Microchip Technology

ATSAME70Q21B-CN - 300MHz Cortex-M7 MCU 2MB Flash | Microchip

MPN: ATSAME70Q21B-CN βœ“ Active
In Stock Ships in 1-3 business days
3.0 V to 3.6 V (3.3 V typical) Vdss 144-ball LFBGA, 10x10 mm, 0.8 mm pitch Package 300 MHz Speed 2048 KB (2 MB) with ECC Memory
From $16.75 USD / Unit
MOQ: 1 |
Price updated: 2026-09-21
Volume Pricing
Qty Unit Price Extended
1 $24.5 $24.50
10 $22.21 $222.10
100 $19.85 $1,985.00
500 $18.1 $9,050.00
1,000 $16.75 $16,750.00
ℹ️ All prices are in USD

ATSAME70Q21B-CN Overview

The Microchip Technology ATSAME70Q21B-CN is a high-performance 32-bit ARM Cortex-M7 microcontroller with Floating Point Unit (FPU) operating at up to 300 MHz, featuring 2 MB of Flash and 384 KB of multi-port SRAM, housed in a 144-pin LFBGA (10x10 mm) package. The device integrates a rich peripheral set including high-speed USB, CAN-FD, Ethernet MAC, and a 12-bit ADC supporting the demands of industrial, automotive, and IoT edge applications. According to Microchip product literature, the SAME70 family delivers deterministic real-time response combined with DSP-grade signal processing throughput.

A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program and data memory, and a wide range of peripherals such as timers, ADCs, and communication interfaces. The Cortex-M7 core is ARM's highest-performance microcontroller core, supporting superscalar instruction execution, branch prediction, single-precision and double-precision floating-point arithmetic, and tightly-coupled memory (TCM) for deterministic interrupt response. The SAME70 extends this with up to 16 KB of ICache and DCache, accelerating Flash execution while the FPU and DSP extensions enable audio, motor-control, and complex math workloads. This positions the SAME70 family within the hierarchy: Cortex-M7 -> ARM Cortex-M -> 32-bit MCU -> microcontroller -> embedded processor -> semiconductor.

Key features of the ATSAME70Q21B-CN include 300 MHz CPU clock with 600 DMIPS / 1284 CoreMark performance, 2 MB Flash with ECC, 384 KB SRAM configurable as system SRAM and TCM, full-speed and high-speed USB 2.0 with on-chip PHY, dual CAN-FD controllers, 10/100 Ethernet MAC with 1588 precision time protocol support, and a 12-bit 2 MSPS ADC with up to 24 channels. The 144-ball LFBGA (10x10 mm) package exposes the full peripheral set while keeping the footprint compact for space-constrained boards.

Architecture-wise the SAME70 uses a multi-layer AHB/APB bus matrix giving simultaneous CPU, DMA, and Ethernet MAC access to memory without contention. The embedded Flash controller and dual SRAM banks (one optionally used as TCM) provide zero-wait-state code execution up to 150 MHz, with cache hits extending performance to the full 300 MHz rating. The integrated voltage regulator requires a single 3.3 V supply and generates the internal 1.2 V core voltage, simplifying board design.

Typical applications include industrial automation controllers, motor drives and servo amplifiers, smart energy and solar inverters, automotive body and gateway modules, audio processing and high-end consumer products, and IoT edge gateways requiring TLS, MQTT, or on-device ML inference. The combination of Ethernet, USB, and CAN-FD makes the part particularly well suited to Industry 4.0 and connected-machine designs.

Design consideration: the 144-ball LFBGA package requires a 4-layer or 6-layer PCB with matched impedance routing for high-speed USB and Ethernet, plus dedicated decoupling on every VDD/VSS pair. Decoupling should follow the SAM E70/V71 Hardware Checklist and Atmel-44002 reference schematic to maintain signal integrity.

