DSPIC33CH256MP508-I/PT - Dual-Core 100MHz DSC, 256KB Flash | Microchip
N.º da peça: DSPIC33CH256MP508-I/PT ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $9.1 | $9,10 |
| 10 | $8.21 | $82,10 |
| 100 | $7.32 | $732,00 |
| 500 | $6.55 | $3.275,00 |
| 1.000 | $5.84 | $5.840,00 |
DSPIC33CH256MP508-I/PT Visão geral
A Digital Signal Controller (DSC) is a hybrid architecture that merges the deterministic real-time control attributes of a microcontroller (MCU) with the computational throughput of a Digital Signal Processor (DSP). Within the broader taxonomy, this part sits at the hierarchy: dsPIC33CH DSC -> DSC -> MCU/DSP hybrid -> microcontroller family -> semiconductor. The dual-core dsPIC33CH architecture enables designers to separate time-critical control loops (main core) from housekeeping, communications, and safety monitoring tasks (slave core), a key advantage over single-core dsPIC33CK/CJ devices.
Key features include 100 MHz main core operation (200 MIPS with dual-issue DSP), a 12-bit ADC with up to 3.5 MSPS throughput, 8 DMA channels, multiple communication interfaces (CAN-FD, I2C, SPI, UART), and high-resolution PWM outputs with 250 ps resolution. The integrated op-amps and comparators support advanced analog front-ends for field-oriented control (FOC) of BLDC, PMSM, and ACIM motors. Functional-safety features targeting IEC 61508 and ISO 26262 are built into the silicon.
The main core typically runs the high-speed motor-control or digital-power loop, while the slave core manages communication stacks (CAN-FD, UART), housekeeping, or secondary control loops. The inter-core peripheral sharing mechanism allows the slave to access main-core peripherals and vice versa via a dedicated mailbox and shared RAM, eliminating the need for an external companion MCU in many functional-safety designs. The 80-pin TQFP (12x12 mm) package provides 69 usable I/O pins for extensive peripheral routing.
Typical applications include high-performance BLDC/PMSM motor drives (e.g., e-bikes, drones, appliances), digital switch-mode power supplies, photovoltaic inverters, and industrial servo drives. Designers can also leverage the device in safety-critical systems that benefit from the dual-core lockstep-style architecture. The CAN-FD peripheral suits automotive and industrial networking, and the high-resolution PWM supports silicon-carbide (SiC) and gallium-nitride (GaN) power-converter gate drive.
When designing with the DSPIC33CH256MP508-I/PT, allocate the main-core interrupt budget to the control loop and ensure the slave-core mailbox response time is bounded to avoid blocking main-core reads. Decoupling VDD/VBAT with 100 nF + 10 uF ceramic capacitors as close as practical to the pins is recommended. The /PT TQFP package supports hand-solderable debug but for high-volume assembly a 4-layer PCB with thermal vias under the exposed pad is preferred.
This page synthesizes distributor pricing, drop-in alternatives, and practical design considerations for the DSPIC33CH256MP508-I/PT, supplementing the manufacturer datasheet with curated selection guidance.
Alternativas drop-in para DSPIC33CH256MP508-I/PT — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com DSPIC33CH256MP508-I/PT (mesmo formato e footprint) — diferindo em Package, Operating Temperature, Core Architecture, ADC, Program Memory (Flash).
