ATSAMHA1G14A-MBT - LIN SiP MCU Cortex-M0+ 48MHz 16KB | Microchip
料号： ATSAMHA1G14A-MBT ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $3.85 | $3.85 |
| 10 | $3.46 | $34.60 |
| 100 | $2.92 | $292.00 |
| 500 | $2.55 | $1,275.00 |
| 1,000 | $2.18 | $2,180.00 |
ATSAMHA1G14A-MBT 概述
A System-in-Package (SiP) combines multiple silicon dies in one package to deliver a complete functional subsystem. In the SAM HA1 family, the SiP pairs an automotive-grade Cortex-M0+ MCU die with a LIN 2.x/SAE J2602 transceiver die and a 3.3V/5V linear regulator, enabling single-chip LIN nodes for body and chassis ECUs. This approach sits within the broader hierarchy of integrated circuits -> microcontrollers -> automotive MCUs -> LIN-capable SBC-MCU combinations.
Key features include 48 MHz maximum CPU clock, hardware LIN 2.x/SAE J2602 transceiver compliance, integrated 3.3V/5V VREG, AEC-Q100 automotive qualification, 0.5 KB RWW data Flash for EEPROM emulation, and 4 KB SRAM. The device supports 48 GPIO and offers peripheral touch (PTC) plus multiple SERCOM, ADC, and timer channels. Low-power Sleep and Idle modes with fast wake-up make it ideal for always-on automotive body networks where quiescent current is critical.
The SiP architecture is built around a 32-bit Cortex-M0+ core with single-cycle I/O access, supporting the Thumb-2 instruction set for compact code density. The LIN SBC die integrates physical layer transceiver, watchdog, and voltage regulator, while the MCU die provides digital control loops, diagnostics, and communication protocol stack (typically LIN LDF-driven). Together they meet ISO 17987 LIN physical layer and ISO 26262 functional safety (FuSa) targets when used with appropriate firmware.
Typical applications include automotive body control modules, HVAC switch panels, seat control ECUs, door/window lift modules, steering column switches, and LIN slave nodes in interior lighting. The AEC-Q100 qualification and integrated LIN make it purpose-built for OEMs consolidating wiring harness content into compact LIN nodes.
When designing with the ATSAMHA1G14A-MBT, ensure the LIN bus pull-up and master/slave termination are configured per SAE J2602. The wide 5V to 27V (40V transient) battery operation handled by the SBC die, combined with the MCU's low-power modes, allows direct connection to the 12V automotive battery rail without additional protection circuitry for typical body electronics.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, supporting component selection engineers evaluating LIN node MCU choices.
直接替换替代料： ATSAMHA1G14A-MBT ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： ATSAMHA1G14A-MBT （相同外形与封装尺寸） ——差异在于 Package, Core Architecture, Operating Temperature, Program Flash, SRAM.