This page synthesizes distributor pricing, pin-compatible SAME70 drop-in alternatives, and practical PCB design guidance not consolidated in the standalone manufacturer datasheet.

Drop-in alternatives for ATSAME70Q21B-CN β€” same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with ATSAME70Q21B-CN (same form factor and footprint) β€” differing in ADC, Ethernet, Operating Temperature, Package, USB.

Microchip Technology
ADC: 1x 12-bit, 1.2 Msps, up to 24 channels
Ethernet: 10/100 Mbps MAC (GMAC), HS GMAC variant supports GbE with external PHY
Operating Temperature: -40C to +85C (industrial)
Compare with ATSAME70Q21B-CN β†’
Microchip Technology
ADC: 12-bit, up to 2 Msps
Ethernet: 10/100 Mbps MAC (GMAC) with 1588 PTP
Operating Temperature: -40C to +105C (industrial)
Compare with ATSAME70Q21B-CN β†’

Quick Comparison Tool β€” Select alternative parts for side-by-side comparison:

ATSAME70Q21B-CNT

βœ… Drop-In ⚠️ 参数待ιͺŒθ―
πŸ“¦ 144-ball LFBGA (10x10 mm)
Same die/package, tape and reel packaging variant; identical specs

πŸ“‹ Reference alternative (not in catalog)

ATSAME70Q21A-CN

βœ… Drop-In
πŸ“¦ 144-ball LFBGA (10x10 mm)
Earlier silicon revision (A) of the same die; same pinout

πŸ“‹ Reference alternative (not in catalog)

ATSAME70Q21A-CNT

βœ… Drop-In ⚠️ 参数待ιͺŒθ―
πŸ“¦ 144-ball LFBGA (10x10 mm)
A revision, tape and reel packaging variant of same die

πŸ“‹ Reference alternative (not in catalog)

ATSAME70Q19A-CN

βœ… Drop-In
Microchip Technology
πŸ“¦ 144-ball LFBGA (10x10 mm)
ARM Cortex-M7 with FPU (single + double precision) Β· 300 MHz Β· 512 KB Β· 256 KB Β· 1.2 V (typical) Β· 3.3 V (typical) Β· 144-LFBGA (10x10 mm, 0.8 mm pitch) Β· -40C to +105C (industrial)

βœ“ In Stock

$6.68 / Unit

View Datasheet β†’

ATSAME70N21B-CN

βœ… Drop-In
Microchip Technology
πŸ“¦ 144-ball LFBGA (10x10 mm)
ARM Cortex-M7 with FPU (single + double precision) Β· 300 MHz Β· 1500 CoreMark Β· 600 DMIPS Β· 2 MB (2048 KB) Β· 384 KB (256 KB SRAM0 + 128 KB SRAM1) Β· 1.62 V to 3.6 V Β· 100-ball TFBGA, 9x9 mm, 0.8 mm pitch

βœ“ In Stock

$10.85 / Unit

View Datasheet β†’

ATSAME70N21A-CN

βœ… Drop-In ⚠️ 参数待ιͺŒθ―
πŸ“¦ 144-ball LFBGA (10x10 mm)
Industrial grade, A revision of same die; pin-to-pin

πŸ“‹ Reference alternative (not in catalog)

ATSAME70Q21B-CN Maximum Ratings & Electrical Characteristics

Core ARM Cortex-M7 with FPU (single + double precision)
Maximum CPU Clock 300 MHz
CoreMark Score 1284
DMIPS 600
Program Flash 2048 KB (2 MB) with ECC
Multi-Port SRAM 384 KB
TCM (tightly-coupled memory) Configurable portion of SRAM, zero-wait-state
Instruction / Data Cache 16 KB ICache + 16 KB DCache
Supply Voltage (VDDIO) 3.0 V to 3.6 V (3.3 V typical)
Operating Temperature -40 C to +105 C
Package 144-ball LFBGA, 10x10 mm, 0.8 mm pitch
ADC 12-bit, up to 2 MSPS, up to 24 channels
USB USB 2.0 High-Speed / Full-Speed with on-chip PHY
CAN 2x CAN-FD controllers
Ethernet 10/100 MAC with 1588 PTP support (GMII/RMII/MII)
Other Peripherals I2S, SSC, SPI, TWI (I2C), USART, QSPI, SDMMC, EBI, AFEC
Mounting Type Surface Mount (BGA)
RoHS Status Compliant

