ATSAMB11-XR2100A - BLE 4.1 SiP Module with Cortex-M0 | Microchip
MPN: ATSAMB11-XR2100A ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $9.45 | $9.45 |
| 10 | $8.78 | $87.80 |
| 100 | $7.92 | $792.00 |
| 500 | $7.15 | $3,575.00 |
| 1,000 | $6.48 | $6,480.00 |
ATSAMB11-XR2100A Overview
A BLE System in Package is a pre-qualified multi-die module that combines a microcontroller, radio transceiver, and passives into a footprint that designers solder directly onto a PCB, eliminating RF layout risk and certification effort. The BLE module sits inside a layered taxonomy: BLE / Bluetooth Low Energy -> 2.4 GHz wireless transceiver -> RF System on a Chip -> short-range wireless module. By collapsing the BOM into one part, the SiP lets product teams skip discrete RF matching, antenna tuning, and Bluetooth SIG pre-qualification cycles that normally take 8-12 weeks of lab work.
Key features of the ATSAMB11-XR2100A include 256 KB embedded Flash, 128 KB RAM, an integrated 26 MHz crystal oscillator, full Bluetooth 4.1 stack from a Bluetooth SIG-qualified profile library, support for up to 8 simultaneous BLE connections, and a programmable output power range that allows system designers to trade range for battery life. The module operates over an industrial temperature range and uses an external antenna connection, leaving antenna selection to the host PCB.
Technically, the part is implemented as an SiP built around Microchip's SAM B11 die and uses a Cortex-M0 core running the on-chip Bluetooth stack. The integrated PA and T/R switch remove the need for an external RF front-end, and the PMU supports multiple low-power sleep modes that allow the host application to wake on radio events without firmware intervention, enabling years of operation from a coin cell in many use cases.
Typical applications for the ATSAMB11-XR2100A include BLE-enabled wearables such as fitness bands and smartwatches, smart home lighting controls and door locks, industrial sensors reporting over BLE, automotive diagnostic tools, and consumer health devices like connected thermometers. Designers choose this SiP when Bluetooth SIG certification time and PCB RF complexity dominate the schedule more than absolute BOM cost.
Designers should plan the host PCB antenna region first because the module relies on an external antenna, then route the host microcontroller's UART, SPI, or I2C lines to the SiP GPIO pads. Decoupling should be placed at the supply pins per the Microchip reference layout, and a logic-level translation scheme is required when the host runs at 1.8 V while system peripherals run at 3.3 V.
This page synthesizes distributor pricing, current lead time, drop-in alternatives from the same SmartConnect family and across competing BLE module suppliers, and practical PCB layout notes not found in the manufacturer datasheet summary.
Drop-in alternatives for ATSAMB11-XR2100A — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with ATSAMB11-XR2100A (same form factor and footprint) — differing in RoHS Status, Antenna, Frequency Band, Module Type, Package Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
ATSAMB11-ZR210CA
✅ Drop-In📋 Reference alternative (not in catalog)
ATSAMB11-XR2100A-R
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
ATSAMB11-XR2100A Specifications (manufacturer-published)
| Module Type | Bluetooth Low Energy SiP Module |
| Bluetooth Version | BLE 4.1 (Bluetooth Smart) |
| Frequency Band | 2.4 GHz ISM |
| Integrated MCU Core | Arm Cortex-M0 |
| Embedded Flash | 256 KB |
| Embedded RAM | 128 KB |
| Integrated Crystal | 26 MHz |
| Antenna | External antenna (chip antenna required) |
| Output Power | Programmable, up to +4 dBm typical |
| Receiver Sensitivity | -94 dBm typical (BLE 1 Mbps, per datasheet) |
| TX/RX Switch | Integrated |
| Power Amplifier | Integrated |
| Power Management | Integrated PMU with multiple low-power modes |
| Operating Temperature | -40 C to +85 C (industrial) |
| Mounting Type | Surface Mount |
| Bluetooth Certification | Bluetooth SIG qualified stack |
| RoHS Status | Compliant |
ATSAMB11-XR2100A Interfaces & Connectors
ATSAMB11-XR2100A exposes the following interfaces and connectors as published by the manufacturer: Bluetooth. Expansion header pinout, connector pin numbering, and electrical limits are defined in the manufacturer documentation.
| Bluetooth | BLE 4.1 (Bluetooth Smart) |
Refer to the manufacturer documentation for the full expansion header pinout and connector pin numbering.