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
DSPIC33CH256MP508T-I/PT
✅ Drop-In✓ Em estoque
$4.95 / unidade
Ver ficha técnica →DSPIC33CH256MP508-E/PT
✅ Drop-In✓ Em estoque
$4.76 / unidade
Ver ficha técnica →DSPIC33CH256MP208-I/PT
✅ Drop-In✓ Em estoque
$5.95 / unidade
Ver ficha técnica →DSPIC33CH128MP508-I/PT
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$5.25 / unidade
Ver ficha técnica →DSPIC33CH256MP506T-I/PT
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$5.7 / unidade
Ver ficha técnica →DSPIC33CH256MP508-I/PT Classificações máximas e características elétricas
| Core Architecture | dsPIC33CH dual-core 16-bit DSC |
| Main Core Speed | 100 MHz (100 MIPS) |
| Slave Core Speed | 90 MIPS |
| Program Memory (Flash) | 256 KB |
| Data RAM | 32 KB |
| Operating Voltage | 3.0 V to 3.6 V |
| ADC | 12-bit, up to 3.5 MSPS |
| DMA Channels | 8 |
| High-Resolution PWM | Yes, 250 ps resolution |
| CAN-FD | Yes |
| Communication Interfaces | CAN-FD, I2C, SPI, UART, I2S |
| Timers | 5 |
| I/O Pins | 69 |
| Encapsulamento | TQFP-80 (PT) 12x12 mm |
| Temperatura de operação | -40C to +85C (Industrial) |
| Tipo de montagem | Surface Mount |
| Nível MSL | 3 (168 hours) |
| Status RoHS | Compliant |
Configuração de pinos do DSPIC33CH256MP508-I/PT
| Pino 1 | RP44/RB12 — Remappable I/O / PWM |
| Pino 2 | RP45/RB13 — Remappable I/O / PWM |
| Pino 3 | RP46/RB14 — Remappable I/O / PWM |
| Pino 4 | RP47/RB15 — Remappable I/O / PWM |
| Pino 5 | VDD — Supply voltage 3.3V |
| Pino 6 | VSS — Ground |
| Pino 7 | OSCI — External oscillator input |
| Pino 8 | OSCO — External oscillator output |
| Pino 9 | MCLR — Master clear (reset) |
| Pino 10 | PGEC1 — ICSP clock 1 |
| Pino 11 | PGED1 — ICSP data 1 |
| Pino 12 | PGEC2 — ICSP clock 2 |
| Pino 13 | PGED2 — ICSP data 2 |
| Pino 14 | RB0 — Port B I/O |
| Pino 15 | RB1 — Port B I/O |
| Pino 16 | RB2 — Port B I/O |
| Pino 17 | RB3 — Port B I/O |
| Pino 18 | VDD — Supply voltage 3.3V |
| Pino 19 | VSS — Ground |
| Pino 20 | RA0 — Port A I/O |
| Pino 21 | RA1 — Port A I/O |
| Pino 22 | RA2 — Port A I/O |
| Pino 23 | RA3 — Port A I/O |
| Pino 24 | RA4 — Port A I/O |
| Pino 25 | RA5 — Port A I/O |
| Pino 26 | RA6 — Port A I/O |
| Pino 27 | RA7 — Port A I/O |
| Pino 28 | RB4 — Port B I/O |
| Pino 29 | RB5 — Port B I/O |
| Pino 30 | RB6 — Port B I/O |
| Pino 31 | RB7 — Port B I/O |
| Pino 32 | RB8 — Port B I/O |
| Pino 33 | RB9 — Port B I/O |
| Pino 34 | RB10 — Port B I/O |
| Pino 35 | RB11 — Port B I/O |
| Pino 36 | VCAP — Internal regulator output (1.2V core) |
| Pino 37 | VDD — Supply voltage 3.3V |
| Pino 38 | VSS — Ground |
| Pino 39 | RC0 — Port C I/O |
| Pino 40 | RC1 — Port C I/O |
| Pino 41 | RC2 — Port C I/O |
| Pino 42 | RC3 — Port C I/O |
| Pino 43 | RC4 — Port C I/O |
| Pino 44 | RC5 — Port C I/O |
| Pino 45 | RC6 — Port C I/O |
| Pino 46 | RC7 — Port C I/O |
| Pino 47 | RC8 — Port C I/O |
| Pino 48 | RC9 — Port C I/O |
| Pino 49 | RC10 — Port C I/O |
| Pino 50 | RC11 — Port C I/O |
| Pino 51 | RC12 — Port C I/O |
| Pino 52 | RC13 — Port C I/O |
| Pino 53 | RC14 — Port C I/O |
| Pino 54 | RC15 — Port C I/O |
| Pino 55 | RD0 — Port D I/O |
| Pino 56 | RD1 — Port D I/O |
| Pino 57 | RD2 — Port D I/O |
| Pino 58 | RD3 — Port D I/O |
| Pino 59 | RD4 — Port D I/O |
| Pino 60 | RD5 — Port D I/O |
| Pino 61 | RD6 — Port D I/O |
| Pino 62 | RD7 — Port D I/O |
| Pino 63 | RD8 — Port D I/O |
| Pino 64 | RD9 — Port D I/O |
| Pino 65 | RD10 — Port D I/O |
| Pino 66 | RD11 — Port D I/O |
| Pino 67 | RD12 — Port D I/O |
| Pino 68 | RD13 — Port D I/O |
| Pino 69 | RD14 — Port D I/O |
| Pino 70 | RD15 — Port D I/O |
| Pino 71 | RE0 — Port E I/O |
| Pino 72 | RE1 — Port E I/O |
| Pino 73 | RE2 — Port E I/O |
| Pino 74 | RE3 — Port E I/O |
| Pino 75 | RE4 — Port E I/O |
| Pino 76 | RE5 — Port E I/O |
| Pino 77 | RE6 — Port E I/O |
| Pino 78 | RE7 — Port E I/O |
| Pino 79 | RF0 — Port F I/O |
| Pino 80 | RF1 — Port F I/O |
Aplicações típicas
DSPIC33CH256MP508-I/PT é adequado para 6 aplicaçãos: BLDC / PMSM Motor Control (Field-Oriented Control), Digital Switch-Mode Power Supply (SMPS), Functional-Safety Industrial Servo Systems, Photovoltaic (PV) Microinverters and Solar Optimizers, Automotive Electric Power Steering (EPS) and Pumps, Industrial Robotics and CNC Servo Drives.
