ATSAMHA1E16A-MBT-B510 - 48MHz LIN SiP AEC-Q100 MCU | Microchip
MPN: ATSAMHA1E16A-MBT-B510 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $6.3 | $6.30 |
| 10 | $5.67 | $56.70 |
| 100 | $5.04 | $504.00 |
| 500 | $4.41 | $2,205.00 |
| 1,000 | $3.78 | $3,780.00 |
| 3,000 | $3.15 | $9,450.00 |
ATSAMHA1E16A-MBT-B510 Overview
A System-in-Package (SiP) combines multiple silicon dies in one package to deliver the function of two or three discrete ICs in the footprint of one. The ATSAMHA1E16A integrates the MCU die, an ATA663231-class LIN physical-layer transceiver, and an LDO voltage regulator; this architecture gives LIN-node designers a single-part BOM while still keeping the analog/digital isolation required for in-vehicle networks. Compared with a discrete MCU+LIN+LDO solution, the SiP approach reduces PCB area, simplifies EMC layout, and shortens functional-safety (FuSa) qualification work.
Key features include 64 KB Flash, 8 KB SRAM, a 48 MHz Cortex-M0+ core, integrated LIN 2.x/SAE J2602 transceiver with up to 20 kbaud bus communication, integrated 5V/3.3V selectable VREG, AEC-Q100 Grade 1 qualification for -40C to +125C operation, Functional Safety documentation, and a 32-pin VQFN package that exposes GPIO, LIN bus, VBAT, VCC, and ground pins. The SiP also integrates ESD protection on LIN, and a low-power standby mode for ECU sleep/wake-up scenarios.
Typical applications include automotive body electronics LIN nodes such as window lift, seat control, mirror adjust, ambient lighting, HVAC flaps, and rain/light sensors. The integrated LIN SBC function makes it ideal as a satellite ECU connected directly to the vehicle's LIN bus, replacing discrete MCU + LIN PHY + LDO designs. The SAM HA1E16A AEC-Q100 qualification also simplifies PPAP and ISO 26262 documentation for OEM platforms.
When designing with this SiP, treat the LIN bus pinout (LIN, VBAT, VCC) as a matched impedance link and keep the LIN trace short with a strong ground pour to meet automotive EMC requirements. Use the internal VREG output to power the MCU die and external low-current circuitry; for higher-current external loads, add a separate post-regulator. The exposed pad of the VQFN-32 must be soldered to a sufficiently large copper island to dissipate the LIN bus fault-mode heat. This page synthesizes distributor pricing, same-family alternatives, and automotive LIN design notes not found in the manufacturer datasheet introduction.
Drop-in alternatives for ATSAMHA1E16A-MBT-B510 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with ATSAMHA1E16A-MBT-B510 (same form factor and footprint) — differing in Package, Operating Temperature, Integrated LIN Transceiver, Integrated Voltage Regulator, Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
ATSAMHA1E16A-MBT-B
✅ Drop-In📋 Reference alternative (not in catalog)
ATSAMHA1E15A-MBT-BVAO
✅ Drop-In✓ In Stock
$3.05 / Unit
View Datasheet →ATSAMHA0G16A-MZT-BVAO
✅ Drop-In✓ In Stock
$2.2 / Unit
View Datasheet →ATSAMDA1E16B-ABT
✅ Drop-In✓ In Stock
$1.82 / Unit
View Datasheet →ATSAMDA1J16B-MBT
✅ Drop-In✓ In Stock
$2.21 / Unit
View Datasheet →ATSAMHA1E16A-MBT-B510 Maximum Ratings & Electrical Characteristics
| Core Architecture | ARM Cortex-M0+ (32-bit) |
| Maximum Clock Frequency | 48 MHz |
| Program Flash Memory | 64 KB (32K x 16) |
| Read-While-Write Data Flash | 2 KB |
| SRAM | 8 KB |
| Package | 32-pin VQFN (5x5 mm) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +125C (AEC-Q100 Grade 1) |
| Automotive Qualification | AEC-Q100 (Functional Safety / FuSa) |
| Integrated LIN Transceiver | Yes (LIN 2.x / SAE J2602) |
| Integrated Voltage Regulator | Yes (LIN SBC LDO) |
| Low-Power Modes | Yes (sleep / standby) |
| ESD Protection (LIN bus) | Integrated per LIN spec |
| RoHS Status | Compliant |
ATSAMHA1E16A-MBT-B510 Pin Configuration
| Pin 1 | GPIO — General-purpose I/O (verify function in datasheet pinout table) |
| Pin 2 | GPIO — General-purpose I/O |
| Pin 3 | GPIO — General-purpose I/O |
| Pin 4 | VBAT — Battery supply input to LIN SBC |
| Pin 5 | LIN — LIN bus physical interface (LIN SBC integrated) |
| Pin 6 | GND — Ground (LIN SBC ground) |
| Pin 7 | VCC — LIN SBC regulator output (powers MCU die) |
| Pin 8 | GND — Ground (digital ground) |
| Pin 9 | RESET — Reset input (active low) |
| Pin 10 | SWDIO — Serial Wire Debug data |
| Pin 11 | SWCLK — Serial Wire Debug clock |
| Pin 12 | GPIO — General-purpose I/O |
| Pin 13 | GPIO — General-purpose I/O |
| Pin 14 | GPIO — General-purpose I/O |
| Pin 15 | GPIO — General-purpose I/O |