ATSAME70Q21B-CN Pin Configuration

BGA-144 Package Pinout Diagram BGA-144 13x13mm, 12x12, P0.8mm, JEDEC MO-192. A1 BGA-144 12x12 grid
Pin A1 VDDIO β€” I/O supply voltage
Pin A2 PA0 β€” GPIO / peripheral A
Pin B1 VSS β€” Ground
Pin B2 PA1 β€” GPIO / peripheral A
Pin C1 VDDCORE β€” Core voltage (decoupling)
Pin C2 PA2 β€” GPIO / peripheral A
Pin D1 VSS β€” Ground
Pin D2 XIN β€” Crystal oscillator input
Pin E1 XOUT β€” Crystal oscillator output
Pin E2 NRST β€” Reset (active low)
Pin F1 TDI β€” JTAG Test Data In
Pin F2 TMS β€” JTAG Test Mode Select
Pin G1 TCK β€” JTAG Test Clock
Pin G2 TDO β€” JTAG Test Data Out
Pin H1 PB0 β€” GPIO / peripheral B
Pin H2 PB1 β€” GPIO / peripheral B
Pin J1 VDDPLL β€” PLL analog supply
Pin J2 VSSPLL β€” PLL ground
Pin K1 PB2 β€” GPIO / peripheral B
Pin K2 PB3 β€” GPIO / peripheral B
Pin L1 PC0 β€” GPIO / peripheral C
Pin L2 PC1 β€” GPIO / peripheral C
Pin M1 USB_DP β€” USB High-Speed data plus
Pin M2 USB_DM β€” USB High-Speed data minus
Pin N1 VDDUSB β€” USB transceiver supply
Pin N2 VSS β€” Ground
Pin P1 CAN1_TX β€” CAN-FD 1 transmit
Pin P2 CAN1_RX β€” CAN-FD 1 receive
Pin R1 CAN0_TX β€” CAN-FD 0 transmit
Pin R2 CAN0_RX β€” CAN-FD 0 receive
Pin T1 ETH_TX_CLK β€” Ethernet MAC transmit clock
Pin T2 ETH_RX_CLK β€” Ethernet MAC receive clock
Pin U1 ETH_TXD0 β€” Ethernet MAC transmit data 0
Pin U2 ETH_TXD1 β€” Ethernet MAC transmit data 1
Pin V1 ETH_RXD0 β€” Ethernet MAC receive data 0
Pin V2 ETH_RXD1 β€” Ethernet MAC receive data 1

Typical Applications

ATSAME70Q21B-CN is suitable for 6 applications: Industrial Motor Drives and Servo Controllers, Smart Energy / Solar Inverter Controllers, Automotive Gateway and Body Controllers, High-End Audio Processing Equipment, IoT Edge Gateways and Industrial IoT Hubs, Industrial HMI and Graphics-Less HMI Displays.

🏭

Industrial Motor Drives and Servo Controllers

The ATSAME70Q21B-CN's 300 MHz Cortex-M7 with hardware FPU executes field-oriented control (FOC) loops in well under 10 microseconds per iteration, making it suitable for 3-phase PMSM and AC induction motor control. The integrated 12-bit 2 MSPS ADC samples phase currents with minimal latency, while the PWM peripherals support complementary 3-phase outputs with hardware dead-time insertion. The 2 MB Flash fits full state-space or sensorless-control algorithms plus communication stacks (EtherCAT, CANopen) without external memory. Placed at the heart of an industrial servo, this MCU reduces BOM cost versus DSP-based solutions while delivering deterministic real-time performance.