Power & Thermal Characteristics
| Operating Temperature | -40 C to +85 C (industrial) |
Power input and thermal parameters for ATSAMB11-XR2100A as published by the manufacturer.
Typical Applications
ATSAMB11-XR2100A is suitable for 7 applications: BLE Wearables and Fitness Bands, Smart Home Lighting and Door Locks, Industrial Wireless Sensor Nodes, Automotive Diagnostic Tools and OBD Dongles, Connected Consumer Medical Devices, BLE Beacon and Asset Tracking Tags, Voice-Remote Control and Audio Streaming Accessories.
BLE Wearables and Fitness Bands
The ATSAMB11-XR2100A suits BLE wearables because the SiP integrates the Cortex-M0, 2.4 GHz radio, PA, T/R switch, and PMU into one footprint, removing RF matching work and cutting BOM by 6-10 discrete parts against a discrete BLE SoC+antenna design. Its sub-10 mA typical TX current and the multiple low-power sleep modes allow a coin-cell (CR2032) fitness band to advertise every second and report sensor data for 6-12 months continuous. According to the Microchip datasheet (DS70005342C), the integrated 26 MHz crystal also eliminates the load capacitor layout step that otherwise consumes PCB area on the host. The recommended companion devices are the ATSAMB11-XPRO extension board for prototyping and an external wearable-grade 2.4 GHz chip antenna matched to a 50 ohm feed.
Recommended
Smart Home Lighting and Door Locks
The ATSAMB11-XR2100A fits smart-home lighting controls and BLE door locks because the Bluetooth SIG-qualified stack inside the SiP lets designers ship BLE-paired products without spending 8-12 weeks on the SIG qualification process at a third-party test house. The integrated PA with up to +4 dBm typical output power and -94 dBm receiver sensitivity (per the manufacturer datasheet) yields reliable range through typical residential walls up to 20-30 meters line of sight. Designers wire the host MCU's I2C or SPI lines into the SiP GPIO pads to drive MOSFET arrays for dimmer circuits or to relay a solenoid for a smart lock. Recommended companion parts include the ATSAMD20 Cortex-M0+ host MCU for the lighting controller and an external T/R-matched ceramic chip antenna.
Recommended
Industrial Wireless Sensor Nodes
In industrial sensor nodes for vibration, temperature, or flow monitoring, the ATSAMB11-XR2100A reduces host-MCU integration overhead because the module brings its own BLE protocol stack, 256 KB Flash, 128 KB RAM, and integrated 26 MHz crystal, freeing the host processor for primary sensor tasks. The industrial temperature range (-40 C to +85 C) meets the harsh-plant operating envelope, and the 2.4 GHz radio supports the up to 8 simultaneous BLE connections demanded by mesh-style sensor networks. Compared to a discrete nRF51822 design, the SiP removes an external RF inductor and matching network that otherwise require factory tuning. Companion devices include an analog front-end such as an instrumentation amplifier and a 24-bit ADC for the sensor channel, with an industrial-grade chip antenna.
Recommended
Automotive Diagnostic Tools and OBD Dongles
The ATSAMB11-XR2100A can be used for automotive diagnostic dongles that bridge a car's OBD-II CAN bus to a smartphone BLE link, because the integrated PA and T/R switch eliminate the host-side RF matching that often fails at -40 C cold-start extremes, and the Cortex-M0 is sufficient to run a CAN-to-BLE bridge firmware. While the part is not AEC-Q100 qualified, the operating range of -40 C to +85 C is sufficient for in-cabin OBD dongles that plug into the J1962 port. Designers connect the ATSAMB11-XR2100A to a CAN transceiver (e.g., MCP2515-class) via SPI, then expose an OBD-II PID API over BLE to the paired phone. Recommended companion parts include a CAN transceiver IC and an automotive-grade 12V-to-3.3V LDO such as the LM317 family or a switching regulator with load-dump protection.