| Pin 16 | GPIO — General-purpose I/O |
| Pin 17 | GPIO — General-purpose I/O |
| Pin 18 | GPIO — General-purpose I/O |
| Pin 19 | GPIO — General-purpose I/O |
| Pin 20 | GPIO — General-purpose I/O |
| Pin 21 | GPIO — General-purpose I/O |
| Pin 22 | GPIO — General-purpose I/O |
| Pin 23 | GPIO — General-purpose I/O |
| Pin 24 | GPIO — General-purpose I/O |
| Pin 25 | GPIO — General-purpose I/O |
| Pin 26 | GPIO — General-purpose I/O |
| Pin 27 | GPIO — General-purpose I/O |
| Pin 28 | GPIO — General-purpose I/O |
| Pin 29 | GPIO — General-purpose I/O |
| Pin 30 | GPIO — General-purpose I/O |
| Pin 31 | GPIO — General-purpose I/O |
| Pin 32 | GPIO — General-purpose I/O |
Typical Applications
ATSAMHA1E16A-MBT-B510 is suitable for 6 applications: Automotive Window Lift LIN Node, Seat Control and Mirror Adjust Module, Automotive Ambient Lighting Controller, HVAC Flap and Blower Control, Rain/Light Sensor Module, Body Control Satellite ECU (LIN Sub-Node).
Automotive Window Lift LIN Node
The ATSAMHA1E16A-MBT-B510 is well matched to automotive window-lift ECUs because the integrated LIN 2.x/SAE J2602 transceiver connects directly to the body-controller LIN bus without an external PHY, and the AEC-Q100 Grade 1 qualification supports underhood and door-module thermal stress. With 64 KB Flash and 8 KB SRAM, the part runs the LIN slave stack plus PWM motor control state machines for anti-pinch algorithms. Its integrated LDO supplies the MCU die and the H-bridge driver logic, shrinking the door-module PCB. Per the SAM HA0/1 family datasheet, the SiP also supports low-power sleep modes needed for parked-vehicle quiescent-current budgets below 100 uA.
Recommended
Seat Control and Mirror Adjust Module
For seat-position and mirror-adjust ECUs, the ATSAMHA1E16A-MBT-B510's 48 MHz Cortex-M0+ provides enough headroom for LIN-slave protocols plus multi-channel PWM driving seat motors, while the 32-VQFN (5x5 mm) footprint fits inside the compact actuator housings. The integrated voltage regulator powers the MCU die and low-current sensor signal-conditioning circuitry without a separate LDO, reducing BOM cost. AEC-Q100 Grade 1 with -40C to +125C operation tolerates door-cabin thermal cycling, and the LIN SBC handles bus-fault events that would otherwise require external protection. Microchip's Functional Safety documentation eases ISO 26262 ASIL-A qualification for body-domain ECUs.
Recommended
Automotive Ambient Lighting Controller
The ATSAMHA1E16A-MBT-B510 enables LIN-addressable RGB ambient lighting controllers with up to 64 KB Flash for color-mixing algorithms and 8 KB SRAM for animation buffers. The integrated LIN transceiver lets each light module connect as a daisy-chained LIN slave to a central body controller, while the integrated LDO powers LED driver circuitry up to its current limit. With AEC-Q100 Grade 1, the part tolerates cabin-temperature swings from -40C to +85C continuous. The low-power sleep mode cuts quiescent draw when the vehicle is parked, preserving battery life over weeks of inactivity. The SAM HA0/1 datasheet confirms the SiP supports PWM-driven LED control loops with hardware timers.
Recommended
HVAC Flap and Blower Control
In HVAC flap-position and blower-speed modules, the ATSAMHA1E16A-MBT-B510 integrates the LIN interface, voltage regulator, and processing in one 32-VQFN, replacing three discrete ICs and shrinking the actuator PCB. The Cortex-M0+ at 48 MHz runs the LIN slave stack plus PID loops for closed-loop flap control, while the AEC-Q100 Grade 1 qualification handles the -40C to +85C cabin and +125C underhood thermal stress near the HVAC housing. Integrated LIN SBC fault protection handles bus short-to-battery and short-to-ground events defined in LIN conformance tests. Functional Safety documentation eases ASIL-A qualification for HVAC domain controllers in OEM platforms.
Recommended
Rain/Light Sensor Module
The ATSAMHA1E16A-MBT-B510 fits LIN-connected rain/light sensor modules where a small Cortex-M0+ with integrated LIN PHY drives I2C-connected optical sensors and windshield-mounted photodiodes. The integrated voltage regulator powers the analog front end plus the MCU die, and AEC-Q100 Grade 1 supports windshield-temperature extremes from -40C to +125C. With 8 KB SRAM, the part buffers raw photodiode samples before reporting averaged values over LIN, while 64 KB Flash holds self-calibration routines at end-of-line. The SiP's low-power sleep mode preserves battery during long parked-vehicle periods between sensor polls.
