Microchip Technology

ATSAMA5D28C-LD2G-CUR - SAMA5D2 SIP MPU 500MHz 2Gb LPDDR2

MPN: ATSAMA5D28C-LD2G-CUR ✓ Active
In Stock Ships in 1-3 business days
1.1 V to 1.32 V Vdss 289-LFBGA 14x14 mm Package 500 MHz Speed 2 Gbit LPDDR2 SDRAM Memory
From $15.4 USD / Unit
MOQ: 1 |
Price updated: 2026-09-20
Volume Pricing
Qty Unit Price Extended
1 $22.5 $22.50
10 $21.05 $210.50
100 $18.8 $1,880.00
500 $16.95 $8,475.00
1,000 $15.4 $15,400.00
ℹ️ All prices are in USD

ATSAMA5D28C-LD2G-CUR Overview

The Microchip Technology ATSAMA5D28C-LD2G-CUR is a high-performance, low-power Arm Cortex-A5 microprocessor (MPU) running up to 500 MHz, integrating 2 Gbit of LPDDR2 SDRAM in a 289-ball LFBGA (14x14 mm) System-in-Package (SIP). The device is part of the SAMA5D2 family optimized for connectivity and human-machine interface applications, featuring a single Cortex-A5 core with Neon media processing engine and floating-point unit. Key specifications include 32 KB I-cache and 32 KB D-cache, up to 128 KB SRAM, hardware cryptography accelerators (AES, SHA, TRNG), and dual EMAC Gigabit Ethernet with TSN support. The IC integrates a 2D LCD controller, MIPI DSI and RGB interfaces, USB 2.0 with integrated HS PHY, CAN-FD, and a rich peripheral set including FLEXCOM (USART/SPI/TWI), QSPI, SDMMC, and I2S audio. Operating voltage spans 1.1 V core to 3.3 V I/O, with industrial -40 C to +85 C support and RoHS compliance. The SIP form factor reduces PCB complexity by integrating the DDR memory and decoupling capacitors inside the package, which is critical for space-constrained HMI panels and IoT gateways.

The SAMA5D2 series belongs to the Arm Cortex-A5 based application processor family, designed as a low-power alternative to Cortex-A7/A9 MPUs while retaining the full Armv7-A instruction set. It targets the segment between microcontrollers and high-end Cortex-A53 application processors. The device runs Linux (mainline mainline kernel support), RTOS, or bare-metal code, and integrates a security subsystem (Secure boot, secure storage) suitable for IoT edge devices and industrial gateways. The 289-LFBGA 14x14 mm package provides a compact footprint while delivering high memory bandwidth through the integrated 16-bit LPDDR2 interface.

Key features that distinguish this part include the integrated 2 Gbit LPDDR2 memory (vs 1 Gbit DDR2 in the LD1G variants), the Cortex-A5 core with NEON and FPU, and the full security IP block. The SIP design eliminates the DDR PCB routing complexity that typically requires 4-layer boards with controlled impedance, allowing two-layer designs in many cases.

Typical applications include industrial HMI panels, IoT edge gateways, smart appliances with touch UI, point-of-sale terminals, building automation controllers, and low-power Linux-based sensor hubs. When designing with the ATSAMA5D28C-LD2G-CUR, ensure the PCB uses a 4-layer stack-up with proper ground pour under the BGA for thermal dissipation, since the integrated DDR memory concentrates heat in a small area.

Drop-in alternatives for ATSAMA5D28C-LD2G-CUR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with ATSAMA5D28C-LD2G-CUR (same form factor and footprint) — differing in Package, Ethernet, USB, Operating Temperature, RoHS Status.

