DSPA56720AG - Multi-Core 24-bit Audio DSP | NXP / Freescale
MPN: DSPA56720AG ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $32.5 | $32.50 |
| 10 | $29.2 | $292.00 |
| 100 | $25.85 | $2,585.00 |
| 500 | $22.4 | $11,200.00 |
| 1,000 | $19.95 | $19,950.00 |
DSPA56720AG Overview
What is a multi-core audio DSP? A digital signal processor (DSP) is a specialized microprocessor optimized for numerical operations on sampled analog signals. An audio DSP is tuned for low-latency, deterministic processing of audio frames using fixed-point arithmetic and hardware accelerators. The Symphony DSP5672x family combines two or more DSP56300 cores in a single die to deliver parallel processing of multiple audio streams and standards, bridging the gap between single-core DSPs and general-purpose processors in audio subsystems.
Key features include 24-bit data paths, dual DSP56300 cores with hardware accelerators, integrated memory interfaces for external SDRAM, dedicated audio peripherals (serial audio interfaces, sample-rate converters), and the LFQFP-144 gull-wing surface-mount package with commercial temperature grade (0C to +70C). The architecture is programmable through NXP's Symphony Studio toolchain, and firmware libraries support popular codecs such as Dolby Digital, DTS, AAC, and MP3.
From a technical standpoint, the DSPA56720AG is built on a 0.13-micron CMOS process, runs at clock speeds suitable for multi-channel HD audio, and supports heterogeneous memory mapping across internal SRAM and external SDRAM. The chip exposes multiple ESSI (Enhanced Synchronous Serial Interface) ports, a Host Interface (HI), and a peripheral control block for GPIO and interrupt management. Designers should consult the manufacturer datasheet for exact core clock, MIPS rating, and on-chip memory sizing.
Typical applications include AV receivers, soundbars, automotive head units, and professional mixing consoles. The part is also deployed in broadcast audio equipment and consumer electronics where multi-channel decoding is required.
When designing with the DSPA56720AG, allocate proper PCB thermal relief under the exposed pad of the LQFP-144 footprint, keep one quad high-speed ESSI traces short and impedance-controlled, and use NXP's Symphony Studio for firmware development. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for DSPA56720AG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPA56720AG (same form factor and footprint) — differing in Package.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPB56720AG
✅ Drop-In✓ In Stock
$20.1 / Unit
View Datasheet →DSP56720AG
✅ Drop-In📋 Reference alternative (not in catalog)
DSPB56721AG
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPB56720AF
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPB56720AFR2
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPA56720AG Specifications
| Family | Symphony DSP5672x |
| Core Architecture | Dual DSP56300 24-bit |
| Data Path Width | 24-bit |
| Process Technology | CMOS |
| Package | LQFP-144 (LFQFP), 20 x 20 mm |
| Terminal Form | GULL WING |
| Number of Terminals | 144 |
| Package Code | LFQFP |
| Package Shape | SQUARE |
| Temperature Grade | COMMERCIAL |
| Mounting Type | Surface Mount |
| Lead-Free | Yes (G suffix) |
| Compliance | RoHS compliant (G suffix indicates lead-free) |
| Description | Symphony DSP56720/DSP56721 Multi-Core Audio Processors |
DSPA56720AG square Pin Configuration Guide
Pin configuration for DSPA56720AG (square package). Pin numbering, functions, and connection diagrams are defined in the manufacturer datasheet. Refer to it for the exact footprint and soldering guidelines.
No detailed pinout data available for DSPA56720AG.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPA56720AG is suitable for 6 applications: Home Theater AV Receiver Audio Decoding, Automotive Premium Audio Head Unit, Soundbar Multi-Channel Processor, Professional Audio Mixing Console, Broadcast Audio Encoding/Decoding Equipment, Consumer Karaoke and DJ Controller.
Home Theater AV Receiver Audio Decoding
The DSPA56720AG's multi-core DSP56300 architecture is purpose-built for multi-channel home theater decoding where several audio codecs must run concurrently. With its dual 24-bit cores, the parser can run a Dolby Digital or DTS decoder on the secondary core while the primary core handles post-processing such as bass management or room equalization. The 144-pin LQFP package exposes multiple ESSI serial audio interfaces for routing decoded PCM streams to DACs, while the Host Interface links to the front-panel microcontroller. Designers benefit from NXP's firmware codec library, which avoids licensing third-party DSP IP.
Recommended
Automotive Premium Audio Head Unit
The DSPA56720AG's hardware audio accelerators make it a strong fit for automotive head units running multi-zone cabin audio processing. The dual DSP56300 cores can simultaneously decode the source stream and run vehicle-imaging architectures like NXP's own or third-party tuner libraries. While the commercial temperature grade (0C to +70C) rules out under-hood deployment, the part is suitable for cabin-mounted head units. The LQFP-144 footprint exposes enough GPIO for button matrices, display drivers, and MOST bus bridges typical of premium head unit designs.
Recommended
Soundbar Multi-Channel Processor
In soundbar designs where space and BOM cost matter, the DSPA56720AG integrates all decoding, post-processing, and virtualization onto a single chip. The parser's hardware acceleration offloads common operations from the cores, enabling Dolby Atmos or DTS Virtual:X rendering at lower MIPS cost. Its compact LQFP-144 footprint fits alongside wireless subwoofer transceivers, Class D amplifiers, and HDMI ARC interfaces. Designers should plan PCB layout to isolate the high-speed ESSI traces from the Class D amplifier switching nodes to prevent audible interference.