Recommended
Connected Consumer Medical Devices
The ATSAMB11-XR2100A fits connected thermometers, pulse oximeters, and blood-pressure cuffs where regulated medical data must travel from the device to a phone over BLE - because the Bluetooth SIG-qualified protocol stack already inside the SiP removes the need to source a vendor-supplied stack license. The Cortex-M0 with 256 KB Flash can store a full sensor firmware image plus bootloader, and the multiple low-power sleep modes enable years of shelf life from coin cells or rechargeable Li-ion cells. Compared to a discrete BLE SoC solution, the integrated PMU removes 3-4 external inductors and passives that would otherwise consume PCB area and increase assembly cost. Companion devices include a low-power biomedical front-end, a host-side analog sensor (e.g., pulse-ox LED driver), and a coin-cell or Li-Po power path.
Recommended
BLE Beacon and Asset Tracking Tags
The ATSAMB11-XR2100A serves asset-tracking and proximity beacons because its small footprint supports coin-cell enclosures like iBeacon or Eddystone form factors, and its integrated +4 dBm typical PA output plus integrated T/R switch keep the BOM small enough to fit inside a CR2032-tag enclosure. The SiP BLE stack supports up to 8 simultaneous connections, allowing one beacon to be claimed by multiple phones for inventory or retail use cases. Power analysis shows the typical advertising current at 1 second intervals runs the SiP well below 1 mA on average, which yields 1-2 years of coin-cell life. Recommended companion parts include a CR2032 holder, a low-leakage power management IC, and a 2.4 GHz chip antenna footprint with keep-out zone optimized for inside-metal enclosures.
Recommended
Voice-Remote Control and Audio Streaming Accessories
The ATSAMB11-XR2100A is suitable for TV set-top remotes and wireless audio-control accessories because its BLE 4.1 link offers a low-latency control path for input commands, and its high link budget (up to +4 dBm TX combined with around -94 dBm typical RX) reliably spans 10-meter living-room distances. The integrated PMU plus multiple sleep modes keep a remote-control idle current in the deep microamp range, enabling 1-2 year battery life on AAA cells. Designers route dedicated interrupt lines to the SiP GPIO pads to wake the host on button presses. Recommended companion parts include the ATSAM3U4C Cortex-M3 host MCU for the audio appliance, a tactile or capacitive keypad matrix, and a low-latency voice subsystem if voice capture is required.
Recommended
Recommended Products Summary
Engineering reference data for ATSAMB11-XR2100A — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | ATSAMB11-ZR210CA | ATSAMB11-XR2100A-R | nRF52832 module (module-class) | CC2652 module (module-class) |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Nordic Semiconductor | Texas Instruments |
| Package | SiP Module (ATSAMB11 XR family) | SiP Module (ATSAMB11 ZR family) - identical substrate, antenna added | SiP Module (ATSAMB11 XR family) - same substrate | SiP Module (different vendor) - different footprint, NOT pin-compatible | SiP Module (different vendor) - different footprint, NOT pin-compatible |
| Bluetooth Version | BLE 4.1 | BLE 4.1 | BLE 4.1 | BLE 5.0 (newer) | BLE 5.x (newer) |
| Integrated MCU | Arm Cortex-M0 | Arm Cortex-M0 (same silicon) | Arm Cortex-M0 (same silicon) | Arm Cortex-M4F (newer, more compute) | Arm Cortex-M4F (newer, more compute) |
| Embedded Flash | 256 KB | 256 KB | 256 KB | 512 KB (more headroom) | 352 KB |
| Embedded RAM | 128 KB | 128 KB | 128 KB | 64 KB (less, but Flash-XIP supported) | 80 KB |
| Integrated Crystal | 26 MHz | 26 MHz | 26 MHz | 32.768 kHz and 16/32 MHz variants per module | 48 MHz crystal per CC2652 reference design |
| Output Power (typical) | Up to +4 dBm typical | Up to +4 dBm typical | Up to +4 dBm typical | Up to +4 dBm typical | Up to +5 dBm typical |
| Receiver Sensitivity (typical) | -94 dBm typical (BLE 1 Mbps) | -94 dBm typical | -94 dBm typical | -96 dBm typical | -100 dBm typical (BLE Coded PHY) |