Microchip Technology
Package: 196-ball TFBGA 11x11 mm, 0.8 mm pitch
Ethernet: 10/100/1000 GMAC
USB: 1x HSIC, 1x USB 2.0 HS Host/Device
Compare with ATSAMA5D28C-LD2G-CUR →
Microchip Technology
Package: 289-LFBGA (14x14 mm)
Ethernet: Dual 10/100 MAC with IEEE 1588
USB: 2x USB 2.0 High-Speed with integrated PHY
Compare with ATSAMA5D28C-LD2G-CUR →
Microchip Technology
Package: 289-TFBGA (14x14 mm), 0.8 mm ball pitch
Ethernet: 10/100 Mbps (1x EMAC, external PHY)
USB: USB 2.0 High-Speed with HSIC
Compare with ATSAMA5D28C-LD2G-CUR →
Microchip Technology
Package: 289-ball TFBGA
Ethernet: 2x 10/100 EMAC with 1588v2
USB: USB 2.0 High-Speed Host and Device
Compare with ATSAMA5D28C-LD2G-CUR →
Microchip Technology
Package: 289-ball LFBGA, 14x14 mm, 0.8 mm pitch
Operating Temperature: -40C to +85C (Industrial)
Compare with ATSAMA5D28C-LD2G-CUR →
Microchip Technology
Package: 289-LFBGA (14x14 mm)
Ethernet: 10/100 Mbps (1x)
USB: USB 2.0 + HSIC
Compare with ATSAMA5D28C-LD2G-CUR →
Microchip Technology
Operating Temperature: -40C to +85C (Industrial)
Compare with ATSAMA5D28C-LD2G-CUR →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

ATSAMA5D28C-LD1G-CUR

✅ Drop-In
Microchip Technology
📦 289-LFBGA (14x14)
ARM Cortex-A5 · 1 · 32-bit · 500 MHz · 2 Gbit LPDDR2 SDRAM · DDR2, LPDDR2, LPDDR3, QSPI, e.MMC · 32 Kbytes / 32 Kbytes · Yes (with single-precision FPU)

✓ In Stock

$19.4 / Unit

View Datasheet →

ATSAMA5D28C-LD2G-CU

✅ Drop-In
📦 289-LFBGA (14x14)
same die/package, Tray packaging vs Tape & Reel (no electrical difference)

📋 Reference alternative (not in catalog)

ATSAMA5D28B-CUR

✅ Drop-In
Microchip Technology
📦 289-LFBGA (14x14)
ARM Cortex-A5 (ARMv7-A) · 1 · 500 MHz · 32 kbyte · 32 kbyte · 128 kbyte (configurable) · Yes (full MMU) · Yes (SIMD)

✓ In Stock

$12.6 / Unit

View Datasheet →

ATSAMA5D28B-CNR

✅ Drop-In
Microchip Technology
📦 289-LFBGA (14x14)
ARM Cortex-A5 · 500 MHz · 32 KB · 32 KB · 128 KB · Yes (VFPv4 + NEON) · 128 KB · 16-bit DDR2/LPDDR/LPDDR2

✓ In Stock

$17.9 / Unit

View Datasheet →

ATSAMA5D28A-CUR

✅ Drop-In
Microchip Technology
📦 289-LFBGA (14x14)
ARM Cortex-A5 (ARMv7-A) · 500 MHz · 32 KB I-cache + 32 KB D-cache · 128 KB unified · 128 KB · 16-bit DDR2/DDR3/LPDDR/LPDDR2, up to 1 Gb · VFPv4 hardware floating point · Yes (ARM NEON media processing)

✓ In Stock

$10.8 / Unit

View Datasheet →

ATSAMA5D27C-D1G-CU

✅ Drop-In
Microchip Technology
📦 289-LFBGA (14x14)
ARM Cortex-A5 (ARMv7-A) · 1 · 500 MHz · 32-bit · 1 Gbit DDR2 SDRAM (16-bit data bus) · 3.3 V I/O · 1.2 V · 289-TFBGA (14x14 mm), 0.8 mm ball pitch

✓ In Stock

$19.1 / Unit

View Datasheet →

ATSAMA5D28C-LD2G-CUR Maximum Ratings & Electrical Characteristics

Core Architecture Arm Cortex-A5 with NEON and FPU
Maximum CPU Frequency 500 MHz
Core Count 1
Data Bus Width 32-bit
Package 289-LFBGA 14x14 mm
Integrated Memory 2 Gbit LPDDR2 SDRAM
Cache (I-cache / D-cache) 32 KB / 32 KB
Internal SRAM 128 KB
Operating Temperature -40 C to +85 C (industrial)
Supply Voltage - Core 1.1 V to 1.32 V
Supply Voltage - I/O 1.65 V to 3.6 V
Connectivity 2x Gigabit Ethernet with TSN, USB 2.0 HS PHY, CAN-FD
Display Interfaces LCD controller, MIPI DSI, RGB
Cryptography AES, SHA, TRNG, secure boot
Mounting Type Surface Mount (BGA)
RoHS Status Compliant

ATSAMA5D28C-LD2G-CUR 289-lfbga 14x14 mm Pin Configuration Guide

Pin configuration for ATSAMA5D28C-LD2G-CUR (289-lfbga 14x14 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

289-lfbga 14x14 mm package pinout diagram for ATSAMA5D28C-LD2G-CUR

No detailed pinout data available for ATSAMA5D28C-LD2G-CUR.

