A54SX16P-TQG144I - 16K Gates SX FPGA 144-TQFP | Microsemi
MPN: A54SX16P-TQG144I ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.65 | $346.50 |
| 100 | $30.8 | $3,080.00 |
| 500 | $27.72 | $13,860.00 |
| 1,000 | $24.64 | $24,640.00 |
Drop-in alternatives for A54SX16P-TQG144I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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A54SX16P-1TQG144I
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$47.9 / Unit
View Datasheet →A54SX16P-2TQG144I
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$26.1 / Unit
View Datasheet →A54SX16P-TQG144
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View Datasheet →A54SX16P-1TQG144
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View Datasheet →A54SX16P-2TQG144
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$48.9 / Unit
View Datasheet →A54SX16A-TQG144I
✅ Drop-In📋 Reference alternative (not in catalog)
A54SX16P-TQG144I Maximum Ratings & Electrical Characteristics
| Manufacturer | Microsemi Corporation (Microchip Technology) |
| Family | SX (SX FPGA Family) |
| Number of Gates | 16000 gates |
| Number of Logic Cells | 924 cells |
| User I/O | 113 |
| Maximum System Frequency | 240 MHz |
| Process Technology | 0.35 um CMOS |
| Supply Voltage (Core) | 3 V to 3.6 V |
| Supply Voltage (I/O) | 4.75 V to 5.25 V |
| I/O Voltage Support | 3.3 V / 5 V |
| Package | 144-TQFP (20x20 mm) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +85C |
| Temperature Grade | Industrial (I suffix) |
| Speed Grade | Standard (P performance variant) |
| Packaging | Tray |
| Programming Technology | One-time programmable (antifuse-family SX architecture) |
A54SX16P-TQG144I 144-tqfp (20x20 mm) Pin Configuration Guide
Complete pinout information for A54SX16P-TQG144I (144-tqfp (20x20 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A54SX16P-TQG144I.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A54SX16P-TQG144I is suitable for 6 applications: Legacy Industrial Control Systems, Telecommunications Line-Card Glue Logic, Aerospace and Defense Subsystems, Embedded Bus Bridging and Interface Conversion, Test and Measurement Instrument Repair, Security and Surveillance Controller Boards.
Legacy Industrial Control Systems
The A54SX16P-TQG144I fits industrial control and factory automation platforms that standardized on SX FPGAs decades ago and require exact form-fit-function replacement. Its -40C to +85C industrial rating and 113 dual-standard 3.3V/5V I/O allow direct interfacing with legacy PLC backplanes and 5V TTL sensors without level shifters. The one-time-programmable configuration cannot be corrupted by brownouts or EMI events common on factory floors, improving field reliability versus SRAM FPGAs. Placed as the main sequencer or bus controller, it sustains the original 240 MHz-class timing with zero PCB changes, protecting the substantial requalification cost of replacing an embedded controller board.
Recommended
Telecommunications Line-Card Glue Logic
Telecom line cards historically used SX FPGAs to bridge proprietary ASIC interfaces to backplane buses. The A54SX16P-TQG144I's 924 logic cells and 113 I/O provide exactly the glue capacity needed for address decoding, bus multiplexing, and interrupt aggregation at line-card speeds well within the 240 MHz family limit. Its 3.3V core and 5V-tolerant I/O ring match legacy -48V-powered card architectures that still run 5V TTL signaling. Because the device is one-time programmable, configuration is instantly available at power-up with no external configuration flash, reducing BOM count and boot latency on hot-swappable cards. Drop-in speed-grade variants preserve the original footprint during spares provisioning.
Recommended
Aerospace and Defense Subsystems
Defense and avionics programs that qualified SX FPGAs during original design-in continue to specify the A54SX16P-TQG144I because its antifuse-style one-time-programmable configuration is inherently resistant to configuration upset and cannot be read back - a design-security requirement in military platforms. The industrial -40C to +85C range covers many avionics bay environments, and the 144-TQFP surface-mount package survives vibration-qualified assembly processes. The device serves as state machines, Mil-STD bus interface logic, and redundancy voting logic. Because redesign of qualified hardware requires costly re-certification, sourcing original SX silicon through excess inventory is preferred over migration to modern FPGA families.
Recommended
Embedded Bus Bridging and Interface Conversion
The A54SX16P-TQG144I is well suited to bridging legacy buses such as VME, ISA-style local buses, or parallel peripheral interfaces to modern controllers. Its dual 3V-3.6V core and 4.75V-5.25V I/O supplies let one device span 5V TTL host sides and 3.3V peripheral sides without external translation. With 113 bidirectional I/O, a single TQFP-144 replaces dozens of 74-series buffers, latches, and PALs, cutting board area and assembly cost. Deterministic one-time-programmed routing gives fixed pin-to-pin propagation delays, simplifying setup/hold analysis on asynchronous bus transactions. Speed-grade variants (A54SX16P-1/2TQG144I) cover designs needing extra timing margin at the same footprint.
