalized logic before production, so reserve the 147 I/O with margin for late-stage changes.
Recommended
Design-Secure Control Logic
For proprietary control logic where bitstream theft is a concern, the A54SX16-TQG176I offers a structural advantage over SRAM FPGAs: the antifuse interconnect is programmed permanently at the factory or in-circuit and stores no configuration bitstream that can be read from an external flash device. SRAM FPGAs expose their design in the configuration memory, requiring encryption management, whereas the antifuse part's 24K-gate design is physically embedded in silicon. The 147 user I/O and 240 MHz performance support interface logic, authentication engines, and security state machines. The 176-TQFP package simplifies layout versus ceramic column BGA alternatives used in military programs. Designers should note that design security is strongest because reverse engineering antifuse nets requires destructive delayering, raising the cost of IP extraction substantially.
Recommended
Communication Interface Glue Logic
The A54SX16-TQG176I bridges legacy communication interfaces: 5V-tolerant I/O banks connect directly to backplane transceivers, line cards, and microprocessor buses from the 5V era, while the 3.3V core keeps dynamic power reasonable. With 24,000 gates and 924 cells at up to 240 MHz system performance, it integrates address decoders, bus arbiters, UART/SPI glue functions, and protocol converters that previously required multiple CPLDs, reducing board area and BOM cost. Instant-on antifuse configuration means interfaces are active before host processors complete boot, simplifying reset sequencing. The industrial -40C to +85C range covers uncooled telecom equipment rooms. When timing closure matters, select the -2 speed grade drop-in (A54SX16-2TQG176I) since it uses the identical 176-TQFP footprint.
Recommended
Aerospace and Defense Subsystems
Microsemi (now Microchip) antifuse FPGAs have a long heritage in defense programs, and the A54SX16-TQG176I continues that role for non-rad-hard avionics, ground systems, and test equipment. The antifuse technology exhibits high immunity to configuration upsets compared with SRAM cells because programmed links are permanent conductive paths, and there is no external configuration memory to corrupt. The 24K-gate device implements telemetry formatters, camera timing generators, and interface controllers within a hermeticity-friendly 176-TQFP package. Operation from -40C to +85C covers most sheltered defense environments, and the dual 3.3V/5V rails integrate with legacy military 5V logic families such as ACT/HCT. For radiation-critical orbits, migrate within Microchip's RTAX-S family, which shares design methodology and Libero toolchain knowledge.
Recommended
Legacy System Obsolescence Redesign
The A54SX16-TQG176I is a strong vehicle for consolidating obsolete PAL/GAL/22V10 and discrete 5V TTL glue logic into a single modern-supported device. Its 5.0V I/O rail (4.75-5.25V) preserves direct compatibility with the original 74-series environment that CPLDs like the EPM7000 family can no longer easily match in new supply, while 24K gates provide 5-10x the capacity of classic SPLDs. The active lifecycle status and 10-week lead time provide continuity for service parts manufactured in small lots, and tray packaging suits low-volume kitting. Because antifuse programming is permanent, each service-board revision needs freshly programmed devices, so maintain programmed spares. The RoHS3 compliance of this MPN also satisfies EU repair-market requirements for legacy equipment sold into Europe.
Recommended
Test and Measurement Instrumentation
Bench and automated test instruments benefit from the A54SX16-TQG176I's instant-on behavior: timing generators, trigger logic, and scanner control become functional the moment power is applied, without configuration latency, which shortens instrument startup to levels customers expect from hardware-only designs. The 240 MHz capability supports counter/timer and pulse-generator functions with sub-10 ns resolution at the I/O pins, and 147 user I/O accommodates high-channel-count switching matrices through the 176-TQFP's generous pin ring. The 5V I/O domain interfaces directly with relay drivers and legacy instrument buses. The industrial temperature range permits uncooled rack use, and the tray-packaged, RoHS3-compliant SMT package supports standard contract-manufacturing assembly for instrument production volumes.
Recommended
Recommended Products Summary
Engineering reference data for A54SX16-TQG176I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A54SX16-TQG176 | A54SX16-2TQG176I | A54SX16P-TQG176I |
|---|---|---|---|---|
| Package | 176-TQFP (24x24 mm) | 176-TQFP - same | 176-TQFP - same | 176-TQFP - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 24000 | 24000 | 24000 | 24000 |
| User I/O | 147 | 147 | 147 | 147 |
| Temperature Range | -40C to +85C | 0C to +70C (commercial) | -40C to +85C | -40C to +85C |
| Speed Class | Standard (240 MHz class) | Standard | -2 (up to 320 MHz class) | Standard (P-die) |
| Supply Voltage | 3.0-3.6V core, 4.75-5.25V I/O | 3.3V / 5V | 3.3V / 5V | 3.3V / 5V |
| RoHS Status | ROHS3 Compliant | Compliant | Compliant | Compliant (Pb-free die) |
| Lead Time | 10 weeks | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Faster -2 speed grade available in the same footprint (vs A54SX16-2TQG176I)
- Industrial temperature rating (vs A54SX16-TQG176)
- Lead-free P-die revision for RoHS programs (vs A54SX16P-TQG176I)
Design Notes
The A54SX16-TQG176I requires two supply domains: 3.0-3.6V for the core and 4.75-5.25V for I/O. Decouple each rail with at least 10 uF bulk plus 0.1 uF ceramic capacitors placed at the package corners, following the SX family datasheet power-supply guidance. Observe the recommended power-up sequence/ramp requirements from the manufacturer datasheet, since 5V applied to I/O before core bias is conditioned by device-specific constraints. Estimated: at 240 MHz toggling a typical design, core dynamic current is design-dependent - run Libero static power analysis before sizing the 3.3V regulator.
The 176-TQFP has a 0.5 mm lead pitch; use a standard TQFP-176 land pattern per IPC-7351 with solder-mask-defined pads to improve self-alignment during reflow. Fan out I/O with 0.2 mm traces escaping diagonally to four breakout rows. Thermal dissipation of this 0.35 um antifuse device is low for typical designs, so the die pad and ground planes normally suffice without heatsinking; verify with an estimate: theta-JA for TQFP-176 is typically near 30-40 C/W, so even 0.5 W yields under 20C rise. Confirm the exact theta-JA from the manufacturer datasheet.
Antifuse FPGAs are one-time programmable: a design change after programming requires a new physical device. Budget 10-20% spare devices for engineering iterations, and fully verify timing and function in Libero simulation before programming. Do not mix speed grades in one production run without re-running timing analysis, because the standard grade guarantees lower timing margins than the -2 grade. Unused I/O should be configured per the datasheet recommendation (typically ground-referenced or tristate) to avoid floating-input noise and excessive current draw.
Compliance Information
ROHS3 Compliant and LEAD FREE confirmed per Microchip USA product page. REACH, halogen-free, and conflict-minerals status not stated in retrieved data.
