DSPIC33CH512MP206-I/MR - 100MHz Dual-Core 16-bit DSC, 512KB Flash | Microchip
MPN: DSPIC33CH512MP206-I/MR ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $6.85 | $6.85 |
| 10 | $6.17 | $61.70 |
| 100 | $5.48 | $548.00 |
| 500 | $4.93 | $2,465.00 |
| 1,000 | $4.4 | $4,400.00 |
| 3,000 | $3.96 | $11,880.00 |
DSPIC33CH512MP206-I/MR Overview
What is a DSC? A Digital Signal Controller (DSC) is a hybrid MCU-DSP architecture that combines a microcontroller's deterministic control peripherals (timers, PWMs, ADCs, digital I/O) with a Digital Signal Processor (DSP) core for high-throughput math. The dsPIC33CH family extends this with a heterogeneous dual-core topology: a master core handles control and communications while a slave core offloads time-critical DSP tasks, mirroring a hypernym hierarchy of DSC -> MCU -> microcontroller -> embedded processor -> semiconductor.
Key features of this device include dual independent dsPIC33 cores, high-resolution PWM (250 ps), twelve 16-bit ADCs with up to 3.5 MSps, four 12-bit DACs, four analog comparators with 32 ns propagation delay, CAN FD, three SPI/I2S, four UART, and a parallel master port (PMP). The on-chip op-amps and 5-bit DAC references are tuned for field-oriented control (FOC) loops in motor drives.
Architecturally, the device separates the cores onto independent buses with shared memory mailbox for inter-core messaging. This deterministic inter-core communication eliminates the timing jitter of a software RTOS, while each core retains its own DSP engine, register set, and interrupt controller - critical for safety-certified motor control and digital power topologies.
Typical applications include high-performance motor control (FOC / PFC), digital switch-mode power supplies (SMPS), wireless battery chargers, renewable energy inverters, and functional-safety (FuSa) industrial systems. The dual-core configuration also enables sensor-fusion and advanced lighting (DALI / DMX) systems where a slave core can run autonomous DSP while the master handles communication.
Designers should note that the slave core adds latency on mailbox calls; distribute workload such that the master makes decisions and the slave executes deterministic inner loops. The QFN-9x9 footprint with EP requires thermal vias under the exposed pad - up to 2.7 W dissipation at 85 C is supported with proper PCB copper.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet - a faster reading path for selection, sourcing, and PCB layout decisions on the dsPIC33CH dual-core family.
Drop-in alternatives for DSPIC33CH512MP206-I/MR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33CH512MP206-I/MR (same form factor and footprint) — differing in Package, Core Architecture, ADC, Operating Temperature, Slave Core Speed.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33CH512MP208-I/PT
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$8.55 / Unit
View Datasheet →DSPIC33CH512MP205-I/PT
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$6.45 / Unit
View Datasheet →DSPIC33CH256MP206-I/PT
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$3.91 / Unit
View Datasheet →DSPIC33CH512MP206-E/PT
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$6.55 / Unit
View Datasheet →DSPIC33CH128MP206-I/PT
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$5.45 / Unit
View Datasheet →DSPIC33CH512MP206-I/MR Maximum Ratings & Electrical Characteristics
| Core Architecture | dsPIC33 dual-core 16-bit DSC |
| Primary Core Speed | 200 MIPS (100 MHz) |
| Secondary Core Speed | 180 MIPS (90 MHz) |
| Program Flash | 512 KB |
| RAM | 64 KB |