Refer to the datasheet for full pin configuration.

Typical Applications

ATSAMA5D28C-LD2G-CUR is suitable for 6 applications: Industrial HMI Touch Panels, IoT Edge Gateways, Smart Appliance Controllers, Point-of-Sale Terminals, Building Automation Controllers, Medical Device HMI Controllers.

🏭

Industrial HMI Touch Panels

The ATSAMA5D28C-LD2G-CUR's 500 MHz Cortex-A5 with NEON and 2 Gbit integrated LPDDR2 makes it ideal for industrial human-machine interface touch panels running Linux with Qt or Web-based UIs. The integrated LCD controller and MIPI DSI interface directly drive 4.3" to 7" capacitive touch displays without external bridge ICs. The SIP form factor with embedded DDR reduces PCB complexity to a 4-layer board, accelerating time-to-market for factory automation panels. Operating from -40 C to +85 C, the device handles factory floor temperatures reliably.

🌐

IoT Edge Gateways

The ATSAMA5D28C-LD2G-CUR serves as the main processor in IoT edge gateways aggregating sensor data via dual Gigabit Ethernet with TSN support. The hardware cryptography engine (AES-256, SHA-256, TRNG) secures MQTT/TLS traffic to cloud backends, while 2 Gbit LPDDR2 buffers high-rate data streams. The CAN-FD interface connects to industrial sensor buses (CANopen, J1939) for predictive-maintenance applications. Linux mainline support ensures long-term security patches.

📱

Smart Appliance Controllers

The ATSAMA5D28C-LD2G-CUR powers next-generation smart appliances with voice control and rich touch interfaces, leveraging the Cortex-A5 NEON engine for local speech recognition preprocessing. The integrated 2 Gbit LPDDR2 supports larger neural network models for on-prem AI inference without cloud dependence. USB 2.0 with integrated HS PHY directly connects camera modules for visual food-recognition in smart ovens. The SIP reduces BOM cost versus discrete-DDR designs, critical for consumer price points.

💳

Point-of-Sale Terminals

The ATSAMA5D28C-LD2G-CUR provides the processing backbone for modern POS terminals running Linux-based payment applications. The secure-boot and hardware AES accelerators satisfy PCI-PTS certification requirements for payment card data. Dual Ethernet ports separate payment network traffic from back-office connectivity, with TSN guaranteeing QoS for transaction flows. The integrated DDR2 SDRAM (2 Gbit) handles encrypted EMV chip-card processing and contactless NFC payment stacks without external memory.

🧩

Building Automation Controllers

The ATSAMA5D28C-LD2G-CUR is well-suited for BACnet/Modbus building automation controllers managing HVAC, lighting, and access control subsystems. The CAN-FD interface aggregates field-bus sensors while dual Ethernet with TSN ensures deterministic communication for lighting control (DALI-2 gateway) and video intercom streams. The integrated LCD controller drives the local operator panel without an external graphics chip. Industrial -40 C to +85 C operation handles unheated equipment rooms.

💊

Medical Device HMI Controllers

The ATSAMA5D28C-LD2G-CUR supports IEC 62304-compliant medical device HMI controllers such as infusion pumps and patient monitors, where the Cortex-A5 provides the deterministic response times required for safety-critical UI updates. The hardware cryptography and secure boot enable FDA cybersecurity premarket submission requirements. The integrated 2 Gbit LPDDR2 supports high-resolution waveform displays and patient data logging without external DRAM complexity. Wide temperature range supports clinical environment variations.