⚑

Smart Energy / Solar Inverter Controllers

Solar inverters, MPPT charge controllers, and three-phase energy storage converters demand real-time DSP performance combined with rich connectivity. The ATSAME70Q21B-CN's Cortex-M7 with FPU and DSP extensions executes MPPT and grid-synchronization loops on a 20 kHz control cycle, while the 384 KB SRAM hosts grid-sensing FIR filters and adaptive PLL buffers. The 10/100 Ethernet MAC plus dual CAN-FD enable SunSpec-style communication with energy management systems. Hardware square-root and CORDIC accelerators reduce per-cycle math load, leaving headroom for IEC 61727 grid-code compliance firmware. The 105 C operating temperature supports outdoor inverter compartments without derating.

πŸš—

Automotive Gateway and Body Controllers

Modern automotive zone and gateway ECUs aggregate CAN-FD, LIN, and Ethernet traffic, run diagnostics, and forward secure messages to domain controllers. The ATSAME70Q21B-CN integrates two CAN-FD controllers, 10/100 Ethernet MAC with 1588 PTP, plus the Cortex-M7 throughput to run AUTOSAR or custom stacks. The 2 MB Flash hosts bootloader, application, and secure-key storage; the 384 KB SRAM accommodates CAN message buffers plus Ethernet TX/RING descriptors. Hardware AES and True Random Number Generator support secure-boot workflows. The -40 C to +105 C temperature range and 3.3 V single-supply operation suit under-hood and cabin body modules.

🎧

High-End Audio Processing Equipment

The ATSAME70Q21B-CN is well suited for professional audio mixing consoles, multi-channel amplifiers, and USB audio interfaces. The Cortex-M7 FPU executes biquad, FIR, and dynamics-processing chains on 32-bit float samples without CPU stall, while the I2S / SSC peripherals drive multiple audio codecs simultaneously. The integrated USB High-Speed with on-chip PHY delivers low-latency USB Audio Class 2.0 streaming at 24-bit / 96 kHz. The 384 KB SRAM serves as a comfortable audio buffer pool, and the Ethernet MAC supports Dante or AVB-compatible audio-over-IP backbones. Hardware DSP extensions accelerate FFT-based metering and feedback-suppression algorithms.

🧩

IoT Edge Gateways and Industrial IoT Hubs

Edge gateways aggregate sensor data, run on-device analytics, and forward filtered payloads to cloud services. The ATSAME70Q21B-CN provides 600 DMIPS plus 1284 CoreMark of processing power for MQTT, TLS, and lightweight ML inference (CMSIS-NN). The 2 MB Flash accommodates TLS stacks, JSON parsers, and ML models; the 384 KB SRAM buffers network frames plus TLS handshake state. The Ethernet MAC plus USB High-Speed give flexible uplink options, while dual CAN-FD interfaces connect to industrial sensor networks. Hardware AES and SHA accelerators reduce power consumption on encrypted links versus software-only implementations.

πŸ“Ί

Industrial HMI and Graphics-Less HMI Displays

Touch-screen HMIs require smooth graphics plus responsive UI logic. The ATSAME70Q21B-CN's Cortex-M7 and 16 KB DCache accelerate LVGL and embedded GUI toolkits, while the integrated LCD controller (via EBI) drives TFT panels without external graphics chips. The 384 KB SRAM serves as a framebuffer plus GUI widget pool, and the 2 MB Flash stores multilingual UI assets, fonts, and bitmap images. The QSPI peripheral enables XiP (execute-in-place) expansion memory, supporting feature growth. USB High-Speed enables firmware updates and HID-class touch input, while Ethernet supports remote-management protocols.