Recommended
Test and Measurement Instrument Repair
Bench instruments, ATE fixtures, and custom test racks built in the 1990s and 2000s frequently embed SX FPGAs for timing generation and pattern sequencing. The A54SX16P-TQG144I enables board-level repair of these assets with original silicon, preserving the factory-programmed bitstream and calibration-correlated timing. The 240 MHz-class family performance and 113 I/O reproduce original stimulus/timing accuracy, while one-time programming guarantees the replacement behaves identically on power-up with zero configuration latency - important in sequencer roles where a missed cycle corrupts a test. Sourcing the industrial I-suffix extends reliable operation in non-conditioned lab environments with wide ambient swings.
Recommended
Security and Surveillance Controller Boards
Older security and video surveillance controller designs used SX FPGAs for camera synchronization, parallel video framing, and alarm logic. The A54SX16P-TQG144I's 16K gates and 924 cells accommodate frame counters, sync generators, and alarm state machines, while the 5V-tolerant I/O ring directly drives legacy CCD camera timing buses and relay drive buffers. One-time programming ensures the security logic cannot be reconfigured by an attacker through any configuration interface - a meaningful hardening property versus SRAM FPGAs whose bitstreams can be intercepted at boot. The industrial temperature rating supports outdoor enclosures from -40C to +85C without convection heating, preserving original mechanical designs.
Recommended
Recommended Products Summary
Engineering reference data for A54SX16P-TQG144I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A54SX16P-1TQG144I | A54SX16P-TQG144 | A54SX16A-TQG144I |
|---|---|---|---|---|
| Package | 144-TQFP (20x20 mm) | 144-TQFP (20x20 mm) - same | 144-TQFP (20x20 mm) - same | 144-TQFP (20x20 mm) - same |
| Brand | Microsemi | Microsemi | Microsemi | Microchip Technology |
| Gate Density | 16000 gates | 16000 gates | 16000 gates | 16000 gates (SX-A) |
| User I/O | 113 | 113 | 113 | 113 |
| Speed Grade | Standard | -1 (faster) | Standard | Standard (SX-A, faster process) |
| Operating Temperature | -40C to +85C | -40C to +85C | 0C to +70C (commercial) | -40C to +85C |
| Supply Voltage | 3V~3.6V core, 4.75V~5.25V I/O | 3V~3.6V core, 4.75V~5.25V I/O | 3V~3.6V core, 4.75V~5.25V I/O | [DATA_NEEDED] |
| Process Technology | 0.35 um | 0.35 um | 0.35 um | SX-A finer process |
| Bitstream Compatibility | Reference | Yes (same family, re-run timing) | Yes (identical die) | No - requires re-compile |
Key Differentiators
- Faster speed grade available as pin-identical upgrade (vs A54SX16P-1TQG144I)
- Industrial temperature rating (vs A54SX16P-TQG144)
- Original-family design security and power-up immediacy (vs A54SX16A-TQG144I)
- Dual 3.3V/5V I/O capability in a single device (vs Modern low-voltage FPGAs (e.g., A3PE600-2FGG484))
Design Notes
The A54SX16P-TQG144I requires two independent rails: 3V to 3.6V core and 4.75V to 5.25V I/O. Power both rails from regulated LDOs or buck converters with at least 0.1 uF ceramic decoupling per power/ground pin pair plus bulk capacitance (10 uF to 22 uF) near the package. Observe power-up: bring rails up monotonically; SX devices tolerate either rail first, but slow, non-monotonic ramps on the 3.3V rail can cause excessive inrush through the I/O ESD structures. Verify total core current against the SX family datasheet current tables for your utilization level.
SX devices are one-time programmable: a programming error or a design at greater than roughly 80% routing utilization cannot be reworked on the same physical part. Before programming, complete static timing analysis at -40C and +85C corners in the Microchip/Libero toolchain, and reserve spare modules for ECO fixes. Do not substitute the commercial A54SX16P-TQG144 (0C to +70C) into an industrial -40C to +85C socket even though it is pin-identical - timing derates outside the commercial range are not guaranteed by the datasheet.
With a 5V I/O ring, output edge rates on heavily loaded buses can produce reflections on long traces; keep 5V I/O trace lengths short and consider series termination (22 to 33 ohm) on clock and strobe outputs. Group 5V-tolerant and 3.3V I/O assignments into their respective banks per the SX pinout tables, and return each bank's ground through adjacent GND pins. Avoid sharing the programming pins with switching signals, since fixture access to programming pads is needed during production programming of this OTP device.
Estimated: thermal performance of the 144-TQFP (20x20 mm) depends on airflow and board copper, per the SX-A family datasheet thermal section. As a design estimate, at moderate core utilization the junction rise above ambient is typically tens of degrees C on a 4-layer board with ground pour; confirm against the datasheet theta_JA tables for your airflow condition and keep Tj within the absolute maximum rating at +85C ambient. Avoid fully-populated, thermally-constrained sealed enclosures without airflow verification.
Compliance Information
This is a mature Microsemi SX-family FPGA; RoHS/REACH status for the exact ordering code was not present in the verified web data and must be confirmed with the supplier. AEC-Q100 is not applicable as this is a commercial/industrial FPGA, not an automotive-qualified part.
