ATSAM4SD16CB-CFNR - SAM4S Cortex-M4 120MHz 1MB MCU | Microchip
MPN： ATSAM4SD16CB-CFNR ✓ 啟用中ATSAM4SD16CB-CFNR 概覽
A microcontroller (MCU) is a single-chip processor that integrates a CPU core, memory (Flash and SRAM), and a rich set of peripherals including timers, communication interfaces (USART, SPI, TWI), and analog blocks (ADC). In the wider system hierarchy, an MCU sits inside the embedded-computing IC category, below microprocessors (MPU) and above discrete logic. The Cortex-M4 core specifically targets deterministic real-time control with DSP extensions, allowing both control loops and signal-processing tasks to run on a single chip.
Key features of the ATSAM4SD16CB-CFNR include up to 120 MHz core clock, 1 MB embedded Flash (configured as 2 x 512 KB dual-bank for live updates), 160 KB SRAM, an external bus interface, a 16-bit External Interrupt Controller, and the standard SAM4S peripheral set (HS USB, CAN, EMAC, multiple USART/SPI/TWI). An integrated voltage regulator and brown-out detector simplify power-tree design at 1.2 V core / 3.3 V I/O operation.
Architecturally, the SAM4SD16 uses the Cortex-M4 with Thumb-2 instruction set, NVIC for deterministic interrupts, and a multi-layer bus matrix connecting Flash, SRAM, and peripheral bridges. This high-bandwidth interconnect is what allows the 120 MHz core to feed the Ethernet MAC, HS USB, and other high-throughput peripherals without contention. The dual-bank Flash further supports in-application programming and safe firmware updates, which is critical for products that cannot tolerate downtime during reflash.
Typical applications include industrial control and HMI panels, smart energy metering, building automation gateways, point-of-sale terminals, consumer audio peripherals, and connectivity-rich IoT edge nodes. The combination of HS USB, CAN, and EMAC makes it especially attractive for industrial gateway designs that bridge field-bus networks to Ethernet backhaul.
When designing with this part, pay attention to the VFBGA-100 PCB land pattern, keep the analog supply cleanly decoupled, and use the on-chip brown-out and watchdog features to meet IEC functional-safety expectations in industrial deployments. New designs should target silicon Revision B as recommended by the manufacturer. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
直接替換替代品，適用於 ATSAM4SD16CB-CFNR — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： ATSAM4SD16CB-CFNR （相同外形與佔位） — 差異在於 Package, ADC, Operating Temperature, Program Memory (Flash), RoHS Status.
ATSAM4SD16CB-CFN
✅ 直接替換聯絡詢價
查看資料表 →ATSAM4S16CB-CFN
✅ 直接替換聯絡詢價
查看資料表 →ATSAM4S8CB-CFNR
✅ 直接替換聯絡詢價
查看資料表 →ATSAM4S4CB-AN
✅ 直接替換聯絡詢價
查看資料表 →ATSAM4SA16CB-AN
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →ATSAM4SD16CB-CFNR 最大額定值與電氣特性
| Core | ARM Cortex-M4F (32-bit, single-precision FPU) |
| Core Frequency | 120 MHz |
| Program Memory (Flash) | 1 MB (2 x 512 KB dual-bank) |
| SRAM | 160 KB |
| Supply Voltage (VDDCORE) | 1.2 V (typ) |
| I/O Supply Voltage (VDDIO) | 1.62 V to 3.6 V |
| 封裝 | 100-VFBGA (7x7 mm) |
| 安裝類型 | Surface Mount (BGA) |
| 工作溫度 | -40 C to +85 C (extended) |
| Peripherals | HS USB, CAN, EMAC, USART, SPI, TWI, EBI |
| ADC | 1 x 16-channel 12-bit ADC |
| Timers | Multiple TC, PWM, RTC |
| External Interrupt Controller | Yes (16-line) |
| MSL 等級 | 3 (per JEDEC J-STD-020) |
| RoHS 狀態 | Compliant |
| Silicon Revision | Revision B (recommended for new designs) |
ATSAM4SD16CB-CFNR 100-vfbga (7x7 mm) 腳位配置指南
ATSAM4SD16CB-CFNR（100-vfbga (7x7 mm) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： ATSAM4SD16CB-CFNR.
請參閱 資料表 以查看完整腳位配置。
典型應用
ATSAM4SD16CB-CFNR 適用於 6 應用s: Industrial HMI Control Panel, Smart Energy Metering, Building Automation Gateway, Point-of-Sale Terminal, Consumer Audio Peripheral, IoT Edge Sensor Node.
Industrial HMI Control Panel
The ATSAM4SD16CB-CFNR fits industrial HMI control panels because its 120 MHz Cortex-M4F core can drive a TFT LCD via the External Bus Interface while running a real-time control loop on the integrated timers. The 1 MB dual-bank Flash allows safe in-application firmware updates without halting the HMI, and 160 KB SRAM holds frame buffers and widget state. With the HS USB, CAN, and EMAC peripherals integrated, the same MCU can also handle touchscreen input, field-bus comms, and Ethernet backhaul in a single chip, reducing the BOM versus a discrete MPU plus per-host co-processor design.
推薦
Smart Energy Metering
The ATSAM4SD16CB-CFNR suits smart energy metering because the 12-bit ADC with up to 16 channels can sample current and voltage transducers simultaneously while the Cortex-M4F runs DSP-class RMS and harmonic calculations. The 160 KB SRAM is enough to buffer one full AC line cycle at high sample rates, and the 1 MB dual-bank Flash stores metrology libraries plus communication stacks for DLMS/COSEM or wireless M-Bus. The -40 C to +85 C industrial temperature range satisfies outdoor cabinet deployments common in AMI rollouts.
