ATSAM4S2CB-CNR - 120MHz Cortex-M4 MCU 128KB Flash | Microchip
MPN: ATSAM4S2CB-CNR ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4.41 | $4.41 |
| 10 | $4.19 | $41.90 |
| 100 | $3.97 | $397.00 |
| 500 | $3.75 | $1,875.00 |
| 1,000 | $3.53 | $3,530.00 |
ATSAM4S2CB-CNR Overview
A microcontroller (MCU) is a complete computing system on a single chip, combining a processor core, non-volatile program memory, RAM, and input/output peripherals. Within the embedded systems hierarchy, the SAM4S series sits in the high-performance 32-bit ARM-based MCU class, positioned above 8-bit and entry 32-bit devices and below multi-core application processors.
Key features of the ATSAM4S2CB-CNR include the 120 MHz Cortex-M4 core with DSP instructions and single-cycle MAC, 128 KB Flash for program storage, 64 KB SRAM for data buffering, and extended industrial temperature operation to 105 degrees C as indicated by the CNR ordering suffix. The device is manufactured in a green, RoHS-aware process and supplied in tape and reel (MRL B) format for automated assembly.
The SAM4S architecture provides a multi-layer bus matrix, DMA-capable peripherals, and a flexible clock controller, allowing deterministic real-time behavior in control loops and communication bridges. The Cortex-M4 core enables efficient execution of control algorithms and signal-processing tasks such as filtering and FFTs that would burden smaller cores.
Typical applications include industrial automation nodes, motor control and power conversion interfaces, data loggers, IoT sensor gateways, and embedded communication modules where 120 MHz processing headroom and 105 C extended temperature tolerance are required.
A key design consideration is BGA package assembly: the 9x9 mm 100-ball TFBGA footprint requires fine-pitch PCB fabrication and reflow inspection capability, so confirm your manufacturing process supports 0.8 mm-class BGA pitches before committing to this package variant.
This page synthesizes distributor pricing, drop-in family alternatives, design notes, and application guidance not consolidated in the manufacturer datasheet alone.
Drop-in alternatives for ATSAM4S2CB-CNR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with ATSAM4S2CB-CNR (same form factor and footprint) — differing in Core Size, Flash Memory, Operating Temperature, Packaging, SRAM.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
ATSAM4S4CB-CNR
✅ Drop-In✓ In Stock
$4.18 / Unit
View Datasheet →ATSAM4S2CB-CN
✅ Drop-In📋 Reference alternative (not in catalog)
ATSAM4S4CA-CU
✅ Drop-In✓ In Stock
$3.9 / Unit
View Datasheet →ATSAM4S2CB-CNR Maximum Ratings & Electrical Characteristics
| Core Processor | ARM Cortex-M4 |
| Core Size | 32-Bit Single-Core |
| Maximum Clock Frequency | 120 MHz |
| Flash Memory | 128 KB (128K x 8) |
| SRAM | 64 KB |
| Operating Temperature | -40C to +105C (extended temp, CNR suffix) |
| Package | 100-TFBGA (9x9 mm) |
| Mounting Type | Surface Mount |
| Packaging | Tape & Reel (MRL B) |
| Green / RoHS Status | GREEN, RoHS compliant per LCSC listing |
| Series | SAM4S |
| FPU / DSP Instructions | Cortex-M4 hardware FPU and DSP extension |
ATSAM4S2CB-CNR 100-tfbga (9x9 mm) Pin Configuration Guide
Pin configuration for ATSAM4S2CB-CNR (100-tfbga (9x9 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for ATSAM4S2CB-CNR.
Refer to the datasheet for full pin configuration.
Typical Applications
ATSAM4S2CB-CNR is suitable for 6 applications: Industrial Automation Nodes, Motor Control and Power Conversion, IoT Sensor Gateways, Data Loggers and Measurement Instruments, Embedded Communication Bridges, Human-Machine Interface Controllers.
Industrial Automation Nodes
The ATSAM4S2CB-CNR fits industrial automation nodes where deterministic control, multiple communication interfaces, and extended temperature tolerance are mandatory. Its 120 MHz Cortex-M4 core executes PLC-style scan loops and protocol stacks simultaneously, while the -40C to +105C CNR temperature rating survives control-cabinet heat. The 128 KB Flash and 64 KB SRAM accommodate Modbus, CAN, and industrial Ethernet-adjacent firmware with DMA-offloaded peripherals keeping interrupt latency low. Deployed between sensor conditioning front-ends and actuator drivers, the MCU provides both the real-time layer and the supervisory logic, replacing discrete logic and reducing BOM cost in distributed I/O modules.
Recommended
Motor Control and Power Conversion
The ATSAM4S2CB-CNR is well matched to motor control and power-conversion interfaces. The Cortex-M4 core's single-cycle MAC and hardware FPU execute field-oriented control (FOC) arithmetic at 120 MHz, enabling PWM update rates of tens of kilohertz with margin to spare. The 64 KB SRAM holds current-sampling buffers and observer state, and DMA channels stream ADC results without CPU intervention, preserving deterministic loop timing. The extended 105C temperature rating tolerates drive-enclosure ambients. Placed between gate-driver front ends and current-sense amplifiers, the MCU implements the full control loop while offloading protection functions to hardware comparators and peripherals.
