ATPL250AG55J19-R - G3-PLC Modem Bundle 80-LQFP | Microchip
MPN: ATPL250AG55J19-R ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $12.5 | $12.50 |
| 10 | $11.4 | $114.00 |
| 100 | $10.2 | $1,020.00 |
| 500 | $9.35 | $4,675.00 |
| 1,000 | $8.6 | $8,600.00 |
ATPL250AG55J19-R Overview
A G3-PLC modem is a specialized communications IC that transmits data over existing AC mains or DC power lines using orthogonal frequency-division multiplexing (OFDM) in the CENELEC and FCC frequency bands. Within the system hierarchy it sits at the physical and data-link layers of a smart-grid or IoT node: power line modem -> communication controller -> application-specific MCU -> embedded system. By bundling the PHY modem with an MCU, Microchip removes the integration effort of pairing a modem with a host processor.
Key features of this bundle include the certified G3-PLC modem stack in the ATPL250A silicon, the 120 MHz Arm Cortex-M4 core of the SAM G55 family in the SAMG55J19A, and factory-matched firmware coupling between the two dies so that the PLC protocol engine and application firmware operate as a validated pair. The Tape & Reel (T/R) delivery format supports automated pick-and-place assembly in volume production.
Technically, the ATPL250A handles analog front-end functions, line coupling, and OFDM modulation/demodulation, while the SAM G55J19A executes the G3-PLC protocol stack and the end-equipment application. The bundle is identified by Microchip CPNs for G3-PLC modules and modems, listed as Bundle PL250A-AKU-R plus SAMG55J19A-MUT, and the published datasheet dates from 2016-09-20.
Typical applications include smart meters (electricity, gas, water), streetlight control networks, solar inverter monitoring, and home-area energy management gateways, all of which benefit from communicating over existing power lines without new wiring.
A key design consideration is that this is a bundle, not a single die: PCB layout must accommodate both the LQFP-80 host footprint and the analog line-driver/coupling network between the ATPL250A and the power line, following Microchip reference designs for coupler impedance and isolation.
This page synthesizes distributor stock listings, cross-reference comparisons (including the Octopart ATPL210A-A1U-Y comparison), bundle composition notes, and procurement guidance not consolidated in the manufacturer datasheet.
Drop-in alternatives for ATPL250AG55J19-R — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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Request AlternativesATPL250AG55J19-R Maximum Ratings & Electrical Characteristics
| Product Type | G3-PLC modem bundle (ATPL250A-AKU-R + SAMG55J19A-MUT) |
| Application | Power Line Communications |
| Category | Embedded - Application Specific Microcontrollers |
| Package | 80-pin LQFP |
| Mounting Type | Surface Mount |
| Packaging | Tape & Reel (T/R) |
| Core Architecture | Arm Cortex-M4 (SAM G55 family) |
| PLC Standard | G3-PLC |
| Bundle Composition | Bundle PL250A-AKU-R plus SAMG55J19A-MUT |
| Datasheet Published | 2016-09-20 |
| Datasheet File Size | 125KB |
| Programmable | Not Verified |
ATPL250AG55J19-R 80-pin lqfp Pin Configuration Guide
Pin configuration for ATPL250AG55J19-R (80-pin lqfp package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for ATPL250AG55J19-R.
Refer to the datasheet for full pin configuration.
Typical Applications
ATPL250AG55J19-R is suitable for 6 applications: Smart Electricity Meters, Streetlight Control Networks, Solar Inverter Monitoring, Home Energy Management Gateways, Industrial Submetering and Load Monitoring, G3-PLC Module and Modem OEM Products.
Smart Electricity Meters
Smart meters are the primary application for the ATPL250AG55J19-R because G3-PLC was designed specifically for metering backhaul over low-voltage distribution lines. The ATPL250A die handles OFDM modulation across CENELEC A-band frequencies, maintaining communication through transformers and noisy line conditions where narrowband FSK fails, while the SAM G55J19A Cortex-M4 executes metering firmware and the G3 protocol stack concurrently at 120 MHz-class performance. The bundle CPN means Microchip has pre-validated the modem-to-host coupling, shortening utility certification cycles. Place the device behind the metering front-end with a coupling network per the PL250A-AKU-R reference design; the trade-off is zero wiring cost since the power line is the communication medium.
Recommended
Streetlight Control Networks
Streetlight controllers use the ATPL250AG55J19-R to receive dimming commands and report energy consumption over the lighting power lines, avoiding the cost of RF mesh gateways or cellular modems per pole. The G3-PLC OFDM physical layer of the ATPL250A tolerates the impedance changes and noise of switched lighting loads, and the SAM G55J19A provides sufficient Cortex-M4 headroom to run both the 6LoWPAN-over-G3 stack and the local lighting control logic. Each luminaire controller connects the modem through a small coupler circuit onto the mains feed; mesh routing across hundreds of poles is handled by the protocol stack rather than extra hardware, keeping per-node BOM to one 80-pin LQFP bundle plus coupling components.
