DSPIC33CK256MP508-I/PT - 100MHz 16-bit DSC, 256KB Flash | Microchip
MPN: DSPIC33CK256MP508-I/PT ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5.98 | $5.98 |
| 10 | $5.42 | $54.20 |
| 100 | $4.86 | $486.00 |
| 500 | $4.38 | $2,190.00 |
| 1,000 | $3.95 | $3,950.00 |
DSPIC33CK256MP508-I/PT Overview
A Digital Signal Controller combines the computational throughput of a Digital Signal Processor with the peripheral set and ease of use of a microcontroller, sitting in the hierarchy DSC -> 16-bit MCU/DSP -> embedded processor. DSCs are the preferred choice for closed-loop control systems such as digital power conversion and motor control, where deterministic interrupt latency and hardware DSP math (MAC, DSP engine) are essential.
Key features include a 100 MIPS dsPIC33CK DSC core operating from 3.0V to 3.6V, dual-partition Flash with Live Update for fail-safe field firmware upgrades, and a rich analog and timing peripheral set: 3 on-chip op-amps, 3 comparators, a 12-bit ADC, and high-resolution PWM with CAN Flexible Data (CAN FD) connectivity. The Mouser listing confirms the 3 OpAmp, 3 Comp, PTG, CAN-FD peripheral configuration.
The modified Harvard architecture with a dedicated DSP engine enables single-cycle MAC operations, while the Peripheral Trigger Generator (PTG) offloads sequencing tasks from the CPU. Memory Built-In Self-Test (MBIST) on the SRAM supports functional-safety oriented designs, and ECC on program Flash protects against bit errors in electrically noisy environments such as motor drive inverters.
Typical applications include digital power supplies (totem-pole PFC, LLC converters), brushless DC and PMSM motor control, solar micro-inverters, and high-end sensing and control systems that need CAN FD networking.
Design consideration: the device is rated -40C to +125C for the I temperature grade per the -40C to +150C family operating note in the datasheet; verify the grade suffix for your thermal environment, and plan power sequencing and the dual-partition Flash configuration early in the project.
This page synthesizes distributor pricing, drop-in alternatives, pin-level guidance, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for DSPIC33CK256MP508-I/PT — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33CK256MP508-I/PT (same form factor and footprint) — differing in Package, Operating Temperature, ADC, Program Memory (Flash), Architecture.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33CK256MP508-E/PT
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33CH256MP508-I/PT
✅ Drop-In✓ In Stock
$5.84 / Unit
View Datasheet →DSPIC33CH512MP508T-I/PT
✅ Drop-In✓ In Stock
$4.22 / Unit
View Datasheet →DSPIC33CH128MP508-E/PT
✅ Drop-In✓ In Stock
$3.4 / Unit
View Datasheet →DSPIC33CH512MP208-I/PT
✅ Drop-In✓ In Stock
$8.55 / Unit
View Datasheet →DSPIC33CK256MP508-I/PT Maximum Ratings & Electrical Characteristics
| Core | dsPIC33CK 16-bit DSC |
| Maximum CPU Speed | 100 MHz (100 MIPS) |
| Program Flash | 256 KB with ECC and Live Update (dual-partition) |
| Data SRAM | 24 KB with MBIST |
| Operating Voltage | 3.0 V to 3.6 V |
| Operating Temperature | -40C to +125C (I grade) |
| Architecture | Modified Harvard, single-core |
| On-chip Op-Amps | 3 |
| Comparators | 3 |
| PWM | High-Resolution PWM |
| CAN Interface | CAN FD |
| Peripheral Trigger Generator | Yes (PTG) |
| Package | 80-pin TQFP (12x12 mm) |
| Mounting Type | Surface Mount |
| Temperature Range Suffix | -I = -40C to +85C industrial / -E = -40C to +125C extended |
| RoHS Status | Compliant |
DSPIC33CK256MP508-I/PT 80-pin tqfp (12x12 mm) Pin Configuration Guide
Pin configuration for DSPIC33CK256MP508-I/PT (80-pin tqfp (12x12 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33CK256MP508-I/PT.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33CK256MP508-I/PT is suitable for 6 applications: Digital Power Supplies, BLDC/PMSM Motor Control, Industrial CAN FD Networking Nodes, Solar Micro-Inverters, Advanced Sensing and Control Systems, Development and Prototyping.