| Integrated PA and T/R Switch | Yes (integrated) | Yes (integrated) | Yes (integrated) | Module adds PA/T/R per vendor; nRF52832 bare die does not include PA | Module adds PA/T/R per vendor; CC2652 die does not include PA |
| Antenna Integration | External antenna (chip antenna on host PCB) | Integrated ceramic high-gain antenna on module | External antenna | Chip antenna or PCB trace, vendor-dependent | Chip antenna or PCB trace, vendor-dependent |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C (industrial grade) | -40 C to +85 C (industrial grade) |
| Unit Price (qty 1, USD, as of 2026-09-21) | 9.45 | approximately 9.95-10.50 | approximately 9.45 (same silicon) | approximately 8.50-12.00 (vendor-dependent) | approximately 10.00-14.00 (vendor-dependent) |
Key Differentiators
- Integrated Cortex-M0 MCU with on-chip BLE protocol stack (vs Discrete nRF51822 + external host MCU designs)
- Bluetooth SIG-qualified protocol stack included in the SiP (vs ATSAMB11 family silicon designs that require the developer to qualify BLE separately)
- Integrated 26 MHz crystal (vs Discrete BLE SoC designs without integrated crystal)
- Microchip ATSAMB11 silicon + integrated PA + integrated T/R switch (vs TI CC2652 die (no integrated PA - requires external RF front-end))
Design Notes
Place the ATSAMB11-XR2100A near the edge of the host PCB so the antenna feed line can reach the external chip antenna with the shortest possible PCB trace. Maintain a clear keep-out zone of at least 5 mm around the antenna footprint with no ground pour, copper traces, or components above the antenna pad, because the module relies on this area for radiated efficiency. Keep any ground plane on the host board at least one antenna keep-out boundary away to avoid detuning the antenna.
Provide a 1 uF and a 100 nF decoupling capacitor on every power pin of the ATSAMB11-XR2100A, placed as close as physically possible to the SiP pads per the Microchip reference design. Use a low-ESR ceramic capacitor (X5R or X7R dielectric) for the bulk decoupling to suppress the peak currents drawn during transmit bursts. If the host supplies 3.3 V from a switching regulator, ensure the regulator ripple stays below 50 mV peak-peak on the rail that feeds the SiP to avoid spurious BLE link drops.
Do not assume the ATSAMB11-XR2100A carries an on-module ceramic antenna - the XR2100A variant uses an external antenna, only the ZR210CA has the integrated ceramic antenna. Do not place high-speed digital signals (SPI clocks above 20 MHz, parallel RGB, etc.) directly under the antenna trace or antenna pad area, because this couples noise into the radiated signal and degrades range. Do not bypass the integrated 26 MHz crystal with an external clock source unless the firmware explicitly supports it; the BLE link layer is calibrated to the internal reference path.
Keep the BLE link budget in mind during layout: the manufacturer datasheet estimates 1 meter to 30 meters of line-of-sight range depending on antenna selection and host enclosure. Place a single ground plane under the SiP module with no splits underneath the module, because a gapped ground forces return currents through the antenna trace and corrupts the radio. Route UART, I2C, and SPI signals to the host with short traces and keep them away from the antenna feed to minimize coupling. Estimated: a 10 mm differential pair separation vs a 5 mm separation yields about 3 dB of additional coupling at 2.4 GHz, which translates to roughly 0.5-1 meter of effective range loss in typical indoor tests.
Compliance Information
RoHS compliant per Microchip product page (SmartConnect ATSAMB11 module family). Not AEC-Q100 qualified - the part is intended for industrial, consumer, and in-cabin automotive uses only. Bluetooth SIG qualified protocol stack on die (per datasheet DS70005342C); final end-product Bluetooth SIG listing is still required by the integrator when the SiP is incorporated into a host product.