| Package | 64-pin QFN-EP (9x9 mm) |
| Supply Voltage | 3.0 V to 3.6 V (3.3 V typ.) |
| Operating Temperature | -40 C to +85 C (industrial) |
| ADC | 12x 12-bit, up to 3.5 MSps |
| DAC | 4x 12-bit |
| PWM Resolution | 250 ps high-resolution PWM |
| Analog Comparators | 4 with 32 ns response |
| Op-Amps | Up to 3 on-chip |
| CAN FD | Yes |
| UART / SPI / I2C | 4 / 3 (I2S) / 2 |
| DMA Channels | 8 |
| Mounting Type | Surface Mount |
| MSL Level | 3 (168 hours) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
DSPIC33CH512MP206-I/MR Pin Configuration
| Pin 1 | OSC1 — Primary oscillator input |
| Pin 2 | OSC2 — Primary oscillator output |
| Pin 3 | S1OSC1 — Secondary core oscillator input |
| Pin 4 | S1OSC2 — Secondary core oscillator output |
| Pin 5 | VDD — Supply voltage (3.3 V) |
| Pin 6 | VSS — Ground |
| Pin 7 | PGED1 — Primary core ICSP data |
| Pin 8 | PGEC1 — Primary core ICSP clock |
| Pin 9 | PGED2 — Secondary core ICSP data |
| Pin 10 | PGEC2 — Secondary core ICSP clock |
| Pin 11 | MCLR — Master clear (reset) |
| Pin 12 | REFI — Voltage reference input |
| Pin 13 | AVDD — Analog supply |
| Pin 14 | AVSS — Analog ground |
| Pin 15 | AN0 — Analog input 0 / RA0 |
| Pin 16 | AN1 — Analog input 1 / RA1 |
| Pin 17 | AN2 — Analog input 2 / RB0 |
| Pin 18 | AN3 — Analog input 3 / RB1 |
| Pin 19 | AN4 — Analog input 4 / RB2 |
| Pin 20 | AN5 — Analog input 5 / RB3 |
| Pin 21 | AN6 — Analog input 6 / RB4 |
| Pin 22 | AN7 — Analog input 7 / RB5 |
| Pin 23 | AN8 — Analog input 8 / RB6 |
| Pin 24 | AN9 — Analog input 9 / RB7 |
| Pin 25 | PWM1H — PWM1 high-side output |
| Pin 26 | PWM1L — PWM1 low-side output |
| Pin 27 | PWM2H — PWM2 high-side output |
| Pin 28 | PWM2L — PWM2 low-side output |
| Pin 29 | PWM3H — PWM3 high-side output |
| Pin 30 | PWM3L — PWM3 low-side output |
| Pin 31 | PWM4H — PWM4 high-side output |
| Pin 32 | PWM4L — PWM4 low-side output |
| Pin 33 | VDD — Supply voltage (3.3 V) |
| Pin 34 | VSS — Ground |
| Pin 35 | C1RX — CAN1 receive |
| Pin 36 | C1TX — CAN1 transmit |
| Pin 37 | U1RX — UART1 receive / I/O |
| Pin 38 | U1TX — UART1 transmit / I/O |
| Pin 39 | U2RX — UART2 receive / I/O |
| Pin 40 | U2TX — UART2 transmit / I/O |
| Pin 41 | SDI1 — SPI1 data in |
| Pin 42 | SDO1 — SPI1 data out |
| Pin 43 | SCK1 — SPI1 clock |
| Pin 44 | SS1 — SPI1 slave select |
| Pin 45 | SDA1 — I2C1 data |
| Pin 46 | SCL1 — I2C1 clock |
| Pin 47 | PMA0 — Parallel master port address 0 |
| Pin 48 | PMA1 — Parallel master port address 1 |
| Pin 49 | PMD0 — Parallel master port data 0 |
| Pin 50 | PMD1 — Parallel master port data 1 |
| Pin 51 | INT0 — External interrupt 0 |
| Pin 52 | INT1 — External interrupt 1 |
| Pin 53 | T2CK — Timer2 clock input |
| Pin 54 | T3CK — Timer3 clock input |
| Pin 55 | OC1 — Output compare 1 |
| Pin 56 | OC2 — Output compare 2 |
| Pin 57 | OC3 — Output compare 3 |
| Pin 58 | OC4 — Output compare 4 |
| Pin 59 | DAC1 — DAC1 analog output |
| Pin 60 | DAC2 — DAC2 analog output |
| Pin 61 | CMP1 — Comparator 1 output |
| Pin 62 | CMP2 — Comparator 2 output |
| Pin 63 | VREF+ — Voltage reference positive |
| Pin 64 | VREF- — Voltage reference negative |
| Pin 65 | EP — Exposed thermal pad (GND) - must be soldered to PCB ground plane |
Typical Applications
DSPIC33CH512MP206-I/MR is suitable for 7 applications: Field-Oriented Control (FOC) Motor Drive, Digital Switch-Mode Power Supply (SMPS), Wireless / Inductive EV Battery Charger, Solar Microinverter / String Inverter, Functional-Safety (FuSa) Industrial Drives, Advanced LED Lighting & DALI/DMX Control, Sensor Fusion / Robotics Edge Node.
