ATSAMA5D26C-CUR - 500MHz Cortex-A5 MPU 289-LFBGA | Microchip
MPN: ATSAMA5D26C-CUR ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $10.96 | $10.96 |
| 10 | $9.87 | $98.70 |
| 100 | $8.78 | $878.00 |
| 500 | $7.69 | $3,845.00 |
| 1,000 | $6.85 | $6,850.00 |
ATSAMA5D26C-CUR Overview
An MPU (Microprocessor Unit) is a class of integrated circuit that integrates a CPU core with memory management and on-chip peripherals, executing a full operating system such as Linux or RTOS. MPUs sit above microcontrollers (MCUs) in the embedded hierarchy: MCU -> MPU -> application processor -> SoC. The Cortex-A5 core delivers an application-class instruction set with MMU support while maintaining power consumption suitable for battery-powered or thermally constrained designs. The 500 MHz operation provides ample headroom for graphical user interfaces, network protocol stacks, and edge analytics.
Key features include the Arm Cortex-A5 core with NEON media engine and floating-point unit, dual 10/100 Ethernet MACs with IEEE 1588 support, two High-Speed USB 2.0 ports with integrated PHY, two CAN-FD controllers, and an LCD TFT controller for displays up to WXGA resolution. The peripheral multiplexing allows flexible pin assignment, with dedicated I/O supply rails supporting 1.8V or 3.3V signaling. Security hardening covers secure boot from signed firmware, hardware cryptographic accelerators, and tamper detection pins for anti-tamper designs.
Typical applications include industrial HMI panels, building automation gateways, smart energy metering terminals, medical patient monitors, and edge IoT gateways. The combination of deterministic Cortex-A5 performance, low standby power, and Linux support enables rapid deployment of connected products requiring graphical interfaces or networked protocol stacks. The 289-LFBGA package requires careful PCB layout but allows integration of all interfaces in a compact footprint suitable for industrial temperature grade operation from -40C to +85C.
When designing with this device, allocate sufficient PCB layers (typically 6 or more) to route the LFBGA ball escape and maintain signal integrity for DDR3L memory. Use the Microchip-provided Linux4SAM distribution and the SAMA5D2 Xplained evaluation board reference design to accelerate firmware bring-up and validate peripherals before committing to layout.
Drop-in alternatives for ATSAMA5D26C-CUR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with ATSAMA5D26C-CUR (same form factor and footprint) — differing in Package, Ethernet, Operating Temperature, Core Architecture, USB.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
ATSAMA5D26C-CU
✅ Drop-In✓ In Stock
$11.8 / Unit
View Datasheet →ATSAMA5D26C-CNR
✅ Drop-In✓ In Stock
$10.85 / Unit
View Datasheet →ATSAMA5D26A-CUR
✅ Drop-In✓ In Stock
$14.2 / Unit
View Datasheet →ATSAMA5D24C-CUR
✅ Drop-In✓ In Stock
$10.2 / Unit
View Datasheet →ATSAMA5D27C-CU
✅ Drop-In✓ In Stock
$11.9 / Unit
View Datasheet →ATSAMA5D28C-LD2G-CUR
✅ Drop-In✓ In Stock
$15.4 / Unit
View Datasheet →ATSAMA5D26C-CUR Maximum Ratings & Electrical Characteristics
| Core Processor | ARM Cortex-A5 |
| Core Count | 1 |
| Data Bus Width | 32-Bit |
| Maximum Clock Frequency | 500 MHz |
| Internal SRAM | 128 KB |
| External Memory Support | DDR2, DDR3L, LPDDR2, LPDDR3, QSPI, e.MMC |
| Package | 289-LFBGA (14x14 mm) |
| Operating Temperature | -40C to +85C (Industrial) |
| Supply Voltage | 1.2V core, 1.8V/3.3V I/O |
| Ethernet | Dual 10/100 MAC with IEEE 1588 |
| USB | 2x USB 2.0 High-Speed with integrated PHY |
| CAN | 2x CAN-FD controllers |
| Display Controller | LCD TFT up to WXGA resolution |
| Security | Secure boot, AES, SHA, TRNG, tamper pins |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Packaging Type | Tape & Reel |
ATSAMA5D26C-CUR 289-lfbga (14x14 mm) Pin Configuration Guide
Pin configuration for ATSAMA5D26C-CUR (289-lfbga (14x14 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for ATSAMA5D26C-CUR.
Refer to the datasheet for full pin configuration.
Typical Applications
ATSAMA5D26C-CUR is suitable for 6 applications: Industrial HMI Control Panels, Building Automation Gateways, Smart Energy Metering Terminals, Medical Patient Monitoring, Edge IoT Gateways, Digital Signage and Kiosks.
Industrial HMI Control Panels
The ATSAMA5D26C-CUR's 500 MHz Cortex-A5 core combined with the integrated LCD TFT controller supporting up to WXGA resolution makes it ideal for industrial HMI panels. The integrated LCD controller drives TFT displays directly without external graphics chips, reducing BOM cost. Dual 10/100 Ethernet enables redundant network connectivity for SCADA integration, while CAN-FD supports real-time communication with PLCs and motor drives. Linux4SAM provides Qt/GTK graphical stacks ready for HMI deployment in factory automation.
Recommended
Building Automation Gateways
The ATSAMA5D26C-CUR's dual Ethernet MACs with IEEE 1588 timestamping enable precise protocol synchronization for BACnet/IP, KNX, and Modbus TCP gateway applications. The 500 MHz processing power handles encrypted TLS communications with cloud services while managing local BACnet data points. CAN-FD interfaces support HVAC equipment and elevator controllers, while USB 2.0 ports enable Wi-Fi or Bluetooth module attachment. Secure boot prevents firmware tampering in security-sensitive deployments.