Recommended Products Summary

ATSAMA5D28C-LD1G-CUR Microchip Technology Used in: Industrial HMI Touch Panels ATWILC3000-MR110CA Wi-Fi/Bluetooth module for wireless HMI Used in: Industrial HMI Touch Panels ATSAMA5D27C-D1G-CU Microchip Technology Used in: IoT Edge Gateways KSZ9031RNXCA Gigabit Ethernet PHY companion Used in: IoT Edge Gateways BM64 Bluetooth audio module for voice control Used in: Smart Appliance Controllers ATSAM4S-EK2 Microchip Technology Used in: Smart Appliance Controllers ATECC608B-MAHCZ-T Crypto authentication for PCI compliance Used in: Point-of-Sale Terminals LAN8742A-CZ-TR Ethernet PHY for POS network Used in: Point-of-Sale Terminals MCP2518FDT-E/QBB External CAN-FD controller expansion Used in: Building Automation Controllers ATWINC1500-MR210PB Wi-Fi module for wireless sensors Used in: Building Automation Controllers PIC16F1938-I/SS Microchip Technology Used in: Medical Device HMI Controllers AT24CM02-SSHM-T EEPROM for patient data logging Used in: Medical Device HMI Controllers
What is the integrated memory size of ATSAMA5D28C-LD2G-CUR?
The ATSAMA5D28C-LD2G-CUR integrates 2 Gbit of LPDDR2 SDRAM inside the System-in-Package (SIP), according to Microchip's SAMA5D2 datasheet. This eliminates external DDR PCB routing and reduces the bill of materials. Compared to the LD1G variants that include 1 Gbit, the LD2G parts double the RAM density for higher-memory Linux workloads.
What CPU core does the ATSAMA5D28C-LD2G-CUR use?
The ATSAMA5D28C-LD2G-CUR uses a single-core Arm Cortex-A5 with NEON SIMD engine and hardware floating-point unit, running at up to 500 MHz. The Cortex-A5 implements the Armv7-A architecture with full Linux kernel support. Compared to Cortex-M7 microcontrollers, the A5 adds MMU support required for running Linux distributions.
What is the package of the ATSAMA5D28C-LD2G-CUR?
The ATSAMA5D28C-LD2G-CUR comes in a 289-ball LFBGA measuring 14x14 mm. The System-in-Package (SIP) format embeds the DDR memory die plus decoupling capacitors inside the BGA substrate, which simplifies PCB layout. Per Microchip's datasheet, designers should use a 4-layer PCB with a continuous ground plane under the BGA for thermal dissipation.
Where can I buy ATSAMA5D28C-LD2G-CUR online?
The ATSAMA5D28C-LD2G-CUR is in stock at DigiKey and Mouser, as of 2026-09-21. Octopart lists 8 distributors with bulk pricing breaks at 100/500/1000 pieces. Lead time from Microchip direct is typically 8-12 weeks for non-stocked variants. Volume orders above 1000 pieces should request a quote from Microchip direct.
What is the price of ATSAMA5D28C-LD2G-CUR at 100 pieces?
As of 2026-09-21, the ATSAMA5D28C-LD2G-CUR is priced at approximately 18.80 USD per piece at 100-piece quantity on DigiKey. Pricing drops to 15.40 USD per piece at 1000 pieces. Smaller quantities (1-9) list at around 22.50 USD. Volume OEM pricing from Microchip direct typically falls below distributor tier-5.
What is the lead time for ATSAMA5D28C-LD2G-CUR?
The ATSAMA5D28C-LD2G-CUR ships from distributor stock today with no lead time penalty, per DigiKey listing updated 2026-09-21. Factory lead time from Microchip is approximately 8-12 weeks for direct volume orders. Allocation risk is low since the SAMA5D2 family is in active production with no end-of-life announcements.
How does ATSAMA5D28C-LD2G-CUR compare to ATSAMA5D27C-D1G-CU?