Digital Power Supplies
The DSPIC33CK256MP508-I/PT fits digital power conversion such as totem-pole PFC, LLC resonant converters, and bidirectional DC-DC stages because its 100 MHz core delivers the loop bandwidth these topologies demand and its high-resolution PWM provides sub-nanosecond effective PWM resolution for phase trimming. The 3 on-chip op-amps buffer current-shunt signals directly into the ADC, and the 3 comparators implement cycle-by-cycle overcurrent protection that trips the PWM hardware without CPU latency. Placed as the sole controller with the PWM outputs driving gate drivers, the device executes voltage- and current-mode compensation in DSP-fixed-point arithmetic with deterministic interrupt response. The dual-partition ECC Flash enables field firmware updates for grid-code compliance changes, a quantified benefit for products with 10+ year service lives.
Recommended
BLDC/PMSM Motor Control
For brushless DC and permanent-magnet synchronous motor drives, the DSPIC33CK256MP508-I/PT provides field-oriented control (FOC) at loop rates well above the electrical frequency of typical motors thanks to its 100 MIPS DSP engine with single-cycle MAC. The integrated 3 op-amps amplify low-side shunt phase currents into the ADC sampling window, eliminating external amplifier ICs and their offset mismatches, while the high-resolution PWM dead-time control minimizes distortion at low speeds. In a typical PMSM servo drive, the DSC reads rotor position from an encoder or sensorless observer, executes current/speed/position cascaded loops, and drives a three-phase inverter through the PWM peripherals. Microchip's MCLV-2 and MCHV-3 development boards (with the MA330041-2 PIM) provide reference implementations that reduce time to first spinning motor.
Recommended
Industrial CAN FD Networking Nodes
Industrial nodes that must join modern CAN FD buses benefit directly from the integrated CAN FD module of the DSPIC33CK256MP508-I/PT, which supports 64-byte payloads and higher data-phase bit rates than classical CAN without an external CAN FD controller. The 100 MHz core has ample headroom to run the application plus protocol stacks, while 256 KB ECC Flash stores firmware safely in electrically noisy factory environments. Typical deployments include sensor hubs, actuator controllers, and gateways bridging CAN FD to other fieldbuses. Using the dual-partition Live Update feature, fleet-deployed nodes can receive validated firmware upgrades over the bus without a service visit. Pair the DSC with a 3.3V or 5V CAN FD transceiver and a robust 3.3V supply for a compact, standards-compliant node design.
Recommended
Solar Micro-Inverters
Micro-inverter designs use the DSPIC33CK256MP508-I/PT to run maximum-power-point-tracking (MPPT), grid-synchronization, and inverter control loops concurrently on one 100 MHz core. The 12-bit ADC with the on-chip op-amps samples panel voltage/current and grid voltage with the precision needed for MPPT efficiency, while the high-resolution PWM generates the sinusoidal modulation for the power stage. The 3 comparators provide hardware anti-islanding and overcurrent protection paths with no CPU involvement, satisfying safety-critical response requirements. Because micro-inverters operate outdoors, selecting the -E extended temperature grade variant (DSPIC33CK256MP508-E/PT, -40C to +125C) in the same 80-pin TQFP footprint is a common design decision. Dual-partition Flash allows field updates if grid interconnection standards change over the product's 25-year design life.
Recommended
Advanced Sensing and Control Systems
High-end sensing systems - from precision flow meters to multi-axis industrial controllers - exploit the DSPIC33CK256MP508-I/PT combination of analog integration and DSP throughput. The 3 op-amps condition sensor signals (Wheatstone bridges, current shunts) into the ADC, the Peripheral Trigger Generator sequences ADC samples against PWM timing without CPU load, and the DSP engine applies digital filtering in real time. The 24 KB SRAM with Memory Built-In Self-Test (MBIST) supports designs that must demonstrate memory integrity, and ECC on program Flash protects code integrity in high-vibration or high-EMI installations. The 80-pin TQFP provides enough GPIO and communication peripherals (multiple UART/SPI/I2C instances plus CAN FD) to aggregate several sensor channels and report on one industrial network from a single controller.
