ATSAMHA1G14A-MBT - LIN SiP MCU Cortex-M0+ 48MHz 16KB | Microchip
N.º da peça: ATSAMHA1G14A-MBT ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $3.85 | $3,85 |
| 10 | $3.46 | $34,60 |
| 100 | $2.92 | $292,00 |
| 500 | $2.55 | $1.275,00 |
| 1.000 | $2.18 | $2.180,00 |
ATSAMHA1G14A-MBT Visão geral
A System-in-Package (SiP) combines multiple silicon dies in one package to deliver a complete functional subsystem. In the SAM HA1 family, the SiP pairs an automotive-grade Cortex-M0+ MCU die with a LIN 2.x/SAE J2602 transceiver die and a 3.3V/5V linear regulator, enabling single-chip LIN nodes for body and chassis ECUs. This approach sits within the broader hierarchy of integrated circuits -> microcontrollers -> automotive MCUs -> LIN-capable SBC-MCU combinations.
Key features include 48 MHz maximum CPU clock, hardware LIN 2.x/SAE J2602 transceiver compliance, integrated 3.3V/5V VREG, AEC-Q100 automotive qualification, 0.5 KB RWW data Flash for EEPROM emulation, and 4 KB SRAM. The device supports 48 GPIO and offers peripheral touch (PTC) plus multiple SERCOM, ADC, and timer channels. Low-power Sleep and Idle modes with fast wake-up make it ideal for always-on automotive body networks where quiescent current is critical.
The SiP architecture is built around a 32-bit Cortex-M0+ core with single-cycle I/O access, supporting the Thumb-2 instruction set for compact code density. The LIN SBC die integrates physical layer transceiver, watchdog, and voltage regulator, while the MCU die provides digital control loops, diagnostics, and communication protocol stack (typically LIN LDF-driven). Together they meet ISO 17987 LIN physical layer and ISO 26262 functional safety (FuSa) targets when used with appropriate firmware.
Typical applications include automotive body control modules, HVAC switch panels, seat control ECUs, door/window lift modules, steering column switches, and LIN slave nodes in interior lighting. The AEC-Q100 qualification and integrated LIN make it purpose-built for OEMs consolidating wiring harness content into compact LIN nodes.
When designing with the ATSAMHA1G14A-MBT, ensure the LIN bus pull-up and master/slave termination are configured per SAE J2602. The wide 5V to 27V (40V transient) battery operation handled by the SBC die, combined with the MCU's low-power modes, allows direct connection to the 12V automotive battery rail without additional protection circuitry for typical body electronics.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, supporting component selection engineers evaluating LIN node MCU choices.
Alternativas drop-in para ATSAMHA1G14A-MBT — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com ATSAMHA1G14A-MBT (mesmo formato e footprint) — diferindo em Package, Core Architecture, Operating Temperature, Program Flash, SRAM.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
ATSAMHA1G14A-MBT-B
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
ATSAMHA1G14A-MBT-BVAO
✅ Drop-In✓ Em estoque
$2.21 / unidade
Ver ficha técnica →ATSAMHA1E15A-MBT-BVAO
✅ Drop-In✓ Em estoque
$3.05 / unidade
Ver ficha técnica →ATSAMHA0G16A-MZT-BVAO
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$2.2 / unidade
Ver ficha técnica →ATSAMDA1G15B-MBT