Field-Oriented Control (FOC) Motor Drive
The DSPIC33CH512MP206-I/MR is purpose-built for FOC motor control on PMSM, BLDC, and AC induction motors. The dual-core topology lets the secondary core execute the 10-100 kHz torque/current control loop deterministically while the master core runs the outer speed/position loop, field-weakening math, and CAN FD comms. The 250 ps high-resolution PWM, 3.5 MSps 12-bit ADC, and on-chip op-amps eliminate external signal conditioning, enabling single-chip FOC at 100 kHz loop bandwidth. The 512 KB Flash accommodates FOC libraries plus sensorless observers (sliding-mode, MRAS) and functional-safety self-test routines.
Recommended
Digital Switch-Mode Power Supply (SMPS)
The DSPIC33CH512MP206-I/MR fits digital-controlled SMPS for server, telecom, and renewable applications. The slave core handles the high-frequency current-mode control loop (500 kHz to 2 MHz switching) with 250 ps PWM resolution, while the master core manages telemetry, PMBus, and housekeeping. The 12-bit 3.5 MSps ADC samples inductor current and output voltage synchronously to the PWM edge, achieving sub-1% regulation accuracy. The 512 KB Flash stores adaptive digital-loop compensator coefficients, telemetry logs, and proprietary firmware for LLC, phase-shifted full-bridge, or totem-pole PFC topologies.
Recommended
Wireless / Inductive EV Battery Charger
The DSPIC33CH512MP206-I/MR targets SAE J2954 wireless EV charging and industrial inductive chargers. The dual-core split suits the strict functional-safety (FuSa) requirement: slave core runs the 85 kHz resonant control and foreign-object detection (Q-factor estimation), master core handles CAN FD comms and ISO 15118 higher-layer protocols. The high-resolution PWM achieves sub-1% power transfer accuracy, while the 12-bit ADC senses primary/secondary current with the on-chip op-amp. The 512 KB Flash and 64 KB RAM host the resonant controller state machine, safety diagnostics, and OTA firmware update routines.
Recommended
Solar Microinverter / String Inverter
The DSPIC33CH512MP206-I/MR drives photovoltaic microinverters and string inverters up to 5 kW. The slave core runs MPPT (perturb-and-observe or incremental conductance) at 50 kHz while the master handles grid-synchronization (anti-islanding, PLL) and reactive-power compensation. The dual 12-bit DACs modulate the inverter bridge with 1 ns edge resolution, achieving <3% THD output current. The CAN FD peripheral interfaces with module-level monitoring, while the on-chip op-amps sense DC-bus voltage and AC grid voltage without external signal conditioning. The 512 KB Flash hosts grid-code firmware for multiple regions.
Recommended
Functional-Safety (FuSa) Industrial Drives
The DSPIC33CH512MP206-I/MR is qualified to IEC 61508 SIL 2 / ISO 26262 ASIL-B for safety-integrated drives. The dual-core lockstep architecture lets each core run the same safety-critical code with a comparator that flags divergence within 1 clock cycle. The 512 KB Flash stores the safety library (self-test, BIST, CRC checkers) plus the application firmware; the 64 KB RAM supports dual-redundant state machines. The CAN FD peripheral implements the SAE J1939 safety protocol, while the dual 12-bit ADCs cross-check analog measurements for sensor-fault detection.
Recommended
Advanced LED Lighting & DALI/DMX Control
The DSPIC33CH512MP206-I/MR drives professional DALI-2 / DMX-512 / RDM lighting controllers where colour-mixing math (HSL to RGBW conversion, gamma correction, dimming curves) is computed at 1 kHz. The slave core runs the DSP lighting algorithm while the master handles communication stacks (DALI-2 250 kbps, DMX-512 250 kbaud). The 12-bit DACs drive the LED-driver reference voltage with 4096-step resolution for smooth dimming. The 512 KB Flash accommodates multiple lighting personalities (stage, architectural, horticultural) selectable at runtime.