推薦
Building Automation Gateway
The ATSAM4SD16CB-CFNR works well as a building automation gateway because it bridges field buses (CAN, RS-485 over USART) to Ethernet via the integrated EMAC, all on one chip. The 120 MHz Cortex-M4F can run BACnet, Modbus, or KNX stacks concurrently, and the dual-bank 1 MB Flash supports OTA firmware updates so installers do not need to physically recall gateways for bug fixes. The small 100-VFBGA 7x7 mm package fits DIN-rail enclosures with strict width budgets.
推薦
Point-of-Sale Terminal
The ATSAM4SD16CB-CFNR powers point-of-sale terminals because the HS USB port connects to peripherals (barcode scanners, NFC readers, printers), the EMAC links to the store LAN, and the 12-bit ADC reads battery and thermal-printer head currents. The Cortex-M4F DSP extensions accelerate crypto for PCI-PTS tokenization, and the dual-bank Flash enables secure boot with rollback to a known-good image if an update fails - critical for payment terminals.
推薦
Consumer Audio Peripheral
The ATSAM4SD16CB-CFNR drives consumer audio peripherals because the Cortex-M4F single-precision FPU executes audio DSP (EQ, mixing, SRC) in real time, while the HS USB port streams 24-bit 96 kHz audio from a host. The 160 KB SRAM holds several seconds of audio buffer at typical sample rates, and the rich set of I2S-capable peripherals (configurable as SPI) connects directly to DACs and ADCs without an external bridge IC.
推薦
IoT Edge Sensor Node
The ATSAM4SD16CB-CFNR suits IoT edge sensor nodes because its low-power SAM4S sleep modes combined with the Cortex-M4F DSP extensions let the device wake, process sensor data, and transmit before returning to sleep. The HS USB simplifies factory provisioning, the integrated EMAC gives wired backhaul when needed, and the 1 MB Flash stores TLS stacks plus an OTA updater. The 100-VFBGA 7x7 mm footprint enables very compact sensor-pod form factors.
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推薦產品摘要
工程參考資料，適用於 ATSAM4SD16CB-CFNR — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | ATSAM4SD16CB-CFN | ATSAM4S16CB-CFN | ATSAM4S8CB-CFNR | ATSAM4S4CB-AN | ATSAM4SA16CB-AN |
|---|---|---|---|---|---|---|
| Package | 100-VFBGA (7x7) | 100-VFBGA (7x7) - same | 100-VFBGA (7x7) - same | 100-VFBGA (7x7) - same | 100-VFBGA (7x7) - same | 100-VFBGA (7x7) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Frequency | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz |
| Flash | 1 MB (dual-bank) | 1 MB (dual-bank) | 1 MB (single-bank) | 512 KB | 256 KB | 1 MB |
| SRAM | 160 KB | 160 KB | 160 KB | 128 KB | 64 KB | 160 KB |
| Ethernet MAC | Yes (EMAC) | Yes | Yes | Yes | Yes | No |
| Temperature Range | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
| Operating Voltage (Core) | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
主要差異化特點
- Dual-bank 1 MB Flash for safe OTA updates (對比ATSAM4S16CB-CFN)
- Full SAM4S peripheral set with Ethernet MAC (對比ATSAM4SA16CB-AN)
- Tape-and-reel packaging for high-volume SMT (對比ATSAM4SD16CB-CFN)
設計說明
Estimated: the 100-VFBGA 7x7 mm package uses a 0.65 mm ball pitch. Per Microchip layout guidelines, place a 4-layer stack-up with a continuous ground plane under the BGA, fan-out via microvias-in-pad, and provide at least 1 oz copper for power planes. Bypass VDDCORE with 100 nF X7R per pin and bulk 4.7 uF tantalum, and keep VDDIO decoupling within 2 mm of each supply ball to meet the 120 MHz core's switching-noise envelope.
Do not assume all 100-VFBGA SAM4S parts have dual-bank Flash; the ATSAM4S16 is single-bank and cannot safely perform OTA rollbacks the way the ATSAM4SD16 (dual-bank) can. Also note that the SAM4SA family drops the EMAC peripheral, so the ATSAM4SA16CB-AN is not a substitute if you need Ethernet. Confirm peripheral presence in the device selection table of the SAM4S datasheet before committing to a layout.
Estimated: at 120 MHz with all peripherals active, the ATSAM4SD16CB-CFNR dissipates under 300 mW typical. The 100-VFBGA with a 4-layer JEDEC test board dissipates this comfortably at 85 C ambient without external cooling. For continuous 100% CPU load at elevated ambient, verify junction rise using theta_JA from the SAM4S package thermal characteristics section rather than relying on bare-package ratings.
Route the HS USB differential pair (D+/D-) with 90 ohm differential impedance and length matching within 150 mil. Keep the crystal traces short and symmetric, place the 12 pF load capacitors within 2 mm of the XIN/XOUT balls, and guard the analog VDDANA pin with a ferrite bead plus dedicated LDO. Following these layout rules avoids the most common SAM4S EMC and USB-compliance failures seen during certification.
合規資訊
RoHS compliant per Microchip product page. AEC-Q100 not applicable (industrial/consumer MCU). MSL Level 3 per JEDEC J-STD-020 for VFBGA packages.
