RTAX250S-CG624B - 250K Gate Rad-Tolerant FPGA CCGA-624 | Microchip
MPN: RTAX250S-CG624B ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3500 | $3,500.00 |
| 10 | $3325 | $33,250.00 |
| 100 | $3150 | $315,000.00 |
| 500 | $2975 | $1,487,500.00 |
| 1,000 | $2800 | $2,800,000.00 |
Drop-in alternatives for RTAX250S-CG624B — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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RTAX250SL-1CG624B
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View Datasheet →RTAX250S-1CG624B
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View Datasheet →RTAX250S-1CG624E
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View Datasheet →RTAX250SL-CG624V
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View Datasheet →RTAX250SL-CG624E
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View Datasheet →RTAX250SL-1CG624B
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View Datasheet →RTAX250S-CG624B Maximum Ratings & Electrical Characteristics
| System Gates | 250000 gates |
| Logic Cells (CLBs) | 2816 cells |
| Maximum System Frequency | 649 MHz |
| Process Technology | 0.15 um CMOS |
| Core Supply Voltage | 1.5 V |
| Package Type | CCGA-624 (Ceramic Column Grid Array, 624 pins) |
| Logic Family | CMOS |
| Operating Temperature | -55C to +125C |
| Radiation Tolerance | SEU rate < 10^-10 errors/bit-day; SEU-hardened registers |
| Configuration | One-time programmable antifuse, live at power-up |
| Embedded Memory | Embedded SRAM with built-in FIFO control logic |
| Product Family | RTAX-S / RTAX-SL Radiation-Tolerant FPGA |
| Architecture Basis | Microsemi Axcelerator commercial family |
| TMR Requirement | Eliminated for registers via SEU hardening |
| Mounting Type | Surface Mount |
| Speed Grade Option | Standard; -1 grade approximately 15% faster |
RTAX250S-CG624B ccga-624 (ceramic column grid array, 624 pins) Pin Configuration Guide
Complete pinout information for RTAX250S-CG624B (ccga-624 (ceramic column grid array, 624 pins) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for RTAX250S-CG624B.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
RTAX250S-CG624B is suitable for 6 applications: Payload Data Processing, Spacecraft Bus Control, Telemetry and Telecommand Interfaces, Instrument and Sensor Front Ends, Attitude Determination and Control, Rad-Hard Glue Logic Replacement.
Payload Data Processing
The RTAX250S-CG624B fits onboard payload processing where 250,000 gates and 2,816 CLBs provide enough fabric for image compression, packetization, and FFT acceleration while drawing minimal static power from the 1.5 V core on a 0.15 um CMOS process. Its SEU-hardened registers allow single-chip implementation without blanket TMR, keeping timing closure feasible at speeds up to 649 MHz for internal paths. Designers typically implement high-throughput datapaths in the core fabric and use embedded SRAM with built-in FIFO control for buffering between sensor interfaces and downlink formatters, exploiting the single-chip, live-at-power-up antifuse architecture to eliminate external configuration memory in the payload bay.
Recommended
Spacecraft Bus Control
For command and data handling (C&DH) units, the RTAX250S-CG624B implements MIL-STD-1553, SpaceWire, and CAN-style bus controllers within its 2,816-cell fabric, surviving the -55C to +125C military temperature range typical of bus electronics. Live-at-power-up antifuse configuration ensures the FPGA is functional immediately after a brownout or safe-mode power cycle, which is essential for autonomous fault recovery. The CCGA-624 ceramic package provides the column-array mechanical reliability and board-level testability demanded by launch environments, and SEU rates below 10^-10 errors per bit-day keep control-plane corruption risk within typical mission assurance budgets without triple module redundancy on every register.
Recommended
Telemetry and Telecommand Interfaces
The RTAX250S-CG624B suits TM/TC front ends that must decode uplink commands and format downlink frames deterministically. Its segmentable clock structures let designers isolate the telecommand decoder clock domain from the payload clock domain, while chip-wide highway routing simplifies frame-buffer interconnect across the 250K-gate die. Embedded SRAM blocks with FIFO control logic stage telemetry packets without external SRAM, reducing part count on a radiation-sensitive board. Because the device is one-time programmable and live at power-up, the command decoder is available within microseconds of switch-on - a requirement for acquiring beacon signals immediately after launch vehicle separation and first Sun-point.
Recommended
Instrument and Sensor Front Ends
Scientific instruments on LEO and interplanetary missions use the RTAX250S-CG624B to time-stamp, decimate, and buffer high-rate sensor streams before compression. The 649 MHz-class fabric performance supports pipelined accumulation and correlation engines, and the 624 available user I/O columns interface dense detector arrays through the wide CCGA-624 ballout. SEU-hardened registers protect accumulation results in proton-rich orbits up to the family's specified LET threshold, and the -55C to +125C operating range covers cryo-instrument warm electronics compartments. Designers prototype the algorithm on commercial Axcelerator silicon using Microchip extender boards per application note AC170 before committing flight antifuse devices.