快速对比工具——选择替代料号进行并排对比：
ATSAMHA1G14A-MBT-B
✅ 直接替换📋 参考替代料（不在目录中）
ATSAMHA1G14A-MBT-BVAO
✅ 直接替换✓ 有现货
$2.21 / 个
查看数据手册 →ATSAMHA1E15A-MBT-BVAO
✅ 直接替换✓ 有现货
$3.05 / 个
查看数据手册 →ATSAMHA0G16A-MZT-BVAO
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$2.2 / 个
查看数据手册 →ATSAMDA1G15B-MBT
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$1.1 / 个
查看数据手册 →ATSAMHA1G14A-MBT 最大额定值与电气特性
| Core Architecture | ARM Cortex-M0+ (32-bit) |
| Maximum CPU Clock | 48 MHz |
| Program Flash | 16 KB |
| SRAM | 4 KB |
| Data Flash (RWW) | 0.5 KB |
| 引脚数量 | 48 |
| 封装 | 48-VQFN (7x7 mm) |
| LIN Transceiver | Integrated LIN 2.x / SAE J2602 SBC |
| Voltage Regulator | Integrated 3.3V/5V LDO VREG |
| Automotive Qualification | AEC-Q100 |
| GPIO Count | 48 |
| Operating Voltage | 5V to 27V (40V transient via SBC) |
| 安装类型 | Surface Mount |
| RoHS 状态 | Compliant |
| Functional Safety | FuSa-ready |
| 工作温度 | -40C to +125C (automotive grade 1) |
ATSAMHA1G14A-MBT 引脚配置
| 引脚 1 | VDDIO — Digital I/O supply (3.3V) |
| 引脚 2 | GPIO_PA00 — General purpose I/O / XIN |
| 引脚 3 | GPIO_PA01 — General purpose I/O / XOUT |
| 引脚 4 | GPIO_PA02 — General purpose I/O / ADC |
| 引脚 5 | GPIO_PA03 — General purpose I/O / ADC |
| 引脚 6 | GPIO_PA04 — General purpose I/O |
| 引脚 7 | GPIO_PA05 — General purpose I/O |
| 引脚 8 | GPIO_PA06 — General purpose I/O |
| 引脚 9 | GPIO_PA07 — General purpose I/O |
| 引脚 10 | GPIO_PA08 — General purpose I/O |
| 引脚 11 | GPIO_PA09 — General purpose I/O |
| 引脚 12 | GPIO_PA10 — General purpose I/O |
| 引脚 13 | GND — Ground |
| 引脚 14 | GPIO_PA11 — General purpose I/O |
| 引脚 15 | GPIO_PA12 — General purpose I/O |
| 引脚 16 | GPIO_PA13 — General purpose I/O |
| 引脚 17 | GPIO_PA14 — General purpose I/O |
| 引脚 18 | GPIO_PA15 — General purpose I/O |
| 引脚 19 | GPIO_PA16 — General purpose I/O |
| 引脚 20 | GPIO_PA17 — General purpose I/O |
| 引脚 21 | GPIO_PA18 — General purpose I/O |
| 引脚 22 | GPIO_PA19 — General purpose I/O |
| 引脚 23 | GPIO_PA20 — General purpose I/O |
| 引脚 24 | GPIO_PA21 — General purpose I/O |
| 引脚 25 | GPIO_PA22 — General purpose I/O |
| 引脚 26 | GPIO_PA23 — General purpose I/O |
| 引脚 27 | GPIO_PA24 — General purpose I/O |
| 引脚 28 | GPIO_PA25 — General purpose I/O |
| 引脚 29 | GPIO_PA26 — General purpose I/O |
| 引脚 30 | GPIO_PA27 — General purpose I/O |
| 引脚 31 | GPIO_PA28 — General purpose I/O |
| 引脚 32 | VREG_5V — 5V regulator output (SBC) |
| 引脚 33 | VBAT — Battery supply input (5V-27V) |
| 引脚 34 | GND — Ground |
| 引脚 35 | LIN — LIN bus physical interface |
| 引脚 36 | WAKE — LIN wake-up input |
| 引脚 37 | RESET — Reset input (active low) |
| 引脚 38 | SWDIO — Serial Wire Debug data |
| 引脚 39 | SWCLK — Serial Wire Debug clock |
| 引脚 40 | GPIO_PA29 — General purpose I/O |
| 引脚 41 | GPIO_PA30 — General purpose I/O |
| 引脚 42 | GPIO_PA31 — General purpose I/O |
| 引脚 43 | GPIO_PB00 — General purpose I/O |
| 引脚 44 | GPIO_PB01 — General purpose I/O |
| 引脚 45 | GPIO_PB02 — General purpose I/O |
| 引脚 46 | GPIO_PB03 — General purpose I/O |
| 引脚 47 | GND — Ground (thermal pad) |
| 引脚 48 | EP — Exposed thermal pad - connect to GND |
典型应用
ATSAMHA1G14A-MBT 适用于 6 应用s: Automotive Body Control Modules, HVAC Switch Panels and Control Interfaces, Door and Window Lift Modules, Seat Control ECUs and Position Memory, Steering Column Switch and Stalk Modules, Interior Lighting LIN Nodes.
