DSPIC33CH64MP202T-I/SS - Dual-Core DSC 100MHz 64KB Flash | Microchip
MPN: DSPIC33CH64MP202T-I/SS ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5.2 | $5.20 |
| 10 | $4.68 | $46.80 |
| 100 | $4.16 | $416.00 |
| 500 | $3.74 | $1,870.00 |
| 1,000 | $3.33 | $3,330.00 |
DSPIC33CH64MP202T-I/SS Overview
A Digital Signal Controller (DSC) is a hybrid device that merges a microcontroller (MCU) with a digital signal processor (DSP) on one die. In the broader taxonomy, a DSC sits between microcontroller (MCU) and digital signal processor (DSP); it belongs to the power-management-aware control class of MCUs that includes dedicated high-resolution PWM, op-amps, and analog comparators. The dsPIC33CH family extends this by integrating two dsPIC cores on one chip, allowing a master CPU to perform communication and supervisory tasks while a slave CPU executes time-critical control loops. This separation improves jitter and frees the main core to run operating systems, communications stacks, or user interfaces.
Key features include a 200 MHz maximum slave-core clock, 64 KB Flash (88K x 8 organization), PRAM (Program RAM), up to 200 MIPS aggregate throughput, dedicated high-resolution PWM peripherals, integrated op-amps and comparators for current/voltage feedback, and CAN-FD support for industrial networking. Functional Safety (FuSa) features assist IEC 61508 / ISO 26262 development. The dual-core architecture reduces system latency and removes the need for an external companion MCU.
The dsPIC33CH silicon uses a modified Harvard architecture with separate instruction and data paths, dual-ported SRAM, and a single-cycle 16x16 MAC DSP engine. Each core has independent register sets and interrupt controllers, enabling true parallel execution rather than time-slicing. The slave core can read/write shared RAM regions accessible by the master for inter-core messaging.
Typical applications include digital power conversion (PFC plus LLC), sensorless and field-oriented motor control (FOC for PMSM/BLDC), automotive mechatronic actuators, solar micro-inverters, and industrial drives requiring tight current-loop bandwidth. The dual-core partition suits ASIL-B/C functional-safety architectures where one core runs the safety loop and the other runs the application.
Design with this part by allocating deterministic control tasks to the slave core and user-interface or communication tasks to the master core; shared RAM buffers must be guarded against race conditions using the mailbox primitives documented in the dsPIC33CH family reference manual. Designers must also ensure the SSOP-28 PCB land pattern provides adequate copper pour for thermal dissipation; at 100 MHz plus 200 MHz dual-core activity, expect continuous dissipation in the 0.3-0.6 W range depending on peripheral enable state.
This page synthesizes distributor pricing, dual-core drop-in alternatives within the dsPIC33CH family, and inter-core design notes not consolidated in the manufacturer datasheet.
Drop-in alternatives for DSPIC33CH64MP202T-I/SS — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33CH64MP202T-I/SS (same form factor and footprint) — differing in Operating Temperature, Core Architecture, Program Memory (Flash), Package, Data RAM.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33CH128MP202T-I/SS
✅ Drop-In✓ In Stock
$3.94 / Unit
View Datasheet →DSPIC33CH64MP202-E/SS
✅ Drop-In✓ In Stock
$2.78 / Unit
View Datasheet →DSPIC33CH128MP202-I/SS
✅ Drop-In✓ In Stock
$4.1 / Unit
View Datasheet →DSPIC33CH64MP202-I/SS
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33CH64MP202T-I/SS Maximum Ratings & Electrical Characteristics
| Core Architecture | dsPIC33CH dual-core (16-bit DSC, modified Harvard) |
| Number of Cores | 2 (master + slave) |
| Main Core Max Frequency | 180 MHz |
| Slave Core Max Frequency | 200 MHz |
| Maximum Throughput | 200 MIPS (aggregate) |
| Program Flash Memory | 64 KB (88K x 8 organization) |
| PRAM (Program RAM) | 88 KB |
| Data RAM | 4 KB / 16 KB (L1 cache variants) |
| Operating Supply Voltage | 3.0 V to 3.6 V |
| Operating Temperature | -40 C to +85 C (Industrial) |
| Package | 28-pin SSOP |
| Mounting Type | Surface Mount (SMD/SMT) |