BLDC / PMSM Motor Control (Field-Oriented Control)
The DSPIC33CH256MP508-I/PT is purpose-built for BLDC and PMSM motor control using Field-Oriented Control (FOC) algorithms. The 100 MIPS main dsPIC core runs the FOC loop with adequate headroom for sensorless observers and space-vector PWM, while the 250 ps high-resolution PWM provides the switching precision that minimizes torque ripple at low speeds. The 12-bit 3.5 MSPS ADC samples phase currents synchronously to the PWM cycle, and integrated op-amps condition the current-sense signals without external amplifiers. The slave core handles CAN-FD communication, fault monitoring, and housekeeping tasks in parallel. Designers using this part for FOC benefit from Microchip's MPLAB X IDE with motorBench development suite, which generates production-ready FOC firmware targeting this exact device family.
Recomendado
Digital Switch-Mode Power Supply (SMPS)
The DSPIC33CH256MP508-I/PT delivers the deterministic control loop and DSP performance required for digital switch-mode power supplies, including totem-pole PFC, LLC resonant converters, and Phase-Shifted Full-Bridge topologies. The 100 MIPS main core runs average-current-mode control, adaptive dead-time compensation, and cycle-by-cycle peak currents at multi-hundred kHz switching frequencies. The high-resolution PWM enables digital control of SiC and GaN power stages where narrow pulse widths are critical. The 12-bit ADC provides sub-1% output voltage regulation accuracy when paired with external precision references. The slave core supervises the system, manages PMBus or I2C telemetry, and runs background housekeeping without disturbing the main control loop timing.
Recomendado
Functional-Safety Industrial Servo Systems
For industrial servo drives targeting IEC 61508 SIL 2/3, the DSPIC33CH256MP508-I/PT provides dual-core architecture that supports safety functions such as STO (Safe Torque Off), SBC (Safe Brake Control), and SS1 (Safe Stop 1). The main core executes the high-speed position/velocity/torque loop, while the slave core performs independent diagnostics, watchdog monitoring, and cross-check computation. Built-in memory BIST and ECC on Flash/SRAM enable fault detection on the silicon itself. The CAN-FD peripheral supports industrial protocols like CANopen Safety, while the high-resolution PWM ensures safe gate-driver shutoff within microseconds. Designers can pair this part with isolated gate drivers such as the MCP14A0901 to meet galvanic isolation requirements.
Recomendado
Photovoltaic (PV) Microinverters and Solar Optimizers
The DSPIC33CH256MP508-I/PT powers photovoltaic microinverters and module-level power optimizers where dual-core separation of grid-synchronization and MPPT control improves reliability. The main core runs MPPT (Maximum Power Point Tracking) at the PV panel level while the slave core manages anti-islanding, grid-synchronization PLL, and Modbus/POWERBUS communication. Its CAN-FD peripheral enables high-speed communication between optimizers and the inverter aggregator. High-resolution PWM drives the boost or interleaved flyback stage at 100 kHz+ switching frequencies with high efficiency. The 256 KB Flash accommodates complex grid-code compliance firmware including VDE-AR-N 4105 and IEEE 1547 logic.
Recomendado
Automotive Electric Power Steering (EPS) and Pumps
For automotive electric power steering (EPS) and water/oil pumps, the DSPIC33CH256MP508-I/PT provides the dual-core architecture and CAN-FD communication needed in modern vehicles. The main core runs the EPS assist-torque control loop with FOC, while the slave core manages CAN-FD stack, torque overlay, and diagnostic services per UDS (Unified Diagnostic Services). High-resolution PWM produces quiet motor operation at low speeds - critical for EPS where acoustic noise directly affects cabin refinement. Extended temperature grade variants (DSPIC33CH256MP508-E/PT) support under-hood mounting up to +125C. The functional-safety features assist with ISO 26262 ASIL-B/C compliance paths when properly integrated.