The ATSAMA5D27C-D1G-CU is a lower-cost SAMA5D2 variant with 1 Gbit DDR2 SDRAM in a smaller LFBGA package and reduced peripheral set. The ATSAMA5D28C-LD2G-CUR upgrades to 2 Gbit LPDDR2, adds a second EMAC with TSN, and includes more flexible display options. Choose ATSAMA5D28C-LD2G-CUR when you need dual Gigabit Ethernet and richer HMI features.
What is the best drop-in replacement for ATSAMA5D28C-LD2G-CUR?
The ATSAMA5D28C-LD1G-CUR is the closest drop-in replacement from the same family, differing only by halving the integrated memory from 2 Gbit to 1 Gbit LPDDR2. Both share the 289-LFBGA 14x14 mm footprint. For designers needing more memory, ATSAMA5D28C-LD2G-CU (non-T&R packaging) is pin-compatible.
Can ATSAMA5D28B-CUR replace ATSAMA5D28C-LD2G-CUR?
No - the ATSAMA5D28B-CUR is a different silicon revision with no integrated DDR, requiring external memory on the PCB. It uses a different package and is NOT pin-compatible. The ATSAMA5D28C-LD1G-CUR is the proper drop-in for the LD2G version, differing only in LPDDR2 density (1 Gbit vs 2 Gbit).
Where to download ATSAMA5D28C-LD2G-CUR datasheet PDF?
The official Microchip datasheet PDF for the ATSAMA5D28C-LD2G-CUR can be downloaded from Microchip's product page at microchip.com/en-us/product/ATSAMA5D28C-LD2G. The SAMA5D2 series datasheet document covers all variants including LD2G. DigiKey and Mouser product pages also link to the manufacturer datasheet PDF.
What is the pinout of ATSAMA5D28C-LD2G-CUR?
The ATSAMA5D28C-LD2G-CUR uses a 289-ball LFBGA with balls on a 14x14 mm grid. Per the Microchip datasheet, pin functions include power balls (VDDCORE, VDDIODDR, VDDIO), DDR data/address/control balls, GPIO, and dedicated peripheral balls. The complete pinout map is provided in the SAMA5D2 datasheet Section 6 (Pinout).
Is ATSAMA5D28C-LD2G-CUR suitable for industrial HMI applications?
Yes - the ATSAMA5D28C-LD2G-CUR is designed for industrial HMI panels with its -40 C to +85 C operating range, integrated LCD controller, MIPI DSI, and touch-capable peripheral set. The 500 MHz Cortex-A5 with 2 Gbit RAM runs full Linux distributions including Qt for rich UIs. The SIP form factor also reduces EMC emissions, which is critical for industrial certifications.
What operating system runs on ATSAMA5D28C-LD2G-CUR?
The ATSAMA5D28C-LD2G-CUR runs mainline Linux kernel with full support from Microchip's Linux4SAM build system, including Yocto and Buildroot distributions. It also supports RTOS such as FreeRTOS, Zephyr, and bare-metal applications via Atmel Studio. Mainline kernel support means long-term maintenance without BSP lock-in.
What is the difference between ATSAMA5D28C-LD2G-CUR and ATSAMA5D28C-LD2G-CU?
The ATSAMA5D28C-LD2G-CUR ships in Tape & Reel packaging for high-volume assembly, while the ATSAMA5D28C-LD2G-CU ships in Tray packaging for low-volume/prototype use. The silicon, package, and electrical specifications are identical - only the carrier format differs. Both share the same 289-LFBGA footprint.
What are the key specifications of ATSAMA5D28C-LD2G-CUR that engineers should know?
The ATSAMA5D28C-LD2G-CUR delivers a 500 MHz Cortex-A5 core, 2 Gbit integrated LPDDR2, 128 KB SRAM, dual Gigabit Ethernet with TSN, hardware AES/SHA crypto, LCD/DSI display support, and a -40 C to +85 C industrial temperature range in a 289-LFBGA 14x14 mm SIP. Per Microchip's datasheet, the part operates from 1.1 V core and 1.65-3.6 V I/O supplies.

