DS24B33Q+T&R - 4Kb 1-Wire EEPROM, 6-TDFN | Maxim Integrated
MPN: DS24B33Q+T&R ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4.26 | $4.26 |
| 10 | $3.94 | $39.40 |
| 100 | $3.55 | $355.00 |
| 500 | $3.18 | $1,590.00 |
| 1,000 | $2.85 | $2,850.00 |
DS24B33Q+T&R Overview
A 1-Wire EEPROM is a non-volatile memory device that uses Maxim's proprietary single-wire half-duplex protocol, requiring only one data line plus ground for communication and power. The bus topology typically supports multiple devices in parallel and provides parasitic-power capability, which is why 1-Wire parts (EEPROM, temperature sensors, secure authenticators) dominate identification, calibration-token, board-registration, and anti-counterfeiting use cases.
Key features of the DS24B33 include 4 Kbit density (16 pages x 256 bits), a 32-byte scratchpad for write verification before commit-to-EEPROM copy, open-drain 1-Wire I/O with internal pull-up equivalent, 40-year data retention typical, and industrial -40C to +85C operating range. The 6-TDFN-EP package provides low-profile 3x3 mm PCB real estate and a thermal pad for stable mass-attach reflow.
Internally, the DS24B33 follows the standard 1-Wire state-machine protocol: RESET, presence pulse, ROM/function command, then read/write to the scratchpad and EEPROM array. The 64-bit unique ROM ID is split into 1-byte family code (0x23 for this part), 48-bit serial number, and 8-bit CRC. The device is targeted at consumables authentication, PCB ID tagging, and small-parameter storage in industrial/embedded systems.
Typical applications include PCB identification and serialization, consumables authentication (medical, printing, industrial fluids), iButton-style accessory detection, calibration-data storage, and board-revision tracking. The exposed-pad package also supports solder-probe programming during manufacturing test.
When designing with the DS24B33, observe the 1-Wire timing budget (reset/presence/slot windows defined by the protocol) and choose the master pull-up strength to satisfy the rise-time spec at the maximum expected bus capacitance. Industrial-grade buses (2+) need a strong pull-up after RESET to deliver adequate recovery time on long stubs.
Drop-in alternatives for DS24B33Q+T&R — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DS24B33Q+T&R (same form factor and footprint) — differing in Interface, Memory Organization, Memory Type, Mounting Type, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DS24B33Q+
✅ Drop-In📋 Reference alternative (not in catalog)
DS24B33S+
✅ Drop-In📋 Reference alternative (not in catalog)
DS24B33+
✅ Drop-In✓ In Stock
$1.92 / Unit
View Datasheet →DS24B33+
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$1.92 / Unit
View Datasheet →DS2431+
✅ Drop-In📋 Reference alternative (not in catalog)
DS24B33Q+T&R Maximum Ratings & Electrical Characteristics
| Memory Type | Non-volatile EEPROM (1-Wire) |
| Memory Size | 4 Kbit (4096 bits) |
| Memory Organization | 16 pages x 256 bits |
| Scratchpad Size | 32 bytes |
| Interface | 1-Wire (single-conductor) |
| Write Cycle Time | 2 us (scratchpad, typical) |
| Operating Voltage | 3.3 V / 5 V |
| Unique ID | 64-bit factory-programmed ROM ID |
| Data Retention | 40 years (typical) |
| Package | 6-TDFN (3x3 mm) with Exposed Pad |
| Mounting Type | Surface Mount |
| Operating Temperature | -40 C to +85 C |
| MSL Level | 1 (data undisclosed in sources) |
| RoHS Status | Compliant |
| Family Code | 0x23 (1-Wire) |
DS24B33Q+T&R Pin Configuration
| Pin 1 | NC — Not connected (per datasheet) |
| Pin 2 | NC — Not connected (per datasheet) |
| Pin 3 | GND — Ground reference |
| Pin 4 | DQ — 1-Wire data input/output (open-drain, with external pull-up) |
| Pin 5 | NC — Not connected (per datasheet) |
| Pin 6 | NC — Not connected (per datasheet) |
| Pin EP | EP — Exposed thermal pad - tie to GND for thermal dissipation |
Typical Applications
DS24B33Q+T&R is suitable for 6 applications: PCB Identification and Serialization, Consumables Authentication, Calibration-Data Storage, iButton-Style Accessory Detection, Board-Revision Tracking, Medical-Device Accessory Authentication.
PCB Identification and Serialization
The DS24B33Q+T&R's 4 Kbit density and factory-locked 64-bit ROM ID make it a strong fit for PCB identification, board-revision tracking, and MAC/serial storage in production-line environments. The 32-byte scratchpad supports commit-then-copy write semantics so a host can verify a full page before it lands in the EEPROM array, eliminating partial-write corruption on noisy factory floors. With -40 C to +85 C industrial operation and 40-year retention, the part outlasts typical product service life. Bus parasitic-power operation lets a single GPIO drive the DQ line, removing a dedicated regulator rail.
Recommended
Consumables Authentication
The DS24B33Q+T&R is widely used in printer cartridges, medical consumables, and industrial-fluid containers to authenticate genuine accessories. The unique 64-bit ROM ID plus 4 Kbit user EEPROM stores certificates, lot codes, and refill counters that the host MCU verifies before enabling operation. Its 1-Wire single-pin interface keeps the consumable connector pin-count minimal, and the exposed-pad TDFN package supports reliable solder-probe programming during cartridge assembly. Open-drain DQ with internal pull-up equivalent simplifies host-side firmware.