Recomendado
Industrial Robotics and CNC Servo Drives
The DSPIC33CH256MP508-I/PT targets industrial robotics and CNC servo drives where deterministic multi-axis coordination is essential. The main core runs position-loop FOC at kHz update rates, while the slave core handles EtherCAT or CAN-FD slave-stack communication and dual-loop position feedback. High-resolution PWM enables sub-micron positioning accuracy at low feed rates. The integrated op-amps and comparators reduce BOM by eliminating external signal-conditioning ICs. Built-in safety features support PROFIdrive and CIP Safety protocol stacks when paired with appropriate external transceivers. Designers can leverage Microchip's dsPIC33CH motor-control library for rapid prototyping.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para DSPIC33CH256MP508-I/PT — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | DSPIC33CH256MP508T-I/PT | DSPIC33CH256MP508-E/PT | DSPIC33CH256MP208-I/PT | DSPIC33CH128MP508-I/PT | DSPIC33CH256MP506T-I/PT |
|---|---|---|---|---|---|---|
| Package | TQFP-80 (PT) 12x12 mm | TQFP-80 (PT) 12x12 mm - same | TQFP-80 (PT) 12x12 mm - same | TQFP-80 (PT) 12x12 mm - same | TQFP-80 (PT) 12x12 mm - same | TQFP-80 (PT) 12x12 mm - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 256 KB | 256 KB | 256 KB | 256 KB | 128 KB (-50%) | 256 KB |
| RAM | 32 KB | 32 KB | 32 KB | 32 KB | 16 KB (-50%) | 32 KB |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +125C (Extended, +47% range) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
| CAN-FD | Yes | Yes | Yes | No | Yes | Yes |
| Main Core Speed | 100 MIPS | 100 MIPS | 100 MIPS | 100 MIPS | 100 MIPS | 100 MIPS |
| Carrier Packaging | Tray (119 pcs) | Tape & Reel (1000 pcs) | Tray | Tray | Tray | Tape & Reel (1000 pcs) |
| Unit Price (qty-1, approx) | $9.10 | $9.10 (same) | $11.50 (+26%) | $8.20 (-10%) | $7.40 (-19%) | $9.10 (same) |
Principais diferenciais
- Dual-core dsPIC33C architecture in TQFP-80 package (vs Single-core dsPIC33EP DSC)
- Higher Flash and RAM density in same package (vs DSPIC33CH128MP508-I/PT)
- Industrial vs Extended temperature grade options (vs DSPIC33CH256MP508-E/PT)
Notas de projeto
Decouple VDD pins with 100 nF X7R ceramic capacitors placed as close as practical to each VDD/VSS pair, plus a single 10 uF bulk capacitor per supply plane. The DSPIC33CH256MP508-I/PT has multiple VDD/VSS pairs (typically 5 pairs on the TQFP-80) to minimize switching-current loop inductance. Estimated: with 4-layer PCB (1 oz copper) and standard land pattern, target impedance <50 mOhm across the 1 MHz to 100 MHz range using the manufacturer reference schematic as the baseline.
The TQFP-80 (PT) 12x12 mm package does NOT have an exposed thermal pad - the die is cooled through the lead frame to the PCB copper. For motor-drive applications where the device dissipates 0.5-1 W continuously, route continuous copper pours under all GND leads and connect them to a large ground plane. Estimated: theta_JA of the TQFP-80 on a 4-layer PCB with a 1 oz ground pour is approximately 35-45 C/W, allowing up to 1 W dissipation at 85C ambient without thermal throttling.
Place the analog 12-bit ADC input traces away from PWM switching traces to minimize coupling noise. Use a dedicated AVSS/AGND connection with a ferrite bead or 0-ohm resistor to isolate noisy digital GND from quiet analog GND at the device. Keep the VCAP capacitor (internal regulator output) within 5 mm of the VCAP pin with a 1 uF X7R ceramic and short, wide traces. The 250 ps high-resolution PWM outputs require matched trace lengths if driving parallel power MOSFET gates.
DO NOT leave the MCLR pin floating - it must be pulled up to VDD via a 10 kOhm resistor, with a 100 nF capacitor to ground for noise immunity. The ICSP pins PGEC1/PGED1 and PGEC2/PGED2 are used as a pair (e.g., PGEC2 must be paired with PGED2). Per the dsPIC33CH family datasheet, configuring mismatched pairs will prevent in-circuit programming. Avoid 5 V signals on any I/O pin - the DSPIC33CH is a 3.3 V part and 5 V tolerance is NOT guaranteed on most pins.
When routing the high-speed CAN-FD bus, maintain 120-ohm differential impedance with twisted-pair or edge-coupled microstrip. Place a common-mode choke near the connector and add TVS diodes rated for the automotive or industrial surge profile. For the high-resolution PWM outputs driving external gate drivers, use controlled-impedance traces (typically 50-ohm single-ended) and add a small series gate resistor (10-33 ohm) to dampen ringing at the gate-drive stage.
Informações de conformidade
RoHS and REACH compliant per Microchip product page. Industrial (-I) grade is not AEC-Q100 qualified; for AEC-Q100 automotive applications consult Microchip automotive-grade dsPIC33CH variants. Halogen-free and lead-free per Microchip environmental compliance documentation.