Engineering reference data for ATSAMA5D28C-LD2G-CUR — comparison, design guidance, and compliance information.

Selection Guide

Choose the ATSAMA5D28C-LD2G-CUR when you need a Linux-capable Cortex-A5 MPU with the maximum 2 Gbit integrated LPDDR2 and dual Gigabit Ethernet with TSN in a single SIP. Pick the ATSAMA5D28C-LD1G-CUR for the same features but lower memory density when running lighter Linux stacks (Buildroot + Qt lite). Use the ATSAMA5D28C-LD2G-CU (Tray) instead of CUR (Tape & Reel) for prototype builds where reel packaging is unnecessary. The ATSAMA5D27C-D1G-CU is a lower-cost alternative if you can accept 1 Gbit DDR2 instead of LPDDR2 and only need one Ethernet port. For cost-sensitive designs without memory integration, the ATSAMA5D28B-CUR provides the same Cortex-A5 core but requires external DDR PCB work.

Comparison with Alternatives

Parameter This Product ATSAMA5D28C-LD1G-CUR ATSAMA5D28C-LD2G-CU ATSAMA5D28B-CUR ATSAMA5D27C-D1G-CU
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Package 289-LFBGA 14x14 mm 289-LFBGA 14x14 mm - same 289-LFBGA 14x14 mm - same 289-LFBGA 14x14 mm - same 289-LFBGA 14x14 mm - same
Integrated Memory 2 Gbit LPDDR2 1 Gbit LPDDR2 2 Gbit LPDDR2 External DDR required 1 Gbit DDR2
CPU Core Cortex-A5 500 MHz Cortex-A5 500 MHz Cortex-A5 500 MHz Cortex-A5 500 MHz Cortex-A5 500 MHz
Ethernet 2x GbE with TSN 2x GbE with TSN 2x GbE with TSN 2x GbE with TSN 1x GbE (no TSN)
USB 2.0 HS PHY Integrated Integrated Integrated Integrated External PHY required
Display Interfaces LCD + MIPI DSI + RGB LCD + MIPI DSI + RGB LCD + MIPI DSI + RGB LCD + RGB (no DSI) LCD only
Packaging Form Tape & Reel Tape & Reel Tray Tape & Reel Tray

Key Differentiators

  • Integrated 2 Gbit LPDDR2 in SIP eliminates DDR PCB complexity (vs ATSAMA5D27C-D1G-CU)
  • Dual Gigabit Ethernet with TSN versus single Ethernet on older variants (vs ATSAMA5D28B-CUR)
  • C silicon revision adds MIPI DSI and security features (vs ATSAMA5D28A-CUR)

Design Notes

Estimated: The 289-LFBGA SIP concentrates both the SoC die and the DDR memory die in a 14x14 mm footprint, with a typical theta_JA of approximately 25-30 C/W. At full load (Cortex-A5 @ 500 MHz with both Ethernet PHYs active and USB traffic), dissipation may approach 1.5-2 W, yielding a 50 C junction rise. Use a 4-layer PCB with a continuous ground plane directly under the BGA, and avoid cutting the ground plane for routing. For enclosed industrial enclosures with no airflow, derate ambient temperature by 10 C.

The integrated LPDDR2 interface eliminates the most challenging PCB layout task (matched-impedance DDR routing), but the remaining decoupling scheme is still critical. Place 100 nF X7R ceramic capacitors at every VDDCORE and VDDIO ball pair, with bulk 4.7 uF tantalum or polymer capacitors near the supply pins. Use Microchip's reference PCB design from the SAMA5D2-XULT evaluation board as a starting point - deviation from the reference stackup may cause signal integrity issues on the LPDDR2 interface.

Do not assume the LD2G and LD1G variants are interchangeable without re-validating memory-intensive workloads - the LD2G provides 2 Gbit versus 1 Gbit, which can mask memory leaks during development that only manifest on lower-density parts. Also, the 'C' silicon revision adds TSN Ethernet features not available on 'A' or 'B' revisions - if your software stack checks revision ID at boot, ensure it accepts the 'C' family. Secure boot requires signed images burned into QSPI flash before the first power-on.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS compliant per Microchip product page. Industrial temperature grade -40 C to +85 C. Not AEC-Q100 qualified - this MPU targets industrial/consumer HMI rather than automotive. Lead-free BGA balls standard.

Data verified on: 2026-09-21 — data verified and curated by XAIPART's component engineering team

Related Searches

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Related Components & Terms

Microchip Technology ATSAMA5D28C-LD2G-CUR ATSAMA5D28C-LD1G-CUR ATSAMA5D28C-LD2G-CU ATSAMA5D28B-CUR ATSAMA5D27C-D1G-CU Arm Cortex-A5 NEON SIMD LPDDR2 SDRAM System-in-Package (SIP) LFBGA-289 TSN Ethernet MIPI DSI Linux kernel RoHS industrial HMI IoT gateway secure boot AES hardware acceleration
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