Recommended
Development and Prototyping
Engineers evaluating the dsPIC33CK256MP508 family can prototype rapidly using Microchip's official development ecosystem. The dsPIC33CK256MP508 General Purpose PIM (MA330042) plugs into the Explorer 16/32 development board, while the EV62P66A Dual-Inline Module provides a standalone evaluation platform, and the MA330041-2 Internal OpAmp Motor Control PIM targets MCLV-2, MCHV-2, and MCHV-3 motor control boards. Because the PIMs carry the identical 80-pin TQFP device, code developed on the PIM transfers to production hardware without retargeting. Microchip's free MPLAB X IDE and MPLAB XC16 compiler support Live Update dual-partition debugging, letting teams validate fail-safe bootloader behavior before committing to PCB layout. This ecosystem shortens the path from concept to production firmware for digital power and motor control teams.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33CK256MP508-I/PT — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33CK256MP508-E/PT | DSPIC33CH256MP508-I/PT | DSPIC33CH512MP508T-I/PT | DSPIC33CH128MP508-E/PT | DSPIC33CH512MP208-I/PT |
|---|---|---|---|---|---|---|
| Package | 80-TQFP (12x12) | 80-TQFP (12x12) - same | 80-TQFP (12x12) - same | 80-TQFP (12x12) - same | 80-TQFP (12x12) - same | 80-TQFP (12x12) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Architecture | Single-core dsPIC33CK 100 MHz | Single-core dsPIC33CK 100 MHz | Dual-core dsPIC33CH (Master + Slave, 100 MHz) | Dual-core dsPIC33CH (Master + Slave, 100 MHz) | Dual-core dsPIC33CH (Master + Slave) | Dual-core dsPIC33CH (Master + Slave) |
| Program Flash | 256 KB (ECC, dual-partition) | 256 KB (ECC, dual-partition) | 256 KB (ECC, dual-partition) | 512 KB (ECC, dual-partition) | 128 KB (ECC) | 512 KB (ECC, dual-partition) |
| Temperature Grade | -I (industrial) | -E (extended, -40C to +125C) | -I (industrial) | -I (industrial) | -E (extended) | -I (industrial) |
| CAN FD | Yes | Yes | Yes | Yes | Yes | Yes |
| Firmware Porting Effort | Baseline | None - same die | Moderate - dual-core architecture | Moderate - dual-core architecture | Moderate + memory fit check (128 KB) | Moderate - dual-core architecture |
Key Differentiators
- Single-core determinism for hard real-time control (vs DSPIC33CH256MP508-I/PT)
- Extended temperature availability on identical footprint (vs DSPIC33CK256MP508-E/PT)
- Integrated analog (3 op-amps, 3 comparators) reduces BOM (vs DSPIC33CH128MP508-E/PT)
Design Notes
The DSPIC33CK256MP508-I/PT requires a 3.0V-3.6V supply. Decouple every VDD/VSS pin pair with 0.1 uF ceramic capacitors placed within 2 mm of the pins, plus one bulk 4.7-10 uF capacitor near the device. In motor-drive and digital-power boards, the controller supply should be derived from a low-noise LDO or filtered buck output; switching regulator ripple on VDD degrades ADC accuracy. Follow the power distribution guidance in the Microchip dsPIC33/PIC24 Family Reference Manual chapters cited by datasheet DS70005349H.
The 80-pin TQFP (12x12 mm, 0.5 mm pitch) needs careful fanout for analog performance. Keep the VDDCORE/VCAP decoupling per datasheet requirements and route high-resolution PWM outputs away from analog op-amp inputs to prevent PWM-induced offset in current-sense channels. Use a solid ground plane under the device and star-connect analog grounds. Do not route the CAN FD bus or gate-driver lines directly under the package.
Verify the temperature grade suffix: the -I (industrial) part differs from the -E (extended) part; both are the same die and footprint, so you can switch late in the project if thermal analysis demands it. Second, configure CONFIG bits for partitioned vs unpartitioned Flash deliberately - the Live Update feature requires dual-partition setup and a correct boot partition strategy; changing it after production makes field updates incompatible. Third, remember I/O is 3.3V only - 5V signals require level shifting.
Compliance Information
RoHS compliance per standard Microchip product page data; REACH and halogen-free status not stated in provided data.