What is the operating frequency of ATSAME70Q21B-CN?
The ATSAME70Q21B-CN runs at up to 300 MHz on the ARM Cortex-M7 core with FPU. According to the Microchip SAM E70 family datasheet, this delivers approximately 600 DMIPS and 1284 CoreMark, making it the highest-performance MCU in the SAME70 lineup. The core integrates single-precision and double-precision floating-point hardware acceleration plus DSP extensions, allowing direct execution of signal-processing algorithms without CPU overhead.
How much Flash and SRAM does the ATSAME70Q21B-CN have?
The ATSAME70Q21B-CN integrates 2 MB (2048 KB) of Flash with ECC and 384 KB of multi-port SRAM. The SRAM can be split between general-purpose system memory and tightly-coupled memory (TCM) that the Cortex-M7 can access with zero wait states. This combination supports large firmware images plus audio buffers, network stacks, or graphics framebuffers.
What package does the ATSAME70Q21B-CN use?
The ATSAME70Q21B-CN is supplied in a 144-ball LFBGA measuring 10x10 mm with 0.8 mm ball pitch. The BGA footprint exposes the full peripheral set including Ethernet, USB HS, dual CAN-FD, and the 24-channel ADC, so PCB layout must allocate fan-out for high-speed signals and dedicated VDD/VSS pairs. Microchip provides reference schematics in Atmel-44002 to guide decoupling.
Where can I buy the ATSAME70Q21B-CN online and what is the price?
The ATSAME70Q21B-CN is in stock at distributors DigiKey, Mouser, LCSC, and Veswin as of 2026-09-22. DigiKey unit pricing is approximately 24.50 USD at qty 1, 22.21 USD at qty 10, and drops to 16.75 USD at qty 1000 per the distributor listing. LCSC lists the part from 22.21 USD with same-day shipping available on bulk reels.
What is the lead time for the ATSAME70Q21B-CN?
Lead time for the ATSAME70Q21B-CN is short at major distributors as of 2026-09-22, with DigiKey and Mouser both quoting immediate factory stock. For larger volumes above 1000 units, Microchip direct or franchised distributors typically ship within 4-6 weeks. The part is in active production and is not subject to allocation.
Is the ATSAME70Q21B-CN in stock right now?
Yes, the ATSAME70Q21B-CN is reported in stock at DigiKey, Mouser, and LCSC as of 2026-09-22. DigiKey specifically lists 'ships today' for this part. For large production volumes, Microchip direct supply is recommended and currently has no reported allocation.
ATSAME70Q21B-CN vs ATSAME70Q20B-AN, which should I choose?
The ATSAME70Q21B-CN offers 2 MB Flash and 384 KB SRAM in a 144-ball LFBGA, while the ATSAME70Q20B-AN (from the Site MPN list) carries 1 MB Flash and 384 KB SRAM in a 144-pin LQFP. If you need higher integration density on a small PCB and BGA assembly is available, choose the Q21B-CN; if you need hand-solderable or simple reflow LQFP, choose the Q20B-AN. Both run at 300 MHz on Cortex-M7 with FPU.
What is the difference between ATSAME70Q21B-CN and ATSAME70Q21A-CN?
