RTAX1000SL-CGS624B - 1M-Gate Rad-Tolerant FPGA CCGA-624 | Microchip
MPN: RTAX1000SL-CGS624B ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1720 | $17,200.00 |
| 100 | $1590 | $159,000.00 |
| 500 | $1480 | $740,000.00 |
| 1,000 | $1390 | $1,390,000.00 |
Drop-in alternatives for RTAX1000SL-CGS624B — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
RTAX1000SL-CGS624V
✅ Drop-In✓ In Stock
$3400 / Unit
View Datasheet →RTAX1000SL-CGS624E
✅ Drop-In✓ In Stock
$3970 / Unit
View Datasheet →RTAX1000SL-1CGS624B
✅ Drop-In✓ In Stock
$3200 / Unit
View Datasheet →RTAX1000SL-1CGS624E
✅ Drop-In✓ In Stock
$3420 / Unit
View Datasheet →RTAX2000SL-CGS624B
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →RTAX1000SL-CGS624B Maximum Ratings & Electrical Characteristics
| Family | RTAX-S/SL Radiation-Tolerant FPGA |
| Equivalent System Gates | 1,000,000 gates |
| ASIC Gates | 125,000 gates |
| Combinational Cells (CLBs) | 12096 |
| Technology | 0.15 um CMOS, anti-fuse |
| Core Supply Voltage | 1.5 V |
| Maximum System Frequency | 581 MHz |
| Package | 624-pin CCGA (CGS624) |
| Speed Grade | B |
| Embedded SRAM | Yes, with built-in FIFO control logic |
| Configuration | Live-at-power-up (anti-fuse, single chip) |
| Clock Features | Segmentable clocks, chip-wide highway routing |
| Mounting Type | Surface Mount |
RTAX1000SL-CGS624B 624-pin ccga (cgs624) Pin Configuration Guide
Complete pinout information for RTAX1000SL-CGS624B (624-pin ccga (cgs624) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for RTAX1000SL-CGS624B.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
RTAX1000SL-CGS624B is suitable for 6 applications: Satellite Payload Data Processing, Spacecraft Bus Control, Telemetry, Tracking & Command (TT&C), Deep-Space Science Instrument Control, Launch Vehicle Avionics, Earth Observation Imaging Chains.
Satellite Payload Data Processing
The RTAX1000SL-CGS624B fits payload processing chains that need 1M gates of reprogrammable logic plus embedded SRAM FIFOs in a single rad-tolerant chip. Its anti-fuse fabric is live at power-up, eliminating configuration-flash SEE concerns that plague SRAM FPGAs in orbit, and the 12,096 CLBs implement channelizers, FEC encoders, and framing engines. Placed between ADC/FPGA front ends and downlink modulators, its embedded SRAM with built-in FIFO control buffers high-rate science data without external memory, reducing parts count and board-level failure points. The 581 MHz B-grade fabric supports parallel datapaths at 100+ MHz real-world clock rates, and the CCGA-624 package's column interconnect withstands thermal cycling over multi-year LEO missions.
Recommended
Spacecraft Bus Control
Spacecraft bus controllers demand deterministic, always-on logic that survives total ionizing dose over mission life, which is exactly the RTAX-SL anti-fuse value proposition. The RTAX1000SL-CGS624B implements reaction-wheel interfaces, mode-state machines, and housekeeping telemetry with live-at-power-up operation so the FPGA is functional the instant the spacecraft separates from the launch vehicle - no configuration load delay. Its segmentable clocks and chip-wide highway routing support multiple independent functional domains (power, AOCS, TT&C) within one device. Low static power from the 1.5V core preserves battery energy during eclipse operations, and the CCGA-624 ceramic package provides hermetic environmental protection for vacuum operation.
Recommended
Telemetry, Tracking & Command (TT&C)
TT&C subsystems benefit from the RTAX1000SL-CGS624B's combination of 1M gates and deterministic anti-fuse timing with no configuration-upset risk from single-event effects. Designers implement CCSDS framing, convolutional and Reed-Solomon encoders/decoders, and command decoders in the 12,096-CLB fabric, while embedded SRAM blocks with FIFO control handle rate buffering between the baseband and RF sections. Because the device is configured at manufacture (one-time programmable), TT&C logic cannot be corrupted in flight - a critical reliability property for the link that commands the spacecraft. The B speed grade's 581 MHz ceiling comfortably covers typical TT&C symbol rates with parallelism margin.
Recommended
Deep-Space Science Instrument Control
Deep-space instruments such as spectrometers and imagers require logic that tolerates high TID behind minimal shielding, and the RTAX1000SL-CGS624B addresses this with its rad-tolerant 0.15 um CMOS anti-fuse process. Instrument sequencers, ADC interface logic, and on-board compression engines fit within the 1M-gate / 125,000 ASIC-gate capacity, with embedded SRAM FIFOs absorbing burst data from sensor arrays. True single-chip operation (no external configuration device) reduces the parts exposed to the radiation environment. Engineers should budget SEU mitigation via triple-module redundancy in the fabric, and use the Microchip prototyping methodology on commercial Axcelerator parts before committing flight units.