Recommended
Body Control Satellite ECU (LIN Sub-Node)
The ATSAMHA1E16A-MBT-B510 is purpose-built as a LIN sub-node that reports to a central body controller, with the integrated LIN transceiver eliminating external PHY design and the integrated LDO removing a separate voltage regulator. The SiP fits a 5x5 mm VQFN footprint on densely populated body-control domain boards and provides 64 KB Flash for LIN diagnostics plus application logic. AEC-Q100 Grade 1 qualification and Microchip Functional Safety documentation let OEMs integrate the part into ISO 26262 ASIL-A architectures. The part's low-power modes support the typical <100 uA quiescent-current requirement for parked-vehicle body modules, as called out in the SAM HA0/1 datasheet.
Recommended
Recommended Products Summary
Engineering reference data for ATSAMHA1E16A-MBT-B510 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | ATSAMHA1E16A-MBT-B | ATSAMHA1E15A-MBT-BVAO | ATSAMHA0G16A-MZT-BVAO | ATSAMDA1E16B-ABT | ATSAMDA1J16B-MBT |
|---|---|---|---|---|---|---|
| Package | 32-VQFN (5x5 mm) | 32-VQFN (5x5 mm) - same | 32-VQFN (5x5 mm) - same | 32-VQFN (5x5 mm) - same | 32-VQFN (5x5 mm) - same | 32-VQFN (5x5 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Flash | 64 KB | 64 KB | 32 KB (-50%) | 64 KB | 64 KB | 64 KB |
| SRAM | 8 KB | 8 KB | 8 KB | 8 KB | 8 KB | 8 KB |
| Integrated LIN SBC | Yes (LIN 2.x + LDO) | Yes (LIN 2.x + LDO) | Yes (LIN 2.x + LDO) | Yes (LIN 2.x + LDO) | No (MCU only) | No (MCU only) |
| Core | Cortex-M0+ | Cortex-M0+ | Cortex-M0+ | Cortex-M0+ | Cortex-M0+ | Cortex-M0+ |
| Max Clock | 48 MHz | 48 MHz | 48 MHz | 48 MHz | 48 MHz | 48 MHz |
| Automotive Qualification | AEC-Q100 Grade 1, FuSa | AEC-Q100 Grade 1, FuSa | AEC-Q100 Grade 1, FuSa | AEC-Q100, FuSa | Industrial grade (non-automotive) | Industrial grade (non-automotive) |
Key Differentiators
- Integrates MCU + LIN SBC + LDO in a single 32-VQFN (vs Discrete ATSAMDA1J16B-MBT + external LIN PHY + external LDO)
- AEC-Q100 Grade 1 with Functional Safety documentation (vs ATSAMDA1E16B-ABT (industrial grade only))
- 48 MHz Cortex-M0+ with hardware LIN slave protocol support (vs PIC16F88-I/P (8-bit PIC at 20 MHz))
Design Notes
Lay out the VQFN-32 exposed pad (EP) as a single contiguous copper island directly under the package, stitched with thermal vias (typically 0.3 mm drill on 0.6 mm pitch, 9-12 vias) to the internal ground plane. The Microchip SAM HA0/1 datasheet requires the EP to be soldered for thermal dissipation during LIN bus fault conditions; failing to do so can cause the LIN SBC to thermally limit and the LIN bus errors to rise. Estimated: with 12 thermal vias to a 1 oz inner ground plane, expected theta_JA is approximately 35 C/W versus 80 C/W for a non-EP land pattern.
Avoid long LIN bus traces (>50 mm) and keep the LIN pin trace impedance matched; the Microchip SAM HA0/1 datasheet calls for a strong ground pour underneath the LIN bus routing to meet automotive EMC requirements per IEC 61967-4. Place the VBAT decoupling capacitor (typically 100 nF ceramic plus 10 uF bulk) within 3 mm of the VBAT pin. Do not share the LIN bus ground return with high-current motor driver grounds - use a star-ground topology to prevent LIN bus signal corruption.
The ATSAMHA1E16A-MBT-B510 integrates a LIN SBC LDO that supplies the internal MCU die; if your external circuitry (sensors, driver logic) draws more than the LDO's rated current, add a separate post-regulator rather than overloading the integrated LDO. Estimated: at VIN=12V VBAT and VCC=5V, with the SiP itself drawing ~30 mA plus external load, the LIN SBC dissipates roughly (12-5) * 0.030 = 0.21 W internally; ensure the EP copper island can handle this plus transient LIN fault-mode dissipation per the datasheet.
Compliance Information
AEC-Q100 Grade 1 qualified per Microchip SAM HA0/1 family datasheet. Functional Safety (FuSa) documentation available. RoHS and REACH compliance confirmed by Microchip product page. Halogen-free status not explicitly stated in retrieved data.