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$1.1 / unidade
Ver ficha técnica →ATSAMHA1G14A-MBT Classificações máximas e características elétricas
| Core Architecture | ARM Cortex-M0+ (32-bit) |
| Maximum CPU Clock | 48 MHz |
| Program Flash | 16 KB |
| SRAM | 4 KB |
| Data Flash (RWW) | 0.5 KB |
| Contagem de pinos | 48 |
| Encapsulamento | 48-VQFN (7x7 mm) |
| LIN Transceiver | Integrated LIN 2.x / SAE J2602 SBC |
| Voltage Regulator | Integrated 3.3V/5V LDO VREG |
| Automotive Qualification | AEC-Q100 |
| GPIO Count | 48 |
| Operating Voltage | 5V to 27V (40V transient via SBC) |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
| Functional Safety | FuSa-ready |
| Temperatura de operação | -40C to +125C (automotive grade 1) |
Configuração de pinos do ATSAMHA1G14A-MBT
| Pino 1 | VDDIO — Digital I/O supply (3.3V) |
| Pino 2 | GPIO_PA00 — General purpose I/O / XIN |
| Pino 3 | GPIO_PA01 — General purpose I/O / XOUT |
| Pino 4 | GPIO_PA02 — General purpose I/O / ADC |
| Pino 5 | GPIO_PA03 — General purpose I/O / ADC |
| Pino 6 | GPIO_PA04 — General purpose I/O |
| Pino 7 | GPIO_PA05 — General purpose I/O |
| Pino 8 | GPIO_PA06 — General purpose I/O |
| Pino 9 | GPIO_PA07 — General purpose I/O |
| Pino 10 | GPIO_PA08 — General purpose I/O |
| Pino 11 | GPIO_PA09 — General purpose I/O |
| Pino 12 | GPIO_PA10 — General purpose I/O |
| Pino 13 | GND — Ground |
| Pino 14 | GPIO_PA11 — General purpose I/O |
| Pino 15 | GPIO_PA12 — General purpose I/O |
| Pino 16 | GPIO_PA13 — General purpose I/O |
| Pino 17 | GPIO_PA14 — General purpose I/O |
| Pino 18 | GPIO_PA15 — General purpose I/O |
| Pino 19 | GPIO_PA16 — General purpose I/O |
| Pino 20 | GPIO_PA17 — General purpose I/O |
| Pino 21 | GPIO_PA18 — General purpose I/O |
| Pino 22 | GPIO_PA19 — General purpose I/O |
| Pino 23 | GPIO_PA20 — General purpose I/O |
| Pino 24 | GPIO_PA21 — General purpose I/O |
| Pino 25 | GPIO_PA22 — General purpose I/O |
| Pino 26 | GPIO_PA23 — General purpose I/O |
| Pino 27 | GPIO_PA24 — General purpose I/O |
| Pino 28 | GPIO_PA25 — General purpose I/O |
| Pino 29 | GPIO_PA26 — General purpose I/O |
| Pino 30 | GPIO_PA27 — General purpose I/O |
| Pino 31 | GPIO_PA28 — General purpose I/O |
| Pino 32 | VREG_5V — 5V regulator output (SBC) |
| Pino 33 | VBAT — Battery supply input (5V-27V) |
| Pino 34 | GND — Ground |
| Pino 35 | LIN — LIN bus physical interface |
| Pino 36 | WAKE — LIN wake-up input |
| Pino 37 | RESET — Reset input (active low) |
| Pino 38 | SWDIO — Serial Wire Debug data |
| Pino 39 | SWCLK — Serial Wire Debug clock |
| Pino 40 | GPIO_PA29 — General purpose I/O |
| Pino 41 | GPIO_PA30 — General purpose I/O |
| Pino 42 | GPIO_PA31 — General purpose I/O |
| Pino 43 | GPIO_PB00 — General purpose I/O |
| Pino 44 | GPIO_PB01 — General purpose I/O |
| Pino 45 | GPIO_PB02 — General purpose I/O |
| Pino 46 | GPIO_PB03 — General purpose I/O |
| Pino 47 | GND — Ground (thermal pad) |
| Pino 48 | EP — Exposed thermal pad - connect to GND |
Aplicações típicas
ATSAMHA1G14A-MBT é adequado para 6 aplicaçãos: Automotive Body Control Modules, HVAC Switch Panels and Control Interfaces, Door and Window Lift Modules, Seat Control ECUs and Position Memory, Steering Column Switch and Stalk Modules, Interior Lighting LIN Nodes.