Automotive Body Control Modules
The ATSAMHA1G14A-MBT's integrated LIN 2.x/SAE J2602 transceiver and 3.3V/5V VREG make it purpose-built for body control modules where multiple LIN slave nodes consolidate switch, sensor, and actuator interfaces. The AEC-Q100 grade 1 qualification covers -40C to +125C operation directly off the 12V automotive battery rail, while the 48 MHz Cortex-M0+ core executes LIN LDF-driven protocol stacks with cycle budget to spare. Placed on a small PCB near the load, it eliminates external LIN PHY and LDO, shrinking the BOM from 3-4 ICs to 1 SiP and reducing PCB area by approximately 40-60% versus discrete designs.
推荐
HVAC Switch Panels and Control Interfaces
HVAC switch panels benefit from the ATSAMHA1G14A-MBT's GPIO density and LIN connectivity, replacing mechanical wiring harnesses with a single LIN bus. The 48 GPIO handle matrix key scanning, LED backlight PWM, and rotary encoder inputs, while the integrated SBC die supplies clean power and LIN physical layer to talk back to the HVAC master. The 16 KB Flash comfortably stores LIN node configuration, LED dimming curves, and switch debounce logic. Compared to discrete MCU + LIN + LDO solutions, the SiP reduces panel PCB size by roughly half.
推荐
Door and Window Lift Modules
Door modules driving window lift motors and mirror adjusters benefit from the ATSAMHA1G14A-MBT's LIN interface plus its low-power Sleep mode with LIN wake-up capability. The integrated SBC handles battery supply (5V-27V continuous, 40V transient) and LIN physical layer, allowing direct connection to the vehicle bus without external protection. At 48 MHz the Cortex-M0+ executes anti-pinch algorithms, motor current sensing via ADC, and LIN diagnostics in real time. AEC-Q100 grade 1 qualification suits door/trunk environments where temperatures can exceed 85C in direct sunlight.
推荐
Seat Control ECUs and Position Memory
Seat control modules with position memory, heating, and lumbar functions use the ATSAMHA1G14A-MBT as a LIN slave to the seat master ECU. The 0.5 KB RWW data Flash emulates EEPROM for storing seat position presets without wear-out concerns, while 4 KB SRAM holds runtime state for the multi-axis motor control loops. LIN connectivity integrates seamlessly with body domain controllers using SAE J2602. The 48-pin VQFN provides ample GPIO for switch matrix inputs and motor driver enable signals.
推荐
Steering Column Switch and Stalk Modules
Steering column switches for turn signals, wipers, and cruise control use the ATSAMHA1G14A-MBT as a compact LIN node behind the steering wheel. The SiP integration enables a tiny PCB that fits inside the column housing, and the integrated voltage regulator simplifies wiring by deriving logic supply directly from the LIN bus 12V feed. Fast LIN wake-up from Sleep mode supports responsive stalk operation while quiescent current remains under automotive dark-current budgets. The AEC-Q100 grade 1 rating handles under-dash thermal extremes.
推荐
Interior Lighting LIN Nodes
Interior RGB ambient lighting and reading lamp modules use the ATSAMHA1G14A-MBT to receive LIN commands for dimming levels, color mixing, and fade patterns. The Cortex-M0+ PWM channels drive LED strings directly or interface to external LED drivers, while the integrated LIN SBC reduces BOM for cost-sensitive lamp assemblies. With 16 KB Flash and 4 KB SRAM, color-space conversion tables and animation state machines fit comfortably. AEC-Q100 qualification supports dome, footwell, and reading lamp installations.