Recommended
IoT Sensor Gateways
For IoT sensor gateways, the ATSAM4S2CB-CNR provides the processing headroom to aggregate multiple sensor streams and run communication stacks concurrently. The 120 MHz Cortex-M4 with DSP instructions handles filtering, FFT-based feature extraction, and encryption-friendly computation locally, while 128 KB Flash stores stack and application code and 64 KB SRAM buffers bursty sensor data. DMA-capable serial peripherals (USART, SPI, I2C) connect radio modules and sensors with minimal CPU overhead. The extended temperature rating supports outdoor and rooftop deployments. Positioned between analog sensor front-ends and wireless modules, the MCU performs edge processing that reduces upstream bandwidth and cloud computing cost.
Recommended
Data Loggers and Measurement Instruments
The ATSAM4S2CB-CNR suits data-logging and bench-instrument designs requiring sustained sampling with timestamped storage. Its 120 MHz core manages high-rate ADC polling through DMA while simultaneously writing formatted records to SD-card or serial-Flash media over SPI, and the 64 KB SRAM provides multi-second ring buffers that survive media-latency spikes. The extended -40C to +105C range qualifies the logger for vehicle bays, cold-chain monitoring, and industrial field boxes. Integrated timers generate precise sample clocks, and the Cortex-M4 DSP extension supports on-device signal conditioning such as decimation and windowing before storage, reducing post-processing workload in the host analysis system.
Recommended
Embedded Communication Bridges
As a protocol bridge, the ATSAM4S2CB-CNR converts between industrial interfaces such as RS-485/Modbus, CAN, SPI, and I2C with deterministic latency. Multiple DMA-driven USARTs and the 120 MHz core sustain full-rate traffic on simultaneous channels, while 128 KB Flash holds multiple protocol stacks plus a bootloader field-update path. Hardware flow control and precise baud-rate generation from the flexible clock controller ensure signal-timing compliance across links. The extended 105C temperature rating allows mounting inside junction boxes and drive cabinets near the physical layer rather than in climate-controlled racks, cutting wiring runs and improving signal integrity in factory retrofits and building-automation gateways.
Recommended
Human-Machine Interface Controllers
The ATSAM4S2CB-CNR drives embedded HMI panels by managing touchscreen controllers, segment or matrix displays, and keypads with responsive event handling. The 120 MHz Cortex-M4 core renders simple graphics buffers and debounce logic comfortably within frame deadlines, while 64 KB SRAM holds framebuffer slices and UI state for multi-language menus. DMA and peripheral interrupts keep touch sampling jitter low even during communications activity. The extended temperature rating suits appliances, industrial panels, and outdoor kiosks. Sitting between capacitive touch controllers and backlight/relay drivers, the MCU provides a single-chip HMI solution that reduces external glue logic and shortens development cycles with Microchip's SAM4S software ecosystem.
Recommended
Recommended Products Summary
Engineering reference data for ATSAM4S2CB-CNR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | ATSAM4S4CB-CNR | ATSAM4S2CB-CN | ATSAM4S4CA-CU |
|---|---|---|---|---|
| Package | 100-TFBGA (9x9 mm) | 100-TFBGA (9x9 mm) - same | 100-TFBGA (9x9 mm) - same | 100-TFBGA - same family |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Clock | ARM Cortex-M4, 120 MHz | ARM Cortex-M4, 120 MHz | ARM Cortex-M4, 120 MHz | ARM Cortex-M4, 120 MHz |
| Flash Memory | 128 KB | 256 KB | 128 KB | 256 KB |
| SRAM | 64 KB | 64 KB | 64 KB | 64 KB |
Key Differentiators
- Lower cost per unit than higher-memory sibling (vs ATSAM4S4CB-CNR)
- Extended 105C temperature grade in standard volume packaging (vs ATSAM4S2CB-CN)
- Pin-compatible upgrade path within SAM4S family (vs ATSAM4S4CB-CNR)
Design Notes
The 100-ball TFBGA (9x9 mm) requires fine-pitch BGA PCB fabrication: plan for via-in-pad or dogbone fanout, solder-mask-defined pads, and X-ray inspection at reflow. Follow the SAM4S datasheet land-pattern recommendation and keep decoupling capacitors on the BGA underside layer adjacent to each power/ground ball pair. Verify your assembly house is qualified for 0.8 mm-class BGA before release; rework of a 100-ball BGA is significantly costlier than QFP rework.
Estimate: with typical MCU active current in the tens of mA range at 120 MHz (exact figure in the SAM4S datasheet power section), a 3.3 V rail shared with radio or actuator loads should be budgeted with margin and sequenced per the datasheet power-up requirements. Use separate local LDO or ferrite-isolated rails for the analog supply domains, and place bulk and 100 nF decoupling capacitors at every VDD ball as prescribed in the SAM4S hardware design guidelines.
Do not confuse ordering-suffix grades: CNR denotes extended temperature (105C) in tape-and-reel; substituting a standard 85C commercial grade in a 105C enclosure will cause field failures. Also note the CNR suffix differs from CU-suffix parts in packing and grade - always verify the full ordering code on purchase orders. When migrating firmware between ATSAM4S2 (128 KB) and ATSAM4S4 (256 KB) devices, regenerate the linker script; the Flash boundary differs even though pinout is identical.
At 120 MHz, keep high-speed clock traces (main crystal, PLL output derived buses) short and reference a solid ground plane; route fast peripheral buses (SDRAM-less designs mostly use SPI/parallel interfaces) with controlled stubs. For the main oscillator, follow the SAM4S datasheet load-capacitance and layout guidance to avoid startup failure across the full -40C to +105C range. Place a ground guard around the crystal and avoid routing noisy switching signals beneath it.
Compliance Information
RoHS compliant per LCSC listing (marked ROHS); 'GREEN' designation per Mouser listing indicates Microchip green packaging process. REACH, halogen-free, and conflict-minerals status not stated in provided data.