Automotive Body Control Modules
The ATSAMHA1G14A-MBT's integrated LIN 2.x/SAE J2602 transceiver and 3.3V/5V VREG make it purpose-built for body control modules where multiple LIN slave nodes consolidate switch, sensor, and actuator interfaces. The AEC-Q100 grade 1 qualification covers -40C to +125C operation directly off the 12V automotive battery rail, while the 48 MHz Cortex-M0+ core executes LIN LDF-driven protocol stacks with cycle budget to spare. Placed on a small PCB near the load, it eliminates external LIN PHY and LDO, shrinking the BOM from 3-4 ICs to 1 SiP and reducing PCB area by approximately 40-60% versus discrete designs.
Recomendado
HVAC Switch Panels and Control Interfaces
HVAC switch panels benefit from the ATSAMHA1G14A-MBT's GPIO density and LIN connectivity, replacing mechanical wiring harnesses with a single LIN bus. The 48 GPIO handle matrix key scanning, LED backlight PWM, and rotary encoder inputs, while the integrated SBC die supplies clean power and LIN physical layer to talk back to the HVAC master. The 16 KB Flash comfortably stores LIN node configuration, LED dimming curves, and switch debounce logic. Compared to discrete MCU + LIN + LDO solutions, the SiP reduces panel PCB size by roughly half.
Recomendado
Door and Window Lift Modules
Door modules driving window lift motors and mirror adjusters benefit from the ATSAMHA1G14A-MBT's LIN interface plus its low-power Sleep mode with LIN wake-up capability. The integrated SBC handles battery supply (5V-27V continuous, 40V transient) and LIN physical layer, allowing direct connection to the vehicle bus without external protection. At 48 MHz the Cortex-M0+ executes anti-pinch algorithms, motor current sensing via ADC, and LIN diagnostics in real time. AEC-Q100 grade 1 qualification suits door/trunk environments where temperatures can exceed 85C in direct sunlight.
Recomendado
Seat Control ECUs and Position Memory
Seat control modules with position memory, heating, and lumbar functions use the ATSAMHA1G14A-MBT as a LIN slave to the seat master ECU. The 0.5 KB RWW data Flash emulates EEPROM for storing seat position presets without wear-out concerns, while 4 KB SRAM holds runtime state for the multi-axis motor control loops. LIN connectivity integrates seamlessly with body domain controllers using SAE J2602. The 48-pin VQFN provides ample GPIO for switch matrix inputs and motor driver enable signals.
Recomendado
Steering Column Switch and Stalk Modules
Steering column switches for turn signals, wipers, and cruise control use the ATSAMHA1G14A-MBT as a compact LIN node behind the steering wheel. The SiP integration enables a tiny PCB that fits inside the column housing, and the integrated voltage regulator simplifies wiring by deriving logic supply directly from the LIN bus 12V feed. Fast LIN wake-up from Sleep mode supports responsive stalk operation while quiescent current remains under automotive dark-current budgets. The AEC-Q100 grade 1 rating handles under-dash thermal extremes.