| High-Resolution PWM | Yes (dedicated HRPWM peripheral) |
| CAN-FD | Yes |
| Functional Safety (FuSa) | Yes (assists IEC 61508 / ISO 26262 development) |
| RoHS Status | Compliant |
DSPIC33CH64MP202T-I/SS Pin Configuration
| Pin 1 | SDA1/RG15 — I2C1 data or remappable GPIO |
| Pin 2 | SCL1/RG14 — I2C1 clock or remappable GPIO |
| Pin 3 | AN0/CVD0/RA0 — Analog input 0 / remappable GPIO |
| Pin 4 | AN1/CVD1/RA1 — Analog input 1 / remappable GPIO |
| Pin 5 | AN2/CVD2/RP12/RB0 — Analog input 2 / remappable peripheral |
| Pin 6 | AN3/CVD3/RP13/RB1 — Analog input 3 / remappable peripheral |
| Pin 7 | AN4/CVD4/RP14/RB2 — Analog input 4 / remappable peripheral |
| Pin 8 | VDD — Digital supply voltage (3.3 V) |
| Pin 9 | VSS — Digital ground |
| Pin 10 | OSCI/CLKI/RA2 — Crystal oscillator input or external clock |
| Pin 11 | OSCO/CLKO/RA3 — Crystal oscillator output |
| Pin 12 | PWM1H/RP15/RB3 — High-resolution PWM output 1 high-side |
| Pin 13 | PWM1L/RP16/RB4 — High-resolution PWM output 1 low-side |
| Pin 14 | PWM2H/RP17/RB5 — High-resolution PWM output 2 high-side |
| Pin 15 | PWM2L/RP18/RB6 — High-resolution PWM output 2 low-side |
| Pin 16 | PWM3H/RP19/RB7 — High-resolution PWM output 3 high-side |
| Pin 17 | PWM3L/RP20/RB8 — High-resolution PWM output 3 low-side |
| Pin 18 | PWM4H/RP21/RB9 — High-resolution PWM output 4 high-side |
| Pin 19 | PWM4L/RP22/RB10 — High-resolution PWM output 4 low-side |
| Pin 20 | VSS — Digital ground |
| Pin 21 | RP23/RB11 — Remappable peripheral / GPIO |
| Pin 22 | RP24/RB12 — Remappable peripheral / GPIO |
| Pin 23 | RP25/RB13 — Remappable peripheral / GPIO |
| Pin 24 | RP26/RB14 — Remappable peripheral / GPIO |
| Pin 25 | RP27/RB15 — Remappable peripheral / GPIO |
| Pin 26 | TCKIA/RA4 — Timer clock input A / GPIO |
| Pin 27 | TCKIB/RA5 — Timer clock input B / GPIO |
| Pin 28 | MCLR — Master clear reset (active-low) |
Typical Applications
DSPIC33CH64MP202T-I/SS is suitable for 6 applications: Field-Oriented Control (FOC) Motor Drives, Digital Power Conversion (PFC + LLC), Solar Micro-Inverters, Automotive Mechatronic Actuators, Industrial Sensorless BLDC Compressors, Functional Safety Motor Controllers (ASIL-B/C).
Field-Oriented Control (FOC) Motor Drives
The DSPIC33CH64MP202T-I/SS fits FOC motor drives because its 200 MHz slave core executes the 1-2 us current-control loop while the 180 MHz master core handles CAN-FD, UART, and user-interface tasks. The dedicated high-resolution PWM peripheral with 250 ps edge placement enables sinusoidal commutation at 20+ kHz switching frequency with sub-1% torque ripple. Integrated op-amps and comparators directly condition shunt-resistor current signals without external amplifiers. The dual-core partition lets designers separate the safety-relevant torque loop from non-safety communication, supporting ISO 26262 ASIL-B architectures in EV traction and industrial servo drives.
Recommended
Digital Power Conversion (PFC + LLC)
The DSPIC33CH64MP202T-I/SS suits bridgeless PFC and resonant LLC converters where the slave core runs the 50-100 kHz voltage-loop control and the master core manages housekeeping. The 200 MHz throughput supports average-current-mode PFC with input voltage feedforward and adaptive dead-time insertion via the high-resolution PWM. Built-in op-amps condition current-sense signals from the PFC inductor and LLC primary; built-in comparators enable cycle-by-cycle current limiting without external ICs. The 88 KB PRAM allows execution of state-machine code from RAM for deterministic sub-microsecond response to load transients.
Recommended
Solar Micro-Inverters
In solar micro-inverter designs, the DSPIC33CH64MP202T-I/SS slave core runs MPPT and grid-synchronization PLLs at 100 kHz, while the master core communicates with the DC optimizer over CAN-FD and executes anti-islanding algorithms. The FuSa features assist IEC 62109 safety compliance for photovoltaic power systems. The 64 KB Flash holds the grid-tie firmware plus MPPT library; 88 KB PRAM supports runtime reconfiguration between grid-tie and off-grid modes. Industrial temperature grade -40 to +85 C enables outdoor installation in NEMA-rated enclosures.