Recommended
Smart Energy Metering Terminals
The ATSAMA5D26C-CUR supports smart energy metering terminals requiring real-time power calculation, secure data logging, and communication with utility backhaul networks. The Cortex-A5 core runs metering firmware stacks while the hardware AES/SHA accelerators secure DLMS/COSEM or IEC 61850 communications. Wide operating temperature (-40C to +85C) suits outdoor cabinet deployment, and the LFBGA package withstands industrial vibration. Multiple UART interfaces connect to metrology front-end ASICs.
Recommended
Medical Patient Monitoring
Medical patient monitors benefit from the ATSAMA5D26C-CUR's deterministic Linux execution and rich peripheral set for multi-parameter acquisition. The dual Ethernet supports isolated network connectivity to hospital EMR systems, while USB enables bedside accessory attachment. The hardware TRNG and secure boot support FDA cybersecurity guidance compliance. The industrial temperature grade supports continuous operation in clinical environments, and Linux enables IEC 62304-compliant software development processes.
Recommended
Edge IoT Gateways
The ATSAMA5D26C-CUR serves as a capable edge IoT gateway, aggregating sensor data from field devices and forwarding processed analytics to cloud platforms. The 500 MHz Cortex-A5 with NEON enables on-device machine learning inference, while dual Ethernet supports daisy-chained industrial network topologies. CAN-FD and UART interfaces connect to legacy industrial equipment, and USB 2.0 attaches cellular or Wi-Fi modems. Linux supports Docker containers and MQTT/OPC-UA protocol stacks for Industry 4.0.
Recommended
Digital Signage and Kiosks
The ATSAMA5D26C-CUR's integrated LCD TFT controller and 500 MHz performance drive digital signage displays and interactive kiosks. The hardware video decoder handles compressed media streams, while USB ports support touchscreens, cameras, and payment peripherals. Linux supports HTML5-based kiosk applications and remote management frameworks. Industrial temperature grade enables outdoor enclosure deployment, and secure boot prevents unauthorized content modification in public-facing installations.
Recommended
Recommended Products Summary
Engineering reference data for ATSAMA5D26C-CUR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | ATSAMA5D26C-CU | ATSAMA5D26C-CNR | ATSAMA5D24C-CUR | ATSAMA5D27C-CU |
|---|---|---|---|---|---|
| Package | 289-LFBGA (14x14) | 289-LFBGA (14x14) | 289-LFBGA (14x14) | 289-LFBGA (14x14) | 289-LFBGA (14x14) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | ARM Cortex-A5 | ARM Cortex-A5 | ARM Cortex-A5 | ARM Cortex-A5 | ARM Cortex-A5 |
| Max Frequency | 500 MHz | 500 MHz | 500 MHz | 500 MHz | 500 MHz |
| Ethernet MACs | 2x 10/100 | 2x 10/100 | 2x 10/100 | 1x 10/100 | 2x 10/100 |
| CAN-FD | 2x | 2x | 2x | 1x | 2x |
| Secure Boot | Yes | Yes | No | Yes | Yes |
| Internal SRAM | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB |
| Unit Price (qty 1) | $10.96 | ~$10.96 | ~$9.50 | ~$8.50 | ~$12.50 |
Key Differentiators
- Dual Ethernet with IEEE 1588 hardware timestamping (vs ATSAMA5D24C-CUR)
- Full security feature set with secure boot (vs ATSAMA5D26C-CNR)
- Dual CAN-FD controllers (vs ATSAMA5D24C-CUR)
Design Notes
The 289-LFBGA package at 0.8 mm ball pitch requires a minimum 6-layer PCB for reliable breakout routing. Use Microchip's reference design stackup with continuous GND planes beneath the BGA and dedicated power planes for VDDIO and VDDCORE. The DDR memory interface signals must maintain matched trace lengths within 50 mil tolerance per byte lane, and the DDR clock should be routed on an inner stripline layer with controlled 50-ohm impedance to meet DDR3L signal integrity requirements.
The ATSAMA5D26C-CUR requires multiple supply rails: VDDCORE at 1.2V, VDDIO at 1.8V or 3.3V, and USB PHY supply at 3.3V. Use a dedicated LDO for VDDCORE with at least 500 mA capacity to handle 500 MHz load transients. According to the Microchip hardware design guide, place 100 nF decoupling capacitors within 2 mm of each BGA power pin and bulk 10 uF ceramic capacitors near the package perimeter. Power sequencing requires VDDIO to ramp before VDDCORE.
At 500 MHz full operation, the ATSAMA5D26C-CUR dissipates approximately 1.5W typical power. The 289-LFBGA package has a junction-to-ambient thermal resistance of approximately 25 C/W on a standard 6-layer JEDEC test board. For enclosed designs, ensure adequate airflow or attach a small heatsink if ambient temperatures exceed 60C. The industrial temperature grade limits junction temperature to 100C maximum - derate clock frequency if operating in sealed enclosures.
Do not connect unused BGA balls to GND unless the datasheet explicitly recommends it - floating balls can cause signal coupling issues. Ensure the boot configuration pins (BMS, JTAG_SEL) have valid pull-up or pull-down resistors at reset to select the correct boot source. The DDR memory interface requires calibration routines in the bootloader; use the AT91Bootstrap with the proper DDR configuration table for your chosen memory chip.
Compliance Information
RoHS compliant per Microchip product page. Not AEC-Q100 qualified - industrial temperature grade only. Lead-free packaging confirmed.