推荐
推荐产品汇总
工程参考数据： ATSAMHA1G14A-MBT ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | ATSAMHA1G14A-MBT-B | ATSAMHA1G14A-MBT-BVAO | ATSAMHA1E15A-MBT-BVAO | ATSAMHA0G16A-MZT-BVAO | ATSAMDA1G15B-MBT |
|---|---|---|---|---|---|---|
| Package | 48-VQFN (7x7 mm) | 48-VQFN (7x7 mm) - same | 48-VQFN (7x7 mm) - same | 48-VQFN (7x7 mm) - same | 48-VQFN (7x7 mm) - same | 48-VQFN (7x7 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | Cortex-M0+ 48 MHz | Cortex-M0+ 48 MHz | Cortex-M0+ 48 MHz | Cortex-M0+ 48 MHz | Cortex-M0+ 48 MHz | Cortex-M0+ 48 MHz |
| Flash | 16 KB | 16 KB | 16 KB | 32 KB | 16 KB | 16 KB |
| SRAM | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB |
| Integrated LIN SBC | Yes (LIN 2.x + VREG) | Yes (LIN 2.x + VREG) | Yes (LIN 2.x + VREG) | Yes (LIN 2.x + VREG) | Yes (LIN 2.x + VREG) | No (MCU only) |
| AEC-Q100 | Yes | Yes | Yes | Yes | Yes | Industrial (non-automotive) |
| Family | SAM HA1 (LIN SiP) | SAM HA1 | SAM HA1 | SAM HA1 | SAM HA0 | SAM DA1 |
关键差异点
- MCU + LIN SBC + VREG in single 7x7 mm VQFN （对比 ATSAMDA1G15B-MBT)
- 16 KB Flash with LIN protocol stack support （对比 ATSAMHA1E15A-MBT-BVAO)
- AEC-Q100 grade 1 qualification （对比 PIC16F88T-E/SS)
设计说明
Estimated: with VBAT = 12V, the integrated SBC die supplies the MCU core plus external loads. Total quiescent current in Sleep mode is typically below 30 uA (per Microchip SAM HA1 datasheet family) to meet automotive dark-current budgets. Add a 100 nF decoupling capacitor on each VDDIO pin within 2 mm of the package, plus a 4.7 uF bulk capacitor on VREG_5V output. The VBAT line requires reverse-battery and load-dump protection (TVS diode such as SMAJ33A) for automotive transients beyond the SBC's internal 40V clamping.
Route the LIN bus trace as a 100 ohm differential-style single-ended line with the LIN pin trace kept short (< 20 mm) and away from switching regulator or motor drive traces. Maintain a continuous ground pour under the 48-VQFN exposed pad (EP) for thermal dissipation, stitching vias (0.3 mm drill, 0.5 mm pitch) connecting EP to inner ground plane. Place the LIN master/slave pull-up resistor and series capacitor within 5 mm of the LIN pin per SAE J2602 EMC recommendations.
Do not assume the -B and -BVAO suffix variants differ electrically; both share the same die, pinout, and electrical specs per the Microchip SAM HA1 datasheet family. The suffixes only indicate qualification/packaging grade. Programming the RWW data Flash for EEPROM emulation requires careful wear-leveling; Microchip provides ASF library routines (nvm.c) to manage this. Verify LIN timing in master mode against SAE J2602 with an oscilloscope on a real bus before final validation - slew-rate and dominant/recessive transitions are critical for EMC compliance.
Estimated: at 48 MHz with all peripherals active, the ATSAMHA1G14A-MBT draws approximately 8-10 mA from VDDIO, producing negligible self-heating in the 48-VQFN. Thermal concerns in LIN SBC SiPs typically come from the SBC die's linear regulator dissipation when supplying heavy external loads - if VREG_5V output delivers > 50 mA, verify that the EP ground pour keeps junction temperature below 125C per AEC-Q100 grade 1 limits.
合规信息
AEC-Q100 grade 1 qualified per Microchip product page material declaration. RoHS and REACH compliant. Conflict minerals CMRT/EMRT available through Microchip franchised channel.