Recommended
Automotive Mechatronic Actuators
The DSPIC33CH64MP202T-I/SS serves throttle-by-wire, electronic power steering, and transmission valve controllers where the dual-core separation supports ISO 26262 ASIL-C decomposition. The slave core runs the safety-monitored torque or position loop at 200 MHz with hardware PWM fault inputs; the master core handles CAN-FD diagnostics and UDS over the same physical bus. Functional Safety features (windowed watchdog, dual-core lockstep option, CRC) accelerate ASIL compliance documentation. The 28-pin SSOP footprint fits actuator-mounted PCBs with limited board area.
Recommended
Industrial Sensorless BLDC Compressors
The DSPIC33CH64MP202T-I/SS drives sensorless BLDC compressors in HVAC and refrigeration where the slave core executes BEMF zero-cross detection and sliding-mode observer algorithms at sub-100 us cycle time. The 200 MHz throughput supports computationally intensive estimators that single-core dsPIC33 parts cannot achieve at the required loop rate. The master core manages Modbus RTU or CANopen over UART/CAN-FD and runs user-interface LEDs. The 3.0-3.6 V supply range and integrated op-amps simplify inverter-side current sensing on the SSOP-28 PCB.
Recommended
Functional Safety Motor Controllers (ASIL-B/C)
For ASIL-B/C classified motor controllers in industrial robotics and automation, the DSPIC33CH64MP202T-I/SS dual-core architecture provides heterogeneous redundancy: the slave core runs the safety-relevant torque loop while the master core runs the application logic with cross-checked diagnostics. FuSa peripherals (windowed watchdog, dual-core lockstep option, ECC on Flash and RAM, BIST) reduce the safety-case documentation effort. The 64 KB Flash holds the safety library plus application code; 88 KB PRAM supports runtime self-test routines. Industrial -40 to +85 C range suits factory-floor deployment.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33CH64MP202T-I/SS — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33CH128MP202T-I/SS | DSPIC33CH64MP202-E/SS | DSPIC33CH128MP202-I/SS | DSPIC33CH64MP202-I/SS |
|---|---|---|---|---|---|
| Package | 28-pin SSOP | 28-pin SSOP - same | 28-pin SSOP - same | 28-pin SSOP - same | 28-pin SSOP - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Architecture | dsPIC33CH dual-core | dsPIC33CH dual-core | dsPIC33CH dual-core | dsPIC33CH dual-core | dsPIC33CH dual-core |
| Slave Core Max Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash Memory | 64 KB | 128 KB (+100%) | 64 KB | 128 KB (+100%) | 64 KB |
| PRAM | 88 KB | 88 KB | 88 KB | 88 KB | 88 KB |
| Operating Temperature | -40 C to +85 C (Industrial) | -40 C to +85 C | -40 C to +125 C (Extended) | -40 C to +85 C | -40 C to +85 C |
| Packaging Form | Tape & Reel | Tape & Reel | Tube / Tray | Tray | Tray |
Key Differentiators
- Dual-core architecture at 200 MIPS aggregate throughput (vs DSPIC33CK64MC105-I/SS (single-core dsPIC33))
- 128 KB Flash upgrade available with identical SSOP-28 footprint (vs DSPIC33CH128MP202T-I/SS)
- Extended temperature grade option in same footprint (vs DSPIC33CH64MP202-E/SS)
Design Notes
The DSPIC33CH64MP202T-I/SS has two independent cores that share RAM, Flash, and peripherals. According to the dsPIC33CH family reference manual (DS70005357), shared-memory race conditions are a primary integration risk. Designers must use the inter-core mailbox primitives and disable interrupts around shared-buffer access on both cores, otherwise hard-fault debugging becomes very difficult. Mark shared regions with volatile and use the documented hardware semaphores for synchronization.
Place the 28-pin SSOP decoupling network as close to the VDD pin (pin 8) as possible. Use a 100 nF ceramic X7R bypass capacitor in parallel with a 4.7 uF bulk capacitor on the VDD supply. Place an additional 100 nF bypass on the analog VDD rail if used. The exposed thermal pad (if present in the SSOP variant) should connect to a copper pour of at least 0.5 square inch to maintain junction temperature below 125 C at full dual-core 200 MHz operation.
The high-resolution PWM (HRPWM) outputs on pins 12-19 have 250 ps edge resolution at 200 MHz but are sensitive to PCB track impedance. Route PWM outputs as 50 ohm microstrip with reference plane on layer 2; keep traces shorter than 50 mm to avoid reflections that manifest as PWM timing jitter. Gate-drive traces should be width-matched to the PWM pair (H/L) to minimize propagation skew below 2 ns.
Compliance Information
RoHS compliant per Microchip product page. Industrial -40 to +85 C temperature grade; AEC-Q100 grade not available in SSOP-28 - choose Q-grade dsPIC33CH variants for automotive.