Recommended
Professional Audio Mixing Console
Professional mixing consoles demand deterministic low-latency audio processing, which the DSPA56720AG's DSP56300 architecture is engineered to provide. The dual cores can run independent DSP channel strips - EQs, dynamics, and effects - in parallel while sharing the host controller interface for parameter recall and scene management. The 144-pin LQFP exposes enough serial audio interfaces to handle 32+ channels of I/O via TDM expansion. NXP's Symphony Studio provides deterministic code-generation tools required for pro-audio latency budgets under 5 ms.
Recommended
Broadcast Audio Encoding/Decoding Equipment
In broadcast audio chains - studio-to-transmitter links, satellite uplinks, and IP audio codecs - the DSPA56720AG handles real-time encoding and decoding of compressed audio formats such as AAC, aptX, and Opus. The dual-core architecture supports simultaneous encode and decode paths, useful for round-trip monitoring. Its LQFP-144 footprint provides the GPIO count required for front-panel LCDs, button matrices, and Ethernet status LEDs common in broadcast gear. Pair it with broadcast-standard AES3 transceiver ICs on the I/O side.
Recommended
Consumer Karaoke and DJ Controller
Karaoke and DJ controllers rely on real-time audio effects processing - reverb, pitch shifting, beat matching - that the DSPA56720AG's dual DSP56300 cores handle gracefully. The parser's hardware accelerators run common mixer operations in parallel, while the cores apply vendor-specific effect chains. The 144-pin LQFP provides the GPIO and serial interfaces needed for jog wheels, level meters, MIDI I/O, and USB audio class 2.0 interfacing. Designers can use NXP's reference effect chains as starting points and customize for product differentiation.
Recommended
Recommended Products Summary
Engineering reference data for DSPA56720AG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPB56720AG | DSP56720AG | DSPB56721AG |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | LQFP-144 (LFQFP) | LQFP-144 (LFQFP) - same | LQFP-144 (LFQFP) - same | LQFP-144 (LFQFP) - same |
| Family | Symphony DSP56720 | Symphony DSP56720 | Symphony DSP56720 | Symphony DSP56721 |
| Core Architecture | Dual DSP56300 24-bit | Dual DSP56300 24-bit | Dual DSP56300 24-bit | Dual DSP56300 24-bit |
| Temperature Grade | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL/INDUSTRIAL |
| Lead-Free (G suffix) | Yes | Yes | Yes | Yes |
| Lifecycle Status | NRND | NRND | NRND | Active |
| Audio Codec Library Support | Dolby Digital, DTS, AAC, MP3 | Dolby Digital, DTS, AAC, MP3 | Dolby Digital, DTS, AAC, MP3 | Dolby TrueHD, DTS-HD, AAC, MP3 |
Key Differentiators
- Multi-core DSP56300 architecture with hardware audio accelerators (vs TMS320VC5503PGE)
- Integrated ESSI serial audio interfaces for direct DAC/ADC connection (vs DSPB56720AG)
- Compact LQFP-144 footprint for space-constrained designs (vs DSPB56720AF)
Design Notes
The LQFP-144 package has a thermal resistance of approximately 50 C/W (theta_JA) on a standard JEDEC 4-layer test board. The DSPA56720AG's typical power dissipation is in the 1-2 W range at full DSP56300 core utilization. Estimated: at 1.5 W dissipation, junction temperature rise above ambient is 50 C/W x 1.5 W = 75 C. With a 70 C ambient ceiling, this leaves 5 C margin to the 125 C junction limit - adequate copper pour and ventilation are recommended. Add thermal vias under the package center pad region to spread dissipation into inner planes.
Route high-speed ESSI (Enhanced Synchronous Serial Interface) traces as 50-ohm impedance-controlled microstrip or stripline, keeping trace lengths under 50 mm where possible to minimize reflections. Place the DSPA56720AG at least 25 mm away from switching power supplies, Class D amplifiers, and RF antennas to avoid coupling noise into the analog audio paths. Provide a solid ground plane under the entire chip footprint with stitched ground vias every 5 mm along the perimeter of the LQFP-144 lead rows.
Do not assume the DSPA56720AG is automotive-qualified - it is commercial-temperature-grade (0C to +70C). For under-hood or safety-critical deployments, select an AEC-Q100 qualified variant from NXP's automotive audio DSP portfolio. Also, do not confuse the G suffix (lead-free RoHS) with automotive grade - G indicates terminal finish only. Finally, the part is NRND; for new designs, evaluate DSP56721 successors or contact NXP for the current recommended part before committing to a long-lifecycle product.
Place external SDRAM chips within 50 mm of the DSPA56720AG SDRAM address/data bus pins, and route the address and data lines with matched trace lengths (within +/- 2 mm) to preserve setup/hold margins. Place SDRAM bulk and bypass capacitors on the same side of the PCB as the DSPA56720AG to minimize via inductance. Avoid routing the SDRAM clock signal across any split in the ground plane. Use a 4-layer PCB stack-up with dedicated VCC and GND planes to provide clean power delivery to the core logic.
Series-terminate the DSPA56720AG SDRAM clock output with a 33-ohm resistor placed within 10 mm of the chip pin to dampen reflections on the long memory bus. Series-terminate each ESSI clock and frame-sync output similarly. Avoid using ferrite beads on the SDRAM VCC supply - use a pi-filter (LC) network instead for clean high-frequency decoupling. Use NXP's Symphony Studio timing analyzer to validate bus timings against your specific PCB layout and SDRAM datasheet parameters.
Compliance Information
G suffix confirms lead-free RoHS-compliant terminal finish. AEC-Q100 not qualified (COMMERCIAL temperature grade). Reach SVHC, and halogen_free status not confirmed in verified data.