Recommended
Solar Inverter Monitoring
Grid-tied solar inverters use the ATPL250AG55J19-R to export generation data, fault codes and curtailment setpoints over the AC connection that already exists to the utility. This matters because rooftop installations often lack Ethernet or reliable wireless coverage, and the G3-PLC link rides the same conductors carrying the generated power. The ATPL250A maintains the OFDM link across the inverter's electrically noisy switching environment through appropriate line filtering, while the SAM G55J19A Cortex-M4 interfaces to the inverter's main controller via UART or SPI and runs the G3-PLC stack in parallel. Designers must isolate and decouple the PLC coupling network from the inverter EMI filter stage per Microchip's reference designs to keep both the modem link and conducted-emissions compliance intact.
Recommended
Home Energy Management Gateways
Home energy management displays and gateways use the ATPL250AG55J19-R as the metering-side communication endpoint, receiving real-time consumption data from the smart meter over the house wiring and presenting it or forwarding it upstream. The SAM G55J19A Cortex-M4 offers enough performance to run the G3-PLC adaptation layer alongside an application UI or local analytics, so one bundle serves both protocol termination and gateway logic without a second processor. Because the modem communicates over existing in-premises power lines, installation requires only plugging the gateway into any outlet within PLC range of the meter - no drilling, no antennas and no RF site survey. The 80-pin LQFP Tape & Reel format suits the mid-volume assembly typical of consumer energy products.
Recommended
Industrial Submetering and Load Monitoring
Factory and building submeters use the ATPL250AG55J19-R to backhaul branch-circuit energy data across the facility's existing power distribution network, which is often the only reliable communication path in metal-framed industrial buildings where RF propagation is poor. The G3-PLC OFDM scheme of the ATPL250A penetrates across distribution panels and through transformers better than single-carrier PLC, and its adaptive tone mapping handles the impulsive noise of motor loads and variable-frequency drives. The SAM G55J19A runs the G3 stack and computes per-circuit aggregates locally. Each submeter node needs only the 80-pin LQFP bundle, a coupling capacitor network and isolation components per the PL250A-AKU-R reference design, making retrofit deployments fast.
Recommended
G3-PLC Module and Modem OEM Products
Module manufacturers building G3-PLC modem modules for resale use the ATPL250AG55J19-R bundle CPN directly, since Microchip defines it exactly for G3-PLC modules and modems. The pre-matched ATPL250A-AKU-R plus SAMG55J19A pairing lets a module vendor certify the communication stack once and reuse it across customer form factors, from DIN-rail modems to embedded modules. The 80-pin LQFP Tape & Reel packaging flows directly into automated SMT lines for module volume production. Because the Cortex-M4 host is programmable, OEMs differentiate with custom bridging firmware - for example, translating the PLC link to RS-485 or Ethernet at the module edge - while retaining the certified PHY and MAC layers from the factory bundle configuration.
Recommended
Recommended Products Summary
Engineering reference data for ATPL250AG55J19-R — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | ATPL210A-A1U-Y |
|---|---|---|
| Package | 80-pin LQFP, Tape & Reel | LQFP (different pin count), Tray |
| Brand | Microchip Technology (Atmel) | Microchip Technology (Atmel) |
| Product Type | G3-PLC modem + SAM G55 Cortex-M4 MCU bundle | ATPL210A PLC modem (previous generation) |
| Application | Power Line Communications | Power Line Communications |
| Lifecycle Status | Active | Obsolete |
| Packaging | Tape & Reel (TR) | Tray |
| Integrated Host MCU | Yes (SAMG55J19A in bundle) | No - external host required |
| Category | Embedded - Application Specific Microcontrollers | Embedded - Application Specific Microcontrollers |
Key Differentiators
- Factory-certified two-die G3-PLC pairing (vs ATPL210A-A1U-Y)
- Active lifecycle status (vs ATPL210A-A1U-Y)
- Tape & Reel production format (vs ATPL210A-A1U-Y)
Design Notes
Because the ATPL250AG55J19-R is a two-die bundle CPN (ATPL250A-AKU-R plus SAMG55J19A-MUT), start the PCB from Microchip's PL250A-AKU-R reference design rather than a custom layout. The PLC analog front-end pins of the 80-pin LQFP require a short, symmetrical route to the coupling network, with the driver stage placed away from the SAM G55 clock lines. Follow the LQFP-80 land pattern exactly and mark pin 1 orientation, since no third-party drop-in footprint alternatives exist to fall back on.
G3-PLC performance depends heavily on the line coupler: coupling capacitor values, transformer impedance and the clamp/protection network must match the reference design for the CENELEC band being used. Estimated: even small deviations in coupler impedance can reduce link margin several dB in OFDM systems, so prototype on the reference board before finalizing your own coupler. Keep the transmit path loop area minimal and add the specified TVS protection, since mains transients directly hit the modem front-end.
Do not treat the bundle as a standard SAM G55 microcontroller order code: flash size, temperature range and programming method should be confirmed from the ATPL250A and SAM G55 datasheets, as public distributor listings mark Programmable as Not Verified. Second, never substitute the obsolete ATPL210A-A1U-Y on the same board - it is a different footprint and generation. Third, confirm RoHS/REACH certificates for the bundle CPN separately from the constituent die part numbers before release.
Compliance Information
Verified distributor listings do not state RoHS/REACH/lead-free status for the ATPL250AG55J19-R bundle CPN. Obtain Material Declaration data from Microchip product page or distributor before compliance-critical designs.