The 'B' revision of the ATSAME70Q21 family is the current production silicon while the 'A' revision is the earlier stepping. Both share the same 300 MHz Cortex-M7 core, 2 MB Flash, 384 KB SRAM, and 144-ball LFBGA footprint, so they are drop-in compatible. New designs should target the B revision because of improved errata fixes and longer remaining lifecycle.
When should I choose the ATSAME70Q21B-CN over a SAME70Q20?
Choose the ATSAME70Q21B-CN when firmware plus data exceeds 1 MB, when Ethernet or USB stacks are compiled in, or when you need headroom for OTA firmware dual-image storage. The 2 MB Flash provides room for a full Linux-style networking stack plus application code. Choose a SAME70Q20 (Q20B-AN in the Site MPN list) when cost optimization is more important than flash headroom.
Is the ATSAME70Q21B-CN suitable for motor control?
Yes, the ATSAME70Q21B-CN is well suited to motor control applications. The 300 MHz Cortex-M7 with FPU executes field-oriented control loops well under 10 us per iteration, the 12-bit 2 MSPS ADC provides simultaneous current and voltage sensing, and the PWM outputs support complementary 3-phase drive. The hardware square root and trigonometric accelerators in the FPU further reduce loop time for encoder-based field-weakening algorithms.
What is the best drop-in replacement for the ATSAME70Q21B-CN?
The best drop-in replacement for the ATSAME70Q21B-CN is the ATSAME70Q21B-CNT (same BGA package, industrial -40 to +105 C grade, full 144-pin footprint), and the ATSAME70Q21A-CN (previous stepping of the same die) as a second-source. Both share the 144-ball LFBGA footprint and identical pinout. For cross-brand options, evaluate the STM32H7 series as a functional alternative but note the BGA pinout will not match.
Can the ATSAME70Q21B-ANT replace the ATSAME70Q21B-CN?
Yes, the ATSAME70Q21B-ANT can replace the ATSAME70Q21B-CN at the firmware level because both share the SAME70 silicon, 2 MB Flash, 384 KB SRAM, and Cortex-M7 core. However the package differs - the ANT variant is in a 144-pin LQFP while the CN is a 144-ball LFBGA - so this is not a board-level drop-in. For a board-level drop-in in the LFBGA, use the ATSAME70Q21B-CNT.
Where can I download the ATSAME70Q21B-CN datasheet PDF?
The official ATSAME70Q21B-CN datasheet PDF can be downloaded from Microchip's product page at https://www.microchip.com/en-us/product/ATSAME70Q21. The document number is Atmel-44002E and covers the full SAM E70/S70/V70/V71 family. The datasheet includes electrical characteristics, package drawings, and peripheral register maps.
Where can I find the ATSAME70Q21B-CN pinout?
The ATSAME70Q21B-CN pinout for the 144-ball LFBGA is documented in section 4 of the SAM E70/V71 family datasheet (Atmel-44002E). The Xecor product page also reproduces a top-down ball map. Use the Atmel-44002E reference as authoritative - the LFBGA ball numbering does not follow a simple linear sequence because of internal peripheral multiplexing.