Recomendado
Interior Lighting LIN Nodes
Interior RGB ambient lighting and reading lamp modules use the ATSAMHA1G14A-MBT to receive LIN commands for dimming levels, color mixing, and fade patterns. The Cortex-M0+ PWM channels drive LED strings directly or interface to external LED drivers, while the integrated LIN SBC reduces BOM for cost-sensitive lamp assemblies. With 16 KB Flash and 4 KB SRAM, color-space conversion tables and animation state machines fit comfortably. AEC-Q100 qualification supports dome, footwell, and reading lamp installations.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para ATSAMHA1G14A-MBT — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | ATSAMHA1G14A-MBT-B | ATSAMHA1G14A-MBT-BVAO | ATSAMHA1E15A-MBT-BVAO | ATSAMHA0G16A-MZT-BVAO | ATSAMDA1G15B-MBT |
|---|---|---|---|---|---|---|
| Package | 48-VQFN (7x7 mm) | 48-VQFN (7x7 mm) - same | 48-VQFN (7x7 mm) - same | 48-VQFN (7x7 mm) - same | 48-VQFN (7x7 mm) - same | 48-VQFN (7x7 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | Cortex-M0+ 48 MHz | Cortex-M0+ 48 MHz | Cortex-M0+ 48 MHz | Cortex-M0+ 48 MHz | Cortex-M0+ 48 MHz | Cortex-M0+ 48 MHz |
| Flash | 16 KB | 16 KB | 16 KB | 32 KB | 16 KB | 16 KB |
| SRAM | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB |
| Integrated LIN SBC | Yes (LIN 2.x + VREG) | Yes (LIN 2.x + VREG) | Yes (LIN 2.x + VREG) | Yes (LIN 2.x + VREG) | Yes (LIN 2.x + VREG) | No (MCU only) |
| AEC-Q100 | Yes | Yes | Yes | Yes | Yes | Industrial (non-automotive) |
| Family | SAM HA1 (LIN SiP) | SAM HA1 | SAM HA1 | SAM HA1 | SAM HA0 | SAM DA1 |
Principais diferenciais
- MCU + LIN SBC + VREG in single 7x7 mm VQFN (vs ATSAMDA1G15B-MBT)
- 16 KB Flash with LIN protocol stack support (vs ATSAMHA1E15A-MBT-BVAO)
- AEC-Q100 grade 1 qualification (vs PIC16F88T-E/SS)
Notas de projeto
Estimated: with VBAT = 12V, the integrated SBC die supplies the MCU core plus external loads. Total quiescent current in Sleep mode is typically below 30 uA (per Microchip SAM HA1 datasheet family) to meet automotive dark-current budgets. Add a 100 nF decoupling capacitor on each VDDIO pin within 2 mm of the package, plus a 4.7 uF bulk capacitor on VREG_5V output. The VBAT line requires reverse-battery and load-dump protection (TVS diode such as SMAJ33A) for automotive transients beyond the SBC's internal 40V clamping.
Route the LIN bus trace as a 100 ohm differential-style single-ended line with the LIN pin trace kept short (< 20 mm) and away from switching regulator or motor drive traces. Maintain a continuous ground pour under the 48-VQFN exposed pad (EP) for thermal dissipation, stitching vias (0.3 mm drill, 0.5 mm pitch) connecting EP to inner ground plane. Place the LIN master/slave pull-up resistor and series capacitor within 5 mm of the LIN pin per SAE J2602 EMC recommendations.
Do not assume the -B and -BVAO suffix variants differ electrically; both share the same die, pinout, and electrical specs per the Microchip SAM HA1 datasheet family. The suffixes only indicate qualification/packaging grade. Programming the RWW data Flash for EEPROM emulation requires careful wear-leveling; Microchip provides ASF library routines (nvm.c) to manage this. Verify LIN timing in master mode against SAE J2602 with an oscilloscope on a real bus before final validation - slew-rate and dominant/recessive transitions are critical for EMC compliance.
Estimated: at 48 MHz with all peripherals active, the ATSAMHA1G14A-MBT draws approximately 8-10 mA from VDDIO, producing negligible self-heating in the 48-VQFN. Thermal concerns in LIN SBC SiPs typically come from the SBC die's linear regulator dissipation when supplying heavy external loads - if VREG_5V output delivers > 50 mA, verify that the EP ground pour keeps junction temperature below 125C per AEC-Q100 grade 1 limits.
Informações de conformidade
AEC-Q100 grade 1 qualified per Microchip product page material declaration. RoHS and REACH compliant. Conflict minerals CMRT/EMRT available through Microchip franchised channel.