Recommended
Attitude Determination and Control
Attitude control electronics benefit from the RTAX250S-CG624B's deterministic single-chip implementation of star-tracker preprocessing, gyro co-addition, and PWM drive interfaces. The low static power of 0.15 um CMOS at a 1.5 V core helps meet the tight power budgets of small reaction-wheel controllers, while SEU rates below 10^-10 errors per bit-day keep control-loop state corruption negligible across a 5-year LEO mission without per-register TMR. The CCGA-624 ceramic package withstands launch vibration and thermal cycling from -55C to +125C, and live-at-power-up operation guarantees the safe-hold controller boots before ground contact during contingency recovery scenarios.
Recommended
Rad-Hard Glue Logic Replacement
Many legacy spacecraft boards replace dozens of rad-hard ASICs and SSI/MSI parts with a single RTAX250S-CG624B, cutting board area, mass, and assembly radiation screening cost. With 2,816 CLBs and up to 649 MHz internal performance, address decoders, bus bridges, interrupt controllers, and watchdog logic consolidate into one antifuse device that is live at power-up - eliminating PROM-based configuration that would otherwise fail single-event latch-up screening. The 624-pin CCGA provides ample I/O for legacy backplane interfaces, and because the fabric is derived from the commercial Axcelerator family, design reuse and timing sign-off flows carry over directly from prior programs.
Recommended
Recommended Products Summary
Engineering reference data for RTAX250S-CG624B — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | RTAX250SL-1CG624B | RTAX250S-1CG624B | RTAX250S-1CG624E | RTAX250SL-CG624V | RTAX250SL-CG624E |
|---|---|---|---|---|---|---|
| Package | CCGA-624 | CCGA-624 - same | CCGA-624 - same | CCGA-624 - same | CCGA-624 - same | CCGA-624 - same |
| Brand | Microchip Technology (Actel/Microsemi legacy) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 250,000 | 250,000 | 250,000 | 250,000 | 250,000 | 250,000 |
| Logic Cells (CLBs) | 2,816 | 2,816 | 2,816 | 2,816 | 2,816 | 2,816 |
| Speed Grade | Standard | -1 (approx. 15% faster) | -1 (approx. 15% faster) | -1 (approx. 15% faster) | Standard | Standard |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Operating Temperature | -55C to +125C | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Silicon / Qualification Flow | S silicon, B flow | SL silicon, B flow | S silicon, B flow | S silicon, E flow | SL silicon, V flow | SL silicon, E flow |
Key Differentiators
- Standard speed grade at lower cost (vs RTAX250S-1CG624B)
- Improved radiation performance option (vs RTAX250SL-1CG624B)
- Single-chip live-at-power-up configuration (vs SRAM-based space FPGAs (e.g., Xilinx Virtex families))
Design Notes
RTAX-S antifuse FPGAs are one-time programmable - a programming error consumes a flight device costing thousands of dollars. Prototype the complete design on commercial Axcelerator silicon using Microchip extender circuit boards that map commercial packages to RTAX-S footprints (per Microchip application note AC170), and run full timing sign-off in Libero before programming flight parts. Also confirm whether your mission assurance plan requires the B, E, or V qualification flow, since these are not interchangeable after the fact.
The 1.5 V core supply of the RTAX250S must be decoupled with low-ESR ceramics placed at the CCGA-624 power columns, and the I/O bank supplies must be sequenced per the RTAX-S/SL datasheet power-up requirements to avoid latch-up during hot launch-pad conditions. Estimated: verify core current against your design's utilization in Libero SmartPower rather than assuming datasheet typicals, since antifuse static current scales with used routing resources, not raw gate count.
Ceramic column grid arrays require different land patterns than BGA balls: columns tolerate Z-axis thermal expansion mismatch with the PCB, which is why the CG624 package is preferred for flight boards. Follow the datasheet mechanical drawing for pad geometry and use nominal 0.4-0.5 mm sequence-resistant solder mask defined pads; inspect with X-ray after reflow since columns hide cold joints. Plan test access to the JTAG columns for programming before final board coating.
With 624 I/O columns on a 1.27 mm pitch array, power-integrity planning matters: distribute ground columns to minimize return-path loops and assign each I/O bank a local decoupling network. Simultaneous switching output noise on wide buses should be checked in Libero; stagger output edges or use slew-limited I/O standards on high fanout strobes. Segmentable clock resources allow isolated clock domains - route each domain's clock through its own segment to limit crosstalk-sensitive skew.
Compliance Information
Space-grade ceramic CCGA package; hermetic ceramic packaging is typically exempt from some commercial RoHS constraints but XAIPART has no verified compliance data for this MPN - consult Microchip for flight-lot compliance certificates.