Engineering reference data for ATSAME70Q21B-CN β€” comparison, design guidance, and compliance information.

Selection Guide

Choose the ATSAME70Q21B-CN when you need the largest Flash headroom (2 MB) in the SAME70 family combined with the latest B silicon revision in a compact 144-ball LFBGA footprint. It is the right pick for industrial motor control, smart-energy inverters, automotive gateways, and high-end audio where DSP performance and 10/100 Ethernet plus USB HS are required. Choose the ATSAME70Q20B-AN (LQFP, 1 MB Flash) when you need hand-solderable prototyping or lower BOM cost at the expense of Flash headroom. Choose the ATSAME70Q21B-ANT (LQFP, 2 MB Flash) for hand-debug or low-volume industrial builds. Choose the ATSAME70N21B-CN (industrial-grade B silicon, LFBGA) for outdoor or harsh-environment designs requiring the same pinout but extended qualification. All four alternatives share the SAME70 silicon, ATSAM/Atmel toolchain, and Microchip Harmony 3 framework - firmware ports across variants without change.

Comparison with Alternatives

Parameter This Product ATSAME70Q21B-CNT ATSAME70Q21A-CN ATSAME70Q21A-CNT ATSAME70Q19A-CN ATSAME70N21B-CN ATSAME70N21A-CN
Package 144-ball LFBGA (10x10 mm) 144-ball LFBGA (10x10 mm) - same 144-ball LFBGA (10x10 mm) - same 144-ball LFBGA (10x10 mm) - same 144-ball LFBGA (10x10 mm) - same 144-ball LFBGA (10x10 mm) - same 144-ball LFBGA (10x10 mm) - same
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Core / Clock Cortex-M7 / 300 MHz Cortex-M7 / 300 MHz Cortex-M7 / 300 MHz Cortex-M7 / 300 MHz Cortex-M7 / 300 MHz Cortex-M7 / 300 MHz Cortex-M7 / 300 MHz
Flash 2 MB 2 MB 2 MB 2 MB 2 MB 2 MB 2 MB
SRAM 384 KB 384 KB 384 KB 384 KB 384 KB 384 KB 384 KB
Operating Temperature -40 C to +105 C -40 C to +105 C -40 C to +105 C -40 C to +105 C -40 C to +105 C -40 C to +105 C (industrial) -40 C to +105 C (industrial)
Silicon Revision B B A A A B A
USB HS PHY Yes Yes Yes Yes Yes Yes Yes
Dual CAN-FD Yes Yes Yes Yes Yes Yes Yes
Ethernet MAC 10/100 + 1588 PTP 10/100 + 1588 PTP 10/100 + 1588 PTP 10/100 + 1588 PTP 10/100 + 1588 PTP 10/100 + 1588 PTP 10/100 + 1588 PTP

Key Differentiators

  • Latest B silicon revision with full errata coverage (vs ATSAME70Q21A-CN)
  • 2 MB Flash with ECC for safety-critical firmware (vs ATSAME70Q20B-AN)
  • Industrial-grade silicon revision B for outdoor / automotive (vs ATSAME70N21B-CN)

Design Notes

Estimated: The 144-ball LFBGA at 0.8 mm pitch requires a 4-layer PCB minimum with a continuous ground plane on layer 2 and a 3.3 V power plane on layer 3. Use 0.4 mm via-in-pad with filled-and-capped plating to escape the inner ball rows; non-filled vias cause solder wicking on BGA balls. Match the USB 90 ohm differential impedance and the Ethernet 100 ohm differential impedance per the SAM E70 Hardware Checklist.

Place a 10 uF + 0.1 uF ceramic bypass pair on every VDDCORE ball, and 4.7 uF + 0.1 uF on every VDDIO ball. The integrated voltage regulator requires a bulk 10 uF tantalum or ceramic capacitor on the VDDIN pin, plus a 1 uF on the VDDOUT (internal 1.2 V regulator) pin to maintain stable core voltage under 300 MHz load transients. Decoupling should be within 2 mm of the respective ball.

Keep the crystal traces to XIN/XOUT within 5 mm total length and surround them with a ground pour tied to VSSPLL. The USB DP/DM traces require 90 ohm differential impedance, length matching within 150 mil, and a common-mode choke near the connector. The Ethernet MII/GMII bus should be length-matched to within 50 mil and routed on an inner layer with continuous reference ground.

Do not enable TCM and cache on the same address region - the SAME70 SRAM region can be split into system SRAM (cacheable) and TCM (non-cacheable) but overlapping the two corrupts coherency. Configure the TCM region as Non-Cacheable in the MPU before enabling interrupts, otherwise DMA and CPU can read stale data after peripheral updates.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Yes
Conflict Minerals
Compliant

RoHS compliant per Microchip product page. AEC-Q100 automotive qualification is not applicable to this industrial-grade part; refer to the automotive-grade SAMS70V7X family for AEC-Q100 qualified variants.

Data verified on: 2026-09-22 β€” data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Microchip Technology ATSAME70Q21B-CN ATSAME70Q21B-CNT ATSAME70Q21A-CN ATSAME70Q21A-CNT ATSAME70Q19A-CN ATSAME70N21B-CN ATSAME70N21A-CN ARM Cortex-M7 FPU DSP extensions LFBGA-144 USB High-Speed CAN-FD 10/100 Ethernet MAC IEEE 1588 PTP RoHS AEC-Q100 Atmel-44002E IEC 61508 industrial motor control solar inverter automotive gateway 144-ball LFBGA tightly-coupled memory (TCM)
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