Recommended
Calibration-Data Storage
The DS24B33Q+T&R's 16-page x 256-bit organization maps naturally to calibration-curve, sensor-trim, and gain-offset records for industrial sensors and modules. A 32-byte scratchpad lets a host write, CRC-check, then commit a complete calibration block, which is critical when the sensor is being programmed during end-of-line test. With 40-year data retention and -40 C to +85 C range, calibration survives harsh field conditions including automotive and outdoor industrial deployments. The 6-TDFN-EP footprint fits in tight sensor-module PCBs.
Recommended
iButton-Style Accessory Detection
The DS24B33Q+T&R operates on the same 1-Wire bus as Maxim's iButton family, making it suitable as an accessory-detection token when full iButton mechanical form-factor is not required. Its factory ROM ID lets the host distinguish between authorized accessories and unauthorized substitutes; the user EEPROM stores accessory parameters, firmware rev, or expiry data. The exposed-pad TDFN supports SMD assembly on accessory PCBs, and the parasitic-power mode means the accessory needs only a single contact pin plus ground.
Recommended
Board-Revision Tracking
The DS24B33Q+T&R stores board-revision codes, BOM hashes, and manufacturing-test logs on every PCB, enabling traceability through the supply chain and field-service history. The 4 Kbit density covers multiple revision entries plus a manufacturing-data block, and the 64-bit ROM ID is unique enough to identify individual boards across millions of units. With 40-year retention and industrial temperature range, the part survives long product field life without service degradation, and the small 6-TDFN footprint adds negligible board area.
Recommended
Medical-Device Accessory Authentication
The DS24B33Q+T&R is well-suited to medical-device accessory authentication where disposables (single-use sensors, tubing sets, electrodes) must be verified before use. The 4 Kbit user area holds batch records, sterilization-cycle counters, and certificate data, and the unique ROM ID guarantees traceability. With -40 C to +85 C operation and 40-year data retention, the EEPROM meets medical-device shelf-life requirements. The exposed-pad TDFN package supports reliable sterilization-process assembly and surface-mount integration into disposable accessory PCBs.
Recommended
Recommended Products Summary
Engineering reference data for DS24B33Q+T&R — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DS24B33Q+ | DS24B33S+ | DS24B33+ | DS24B33 | DS2431+ |
|---|---|---|---|---|---|---|
| Package | 6-TDFN (3x3 mm) EP | 6-TDFN (3x3 mm) EP - same | 8-SOIC (5.30 mm) - different footprint | 6-TDFN (3x3 mm) EP - same | 6-TDFN (3x3 mm) EP - same | 6-TSOC - different but adjacent family |
| Brand | Maxim Integrated | Maxim Integrated | Maxim Integrated | Maxim Integrated | Maxim Integrated | Maxim Integrated |
| Memory Density | 4 Kbit | 4 Kbit | 4 Kbit | 4 Kbit | 4 Kbit | 1 Kbit (-75%) |
| Interface | 1-Wire | 1-Wire | 1-Wire | 1-Wire | 1-Wire | 1-Wire |
| Unique ROM ID | Yes (64-bit) | Yes (64-bit) | Yes (64-bit) | Yes (64-bit) | Yes (64-bit) | Yes (64-bit) |
| Operating Voltage | 3.3 V / 5 V | 3.3 V / 5 V | 3.3 V / 5 V | 3.3 V / 5 V | 3.3 V / 5 V | 2.8 V to 5.25 V |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
| Data Retention (typ) | 40 years | 40 years | 40 years | 40 years | 40 years | 40 years |
Key Differentiators
- Higher density 4 Kbit in same 6-TDFN-EP package as 1-Wire EEPROM family (vs DS2431+)
- Surface-mount 6-TDFN-EP package supports modern SMT reflow (vs DS24B33S+ (8-SOIC))
- 32-byte scratchpad for verified commit-then-copy write semantics (vs I2C EEPROMs (e.g., AT24C32 family))
Design Notes
Place the DS24B33Q+T&R close to the 1-Wire bus connector and keep the DQ trace away from high-frequency switching nodes. The 6-TDFN-EP exposed pad must be soldered to a contiguous ground pour to meet thermal and electrical performance. A 4.7 kohm pull-up to the host VPUP rail (3.3V or 5V) is typical; rise-time on the DQ line must satisfy the 1-Wire spec at maximum expected bus capacitance (typically 1 us for short stubs, up to 15 us for long multi-drop buses).
Do not omit the external pull-up on DQ - the 1-Wire protocol requires the master to drive the bus high during recovery. Avoid mixing 1-Wire devices with different VPUP tolerances on the same bus segment without a level shifter. Verify the family code 0x23 when polling the ROM ID; mismatched family codes typically indicate an unsupported device on the bus. The scratchpad-commit pattern must be observed exactly: write scratchpad, read-back CRC, then COPY to EEPROM - skipping the read-back risks silent corruption.
Long 1-Wire stubs (greater than approximately 5 meters total bus length) require careful impedance management; place a stronger pull-up (1-2.2 kohm) and consider a 'stretch' reset waveform on the master side. Multi-drop buses need a unique 64-bit ID per device - the DS24B33Q+T&R's factory-programmed ID satisfies this out of the box. Bus recovery time after a strong pull-up RESET must be observed before any subsequent slot; refer to the DS24B33 datasheet timing diagram for the exact window.
Compliance Information
RoHS compliance confirmed per PartGenie and distributor listings (Y). REACH, halogen-free, and conflict-minerals status not explicitly stated in the provided data - set to unknown pending manufacturer disclosure. AEC-Q100 not applicable - this is a memory IC, not automotive-qualified.