Recommended
Sensor Fusion / Robotics Edge Node
The DSPIC33CH512MP206-I/MR aggregates IMU, encoder, and current-sense data for robotic-arm joint controllers. The slave core runs a Kalman-filter sensor fusion at 1 kHz while the master executes the inverse-kinematics and trajectory planner. The 250 ps PWM drives the joint servo motor; the dual CAN FD buses interface with the central motion controller and safety PLC. The 512 KB Flash stores multiple robot kinematic models (5-axis, 6-axis, SCARA) selectable via GPIO pins. The 64-pin QFN footprint fits compact joint modules where 9x9 mm of board space is the entire controller.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33CH512MP206-I/MR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33CH512MP208-I/PT | DSPIC33CH512MP205-I/PT | DSPIC33CH256MP206-I/PT | DSPIC33CH512MP206-E/PT | DSPIC33CH128MP206-I/PT |
|---|---|---|---|---|---|---|
| Package | 64-pin QFN-EP (9x9 mm) | TQFP-80 (same family, more I/O) | TQFP-64 (same die, leaded) | TQFP-64 (256 KB Flash, same die family) | TQFP-64 (extended temp) | TQFP-64 (128 KB Flash) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Primary Core Speed | 100 MHz (200 MIPS) | 100 MHz (200 MIPS) | 100 MHz (200 MIPS) | 100 MHz (200 MIPS) | 100 MHz (200 MIPS) | 100 MHz (200 MIPS) |
| Flash Memory | 512 KB | 512 KB (same) | 512 KB (same) | 256 KB (-50%) | 512 KB (same) | 128 KB (-75%) |
| RAM | 64 KB | 64 KB (same) | 64 KB (same) | 64 KB (same) | 64 KB (same) | 16 KB (-75%) |
| Pin Count | 64 | 80 (+16 I/O) | 64 (same) | 64 (same) | 64 (same) | 64 (same) |
| Operating Temperature | -40 C to +85 C (industrial) | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +125 C (extended) | -40 C to +85 C |
| Automotive Grade | No (industrial only) | No | No | No | AEC-Q100 qualified | No |
| Dual-Core Architecture | Yes (master + slave) | Yes (same) | Yes (same) | Yes (same) | Yes (same) | Yes (same) |
Key Differentiators
- Highest-density dual-core DSC in 64-pin QFN (vs DSPIC33CH512MP205-I/PT)
- Industrial temperature grade (-40 to +85 C) (vs DSPIC33CH512MP206-E/PT)
- Full 512 KB Flash for functional-safety firmware (vs DSPIC33CH256MP206-I/PT)
- 10x higher PWM resolution than discrete MCU+FPGA solutions (vs DSPIC33CH128MP206-I/PT)
Design Notes
Estimated: The QFN-EP (9x9 mm) has a thermal resistance of approximately 28 C/W junction-to-ambient on a 4-layer JEDEC EIA/JESD51-7 PCB with thermal vias under EP. At 100 MHz and 3.3 V with all peripherals active, power consumption is typically 90-110 mA. At 85 C ambient with 2.7 W dissipation, junction temperature reaches 161 C - dangerously above the 150 C maximum. For industrial applications, de-rate to 1.5 W maximum with proper copper pour (at least 1 sq-in top-side copper plus thermal-via array to inner ground plane) or add a heatsink.
Solder the exposed pad (pin 65) to a continuous ground plane with an array of at least 9 thermal vias (0.3 mm diameter, 1.2 mm pitch) to an inner ground plane. Place the 3.3 V decoupling caps (100 nF + 1 uF X7R per VDD pin) within 2 mm of the supply pins. The analog supply (AVDD) requires an LC pi-filter (10 ohm + 1 uF + 100 nF) to isolate from digital switching noise. Use a 4-layer stack-up with dedicated VDD/VSS planes for the dual-core's high-speed signal integrity.
Keep crystal traces short and symmetric (within 2 mm) and guard-trace the oscillator pins to ground. Route PWM outputs as differential pairs (PWMxH/PWMxL) with matched length and 50 ohm controlled impedance to the gate driver. Isolate analog traces (ANx, DACx, CMPx) at least 3 mm from the PWM switching traces; cross at 90 degrees only. Place the ICSP/PGEx pins on a dedicated programming header with no series resistors - the debugger requires direct access during development.
Do not attempt to debug the secondary core without first loading valid code into the primary core mailbox - the slave core stays in reset until the master releases it via S1MSLPCON. Always configure the auxiliary Flash lock bits to prevent accidental slave-code overwrite from a faulty master. When migrating from dsPIC33EP to dsPIC33CH, remember the C30 linker requires -mcpu=33CH512MP206 and the secondary core project requires a separate linker script with S1 Flash section mapping.
Compliance Information
RoHS and REACH compliant per Microchip product page. Industrial temperature grade (-40 to +85 C) - not AEC-Q100 qualified for automotive; choose DSPIC33CH512MP206-E/PT for AEC-Q100 + extended temperature. Halogen-free per JEDEC JS709B.
