A54SX08-2TQG176I - SX FPGA 12K Gates 176-TQFP | Microsemi
MPN: A54SX08-2TQG176I ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $42.5 | $42.50 |
| 10 | $39.1 | $391.00 |
| 100 | $35.2 | $3,520.00 |
| 500 | $31.8 | $15,900.00 |
| 1,000 | $28.9 | $28,900.00 |
Drop-in alternatives for A54SX08-2TQG176I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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A54SX08-TQG176I
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View Datasheet →A54SX08-2TQG176I Maximum Ratings & Electrical Characteristics
| Series | SX (SX08) |
| System Gates | 12,000 |
| Typical Gates | 8,000 |
| Logic Cells | 512 |
| LABs / CLBs | 768 |
| User I/O | 128 |
| Speed Grade | -2 |
| Technology | 0.35um CMOS, antifuse (OTP) |
| Supply Voltage (Core/IO) | 3.3 V (3.0 V to 3.6 V) |
| Alternative Supply Voltage | 5 V (4.75 V to 5.25 V) |
| Max Clock Frequency | 320 MHz |
| Package | 176-TQFP (24x24 mm) |
| Mounting Type | Surface Mount |
| Programming Type | One-Time Programmable (antifuse) |
A54SX08-2TQG176I 176-tqfp (24x24 mm) Pin Configuration Guide
Complete pinout information for A54SX08-2TQG176I (176-tqfp (24x24 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A54SX08-2TQG176I.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A54SX08-2TQG176I is suitable for 6 applications: Industrial Control and Automation Logic, 5V/3.3V Bus Interface Bridging, Aerospace and Defense Support Logic, Communications Equipment State Machines, Test and Measurement Instrumentation, Secure/Instant-On Embedded Systems.
Industrial Control and Automation Logic
The A54SX08-2TQG176I fits industrial control and factory automation boards that need deterministic, instantly-active control logic without external configuration memory. Its 12,000 gates, 512 logic cells, and 128 user I/O provide ample capacity for sequencers, interlock logic, and I/O expansion in PLC-class hardware. The 3.3V/5V dual supply operation allows direct bridging of legacy 5V sensor and relay-driver rails with modern 3.3V controllers. Because the antifuse configuration is non-volatile and immune to configuration upsets, logic starts functioning within microseconds of power application - important for safety interlocks. Designers should budget for the one-time-programmable nature by fully validating logic in simulation before production programming.
Recommended
5V/3.3V Bus Interface Bridging
Legacy 5V TTL buses persist in industrial, telecom, and test equipment, and the A54SX08-2TQG176I addresses this directly with its 4.75V to 5.25V supply option alongside 3.0V to 3.6V operation. With 128 user I/O in the 176-TQFP, it absorbs bus transceivers, address decoders, and wait-state generators that would otherwise require several SSI/MSI devices, reducing BOM count. The SX08's 0.35um CMOS I/O structure is specified for both voltage domains, simplifying mixed-voltage design without level shifters. Engineers should confirm per-bank current limits in the SX datasheet when driving heavily loaded 5V buses, and reserve margin on the -2 speed grade for long propagation chains through the antifuse interconnect.
Recommended
Aerospace and Defense Support Logic
Microsemi SX-family antifuse FPGAs are widely used in aerospace and defense programs for housekeeping, telemetry encoding, and radiation-tolerant system support logic. The A54SX08-2TQG176I's antifuse interconnect cannot be altered by configuration memory upsets, giving inherent robustness advantages over SRAM FPGAs for instant-on payload functions. The industrial temperature I-grade and 176-TQFP 24x24 package suit ruggedized board assemblies. At 12,000 gates with 512 cells, the device handles state machines, counters, and interface glue for flight hardware where function is modest but reliability is paramount. The same-footprint SX16/SX32 alternatives provide a density escalation path without board redesign, supporting long-lived platform upgrades.
Recommended
Communications Equipment State Machines
Line-card, backplane, and protocol-framing boards benefit from the A54SX08-2TQG176I's up to 320 MHz family clock architecture and deterministic antifuse routing. The 512 logic cells comfortably implement HDLC-style framers, elastic buffers, and control state machines, while 128 I/O terminate parallel status and alarm buses across the 176-TQFP. Because configuration loads from silicon rather than a boot device, the logic is live within microseconds of power-on, avoiding link-establishment delays inherent to SRAM FPGA configuration flows. When using the -2 speed grade near its timing limits, route critical counters with shortest paths and verify with static timing analysis in Libero before committing to the one-time-programmable device.