Recommended
Launch Vehicle Avionics
Launch-vehicle flight computers and stage controllers use the RTAX1000SL-CGS624B where short but severe missions demand guaranteed live-at-power-up behavior and vibration-tolerant column-grid packaging. The CCGA-624 ceramic package's column interconnect resists mechanical shock during stage separation better than fine-pitch commercial BGAs, and the anti-fuse fabric needs no boot sequence during the seconds-critical launch timeline. The 1M-gate fabric implements GN&C glue logic, redundant-voter circuits, and telemetry multiplexers, while segmentable clocks let designers partition safety-critical and non-critical functions with independent timing domains. DLA-qualified variants of the RTAX1000SL family exist under Mil-Prf-38535 Class V per Microchip's DLA cross-reference guide.
Recommended
Earth Observation Imaging Chains
Earth-observation satellites route high-rate imager data through the RTAX1000SL-CGS624B, which provides enough 12,096-CLB capacity for CCD/CMOS sensor interface, defect correction, and lossless pre-compression in one rad-tolerant chip. Embedded SRAM with FIFO control logic buffers line data between the sensor clock domain and the mass-memory downlink domain without external FIFO ICs. The device's low power consumption matters because imaging payloads are power-budget-critical in orbit, and live-at-power-up anti-fuse configuration ensures the imager is ready at first acquisition. For higher-resolution instruments, the same-package RTAX2000SL-CGS624B doubles logic capacity with zero board redesign.
Recommended
Recommended Products Summary
Engineering reference data for RTAX1000SL-CGS624B — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | RTAX1000SL-CGS624V | RTAX1000SL-CGS624E | RTAX1000SL-1CGS624B | RTAX2000SL-CGS624B |
|---|---|---|---|---|---|
| Package | 624-pin CCGA (CGS624) | 624-pin CCGA (CGS624) - same | 624-pin CCGA (CGS624) - same | 624-pin CCGA (CGS624) - same | 624-pin CCGA (CGS624) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Equivalent System Gates | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 | 2,000,000 |
| CLBs (Cells) | 12096 | 12096 | 12096 | 12096 | 21504 |
| Speed Grade | B | V | E | B | B |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Maximum System Frequency | 581 MHz | [DATA_NEEDED] | [DATA_NEEDED] | 581 MHz | [DATA_NEEDED] |
| Configuration | Anti-fuse, live-at-power-up (single chip) | Anti-fuse, live-at-power-up | Anti-fuse, live-at-power-up | Anti-fuse, live-at-power-up | Anti-fuse, live-at-power-up |
Key Differentiators
- 1M-gate density in the flight-proven RTAX-SL anti-fuse family (vs RTAX250SL-CG624B)
- Pin-compatible upgrade path without board redesign (vs RTAX2000SL-CGS624B)
- Live-at-power-up single-chip operation vs SRAM FPGAs (vs RTAX1000SL-CGS624V)
Design Notes
The CGS624 CCGA uses solder columns rather than solder balls, so the land pattern must be designed for column pitch with adequate fillet volume; follow the RTAX-S/SL datasheet package mechanical drawing. Columns mechanically decouple the ceramic substrate from PCB thermal-expansion mismatch, which is essential across the large temperature swings of orbital missions. Avoid routing high-speed signals directly under the package center without a ground plane, and verify board warpage specs meet the ceramic package flatness requirement before reflow profiling.
RTAX-S devices are one-time programmable anti-fuse FPGAs - there is no rework path after programming. Complete full timing closure, functional verification, and pin assignment sign-off in Microchip Libero SoC before sending flight units to programming. Use the manufacturer's prototyping methodology (footprint-compatible adaptor board on commercial Axcelerator parts plus EDIF netlist and pinout conversion) to shake out design bugs on cheap commercial silicon first, per the application note 'Prototyping for RTAX-S and RTAX-SL Devices'.
Estimate: budget the 1.5V core supply per the RTAX-S/SL datasheet power calculator with your actual toggle rates, since fabric power scales with switching activity and the 1M-gate fabric can draw substantial current at high utilization. Provide independent clean rails for core and I/O banks with bulk plus 0.1uF decoupling at each supply pin group. Ensure power-up ramp meets datasheet monotonicity requirements - anti-fuse devices must be live and configured correctly at first power application.
With 624 I/O available in the CGS624 package, group I/O banks by voltage standard and keep simultaneously switching outputs distributed across banks to limit ground bounce on the ceramic substrate. Simulate flight harness-driven lines for reflection and crosstalk, and reserve spare pins for mitigated (TMR-replicated) signals in SEU-critical paths. Match trace lengths within source-synchronous buses such as ADC or DDR-style interfaces to the datasheet setup/hold budgets for the B speed grade.
Compliance Information
Space-flight hermetic ceramic package (CCGA); DLA-qualified variants of the RTAX1000SL family exist under DLA standard microcircuit drawings per Microchip's DLA Cross Reference Guide (Mil-Prf-38535 QML Class Q/V). Specific RoHS/REACH status for this exact ordering code not stated in provided data.