Recommended
Test and Measurement Instrumentation
Bench instruments and automated test fixtures use the A54SX08-2TQG176I for trigger logic, timing generators, and fixture control glue. The -2 speed grade provides the faster timing bin of the SX08 family, useful for counter/timer chains, and the dual 3.3V/5V supply operation lets the FPGA sit directly on legacy 5V instrument backplanes. The 176-TQFP (24x24 mm) footprint is hand-solderable for prototype iterations and widely supported by socket vendors for engineering use. One practical caveat: since antifuse devices are one-time programmable, instrument designers typically validate logic on socketed engineering units before soldering production devices, keeping the 12,000-gate capacity and 128 I/O fully committed once programmed.
Recommended
Secure/Instant-On Embedded Systems
Applications that must never reveal design details or wait for configuration - secure controllers, tamper-evident equipment, and instant-on subsystems - exploit the A54SX08-2TQG176I's antifuse OTP architecture. There is no bitstream to intercept in transit and no configuration flash to corrupt or read back, so the 12,000-gate design is protected in silicon. The device begins operating its configured logic immediately at power-up, meeting cold-start requirements of monitoring and access-control systems. The industrial-grade I suffix and 176-TQFP package support extended-environment enclosures. Designers should note that physical design security is inherited from the technology itself, but the trade-off is zero field updatability - logic changes require new devices.
Recommended
Recommended Products Summary
Engineering reference data for A54SX08-2TQG176I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A54SX08-TQG176I | A54SX32-1TQG176I | A54SX16-TQG176I |
|---|---|---|---|---|
| Package | 176-TQFP (24x24) | 176-TQFP (24x24) - same | 176-TQFP (24x24) - same | 176-TQFP (24x24) - same |
| Brand | Microsemi (Microchip Technology) | Microsemi (Microchip Technology) | Microsemi (Microchip Technology) | Microsemi (Microchip Technology) |
| System Gates | 12,000 | 12,000 | 32,000 | 16,000 |
| Logic Cells | 512 | 512 | [DATA_NEEDED] | [DATA_NEEDED] |
| Speed Grade | -2 | Base (standard) | -1 | Base (standard) |
| User I/O | 128 | 128 | [DATA_NEEDED] | [DATA_NEEDED] |
| Supply Voltage | 3.3 V / 5 V | 3.3 V / 5 V | 3.3 V / 5 V | 3.3 V / 5 V |
| Temperature Grade | Industrial (I suffix) | Industrial (I suffix) | Industrial (I suffix) | Industrial (I suffix) |
| Programming Technology | Antifuse (OTP) | Antifuse (OTP) | Antifuse (OTP) | Antifuse (OTP) |
Key Differentiators
- Fastest -2 speed grade in the SX08 176-TQFP offering (vs A54SX08-TQG176I)
- Lowest cost per gate on the 176-TQFP footprint (vs A54SX32-1TQG176I)
- Dual 3.3V/5V supply operation (vs Modern SRAM FPGAs (3.3V I/O max))
- Instant-on antifuse configuration (vs A54SX16-TQG176I (same technology))
Design Notes
The A54SX08-2TQG176I is a one-time-programmable antifuse FPGA. Unlike SRAM FPGAs, a design error cannot be patched by reloading - every design iteration consumes a new physical device. Complete behavioral simulation, post-place-and-route timing simulation, and static timing analysis in Microsemi Libero/Designer before submitting devices to programming. Budget for 2-3 engineering iterations in prototype quantity planning, and consider socketing initial units for logic validation before soldering production devices onto the 176-TQFP footprint.
The SX08 supports two supply options: 3.3V (3.0-3.6V) and 5V (4.75-5.25V). Decide the I/O voltage domain early because it drives the board power tree and compatibility with surrounding logic. Provide local decoupling of at least 0.1uF ceramic per supply pin pair plus bulk 10uF near the device; antifuse FPGAs have low dynamic switching current relative to SRAM FPGAs, but simultaneous switching outputs on 128 I/O can still induce ground bounce. Verify the maximum current per ground pin in the SX family datasheet thermal/reliability sections when driving heavy 5V loads.
The 176-TQFP (24x24 mm) has a fine lead pitch typical of 176-pin QFP packages. Follow the manufacturer land pattern exactly, use solder paste apertures at 1:1 ratio, and inspect with magnification or X-ray for bridging on adjacent leads. The central die area of a TQFP has no exposed pad, so thermal relief comes from the leads; place thermal vias near the package perimeter only if board-level thermal analysis indicates a need. Keep clock routing short and reference a solid ground plane to limit the -2 speed-grade clock edges from radiating.
Compliance Information
The G suffix in TQG176 typically denotes Microchip/Microsemi green (halogen-free, lead-free) packaging, but explicit RoHS/REACH declarations were not present in the provided data; confirm via the manufacturer product page certificate of compliance.
