dsPIC33EP128GM310T-I/BG - 70 MIPS DSC, 128KB Flash | Microchip
MPN: DSPIC33EP128GM310T-I/BG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $7.62 | $7.62 |
| 10 | $6.9 | $69.00 |
| 100 | $6.21 | $621.00 |
| 500 | $5.6 | $2,800.00 |
| 1,000 | $5.05 | $5,050.00 |
DSPIC33EP128GM310T-I/BG Overview
A digital signal controller combines the compute throughput of a DSP with the peripheral integration and control architecture of a microcontroller. Within the embedded hierarchy, the dsPIC33E family sits above general-purpose 8-bit MCUs and alongside 16-bit MCUs, targeting real-time closed-loop control where multiply-accumulate (MAC) DSP instructions execute deterministic control loops such as field-oriented motor control and digital power conversion.
Key features include the 70 MIPS dsPIC33E core with integrated DSP engine, 12-channel motor control PWM (MCPWM), 8 input capture and 8 output compare channels, 2 quadrature encoder interfaces (QEI), 4 on-chip operational amplifiers, a Charge Time Measurement Unit (CTMU), and a Peripheral Trigger Generator (PTG) for autonomous peripheral sequencing. The integrated op-amps can amplify low-level current-shunt signals internally, reducing external component count in motor control and power-conversion front ends.
Architecturally, the device operates from 3V to 3.6V over an industrial temperature range of -40C to +85C, executing from zero-wait-state Flash with DSP-class addressing modes. The large peripheral set is serviced by DMA and flexible interrupt prioritization, keeping CPU bandwidth free for control algorithms. Enhanced peripherals such as the PTG allow trigger sequences without CPU intervention, a significant benefit in tightly timed switching applications.
Typical applications include precision BLDC and PMSM motor drives, digital power supplies (LLC, totem-pole PFC), industrial automation sensors, and embedded data-acquisition systems that benefit from the 12-channel MCPWM and on-chip analog amplification.
When designing with the 121-TFBGA package, ball-map signal planning and power-ball allocation deserve early attention; the fine-pitch BGA requires controlled-impedance PCB fabrication and X-ray inspection capability for rework.
This page synthesizes distributor pricing, same-package drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for DSPIC33EP128GM310T-I/BG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33EP128GM310-I/BG
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33EP256GM310T-I/BG
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP64GM310T-I/BG
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP128GM710T-I/BG
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP256GM710T-I/BG
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP128GM310T-I/BG Maximum Ratings & Electrical Characteristics
| Core | 16-bit dsPIC33E DSC |
| Maximum Operating Frequency | 70 MIPS |
| Flash Memory | 128KB (43K x 24) |
| RAM | 16KB |
| Supply Voltage | 3 V to 3.6 V |
| Operating Temperature | -40C to +85C |
| Package | 121-TFBGA (10x10 mm) |
| Mounting Type | Surface Mount |
| Motor Control PWM Channels | 12 MCPWM |
| Input Capture / Output Compare | 8 / 8 |
| Quadrature Encoder Interfaces | 2 QEI |
| On-chip Operational Amplifiers | 4 Op-Amps |
| Charge Time Measurement Unit | CTMU |
| Peripheral Trigger Generator | PTG |
| Product Series | dsPIC33EP128GM3xx |
DSPIC33EP128GM310T-I/BG 121-tfbga (10x10 mm) Pin Configuration Guide
Pin configuration for DSPIC33EP128GM310T-I/BG (121-tfbga (10x10 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EP128GM310T-I/BG.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EP128GM310T-I/BG is suitable for 6 applications: BLDC/PMSM Motor Drives, Digital Power Conversion, Industrial Automation and Sensing, Embedded Data Acquisition, Robotics and Servo Drives, Digital Audio and Signal Processing.
BLDC/PMSM Motor Drives
The dsPIC33EP128GM310T-I/BG is purpose-built for precision motor control: the 70 MIPS DSP core executes field-oriented control (FOC) loops at tens of kHz, the 12-channel MCPWM generates complementary three-phase PWM with hardware dead-time, and the dual QEI modules read rotary encoders directly. The 4 on-chip op-amps amplify low-level current-shunt signals internally, eliminating external amplifier stages and their offset/latency errors. In a typical FOC drive, MCPWM triggers the ADC at PWM center, current samples are amplified by the internal op-amps, and the DSP core completes the Clarke/Park transform and PI loops within one PWM period - a quantified benefit of the integrated DSP MAC engine versus a generic MCU.
Recommended
Digital Power Conversion
Digital LLC converters, totem-pole PFC stages, and DC-DC modules benefit from the dsPIC33EP128GM310T-I/BG's deterministic control timing. The PTG (Peripheral Trigger Generator) sequences ADC sampling and PWM updates autonomously, offloading the 70 MIPS core, while 8 output-compare channels provide auxiliary gating. The integrated op-amps condition current-sense signals for average-current-mode control with sub-microsecond latency. Because loop bandwidth in digital power is limited by sampling-to-PWM latency, the on-chip signal chain (op-amp to ADC to MCPWM) minimizes propagation delay versus discrete implementations, improving achievable crossover frequency and transient response in a 3.3V, -40C to +85C industrial environment.
Recommended
Industrial Automation and Sensing
Factory automation nodes use the dsPIC33EP128GM310T-I/BG where sensor signal conditioning and real-time control coexist. The CTMU (Charge Time Measurement Unit) enables precise capacitive and time-of-flight measurements for proximity and level sensing, while the 128KB Flash accommodates communication stacks (CAN, UART, SPI) alongside the control algorithm. Operating from -40C to +85C, the device suits unconditioned cabinet environments. The 8 input-capture channels timestamp external events with core-clock resolution for flow-metering and encoder counting applications, and the DSP library accelerates filtering of noisy industrial sensor data - a concrete throughput advantage of the 70 MIPS MAC-capable core over standard 16-bit MCUs.
Recommended
Embedded Data Acquisition
The dsPIC33EP128GM310T-I/BG integrates the complete acquisition chain: internal op-amps amplify millivolt-level signals, the CTMU supports precision time and charge measurements, and DSP instructions implement FIR/IIR filtering at 70 MIPS. The 16KB RAM buffers waveform segments, and DMA moves ADC results without CPU intervention, preserving bandwidth for processing. Compared with an MCU-plus-discrete-frontend design, integrating the analog front end reduces BOM count and board area in the 10x10 mm TFBGA. Typical uses include portable instrumentation, vibration monitoring, and multi-channel logging where 16-bit control-grade processing, industrial temperature range, and compact BGA integration justify the 3V to 3.6V single-rail design.
Recommended
Robotics and Servo Drives
Multi-axis servo systems leverage the dual QEI modules of the dsPIC33EP128GM310T-I/BG to close position loops on two encoders from a single controller, with 12 MCPWM channels driving two motors or a redundant three-phase bridge. The 70 MIPS core runs cascaded position/velocity/current loops on both axes within tight deadlines, while the PTG schedules time-critical trigger sequences deterministically. On-chip op-amps process resolver- or shunt-based current feedback. The 128KB Flash retains trajectory profiles and field-upgradable firmware. Tape-and-reel supply (T suffix) supports automated assembly of high-volume robot controller boards in the 121-TFBGA footprint.
Recommended
Digital Audio and Signal Processing
The 70 MIPS DSP engine with hardware MAC, bit-reversed addressing, and 40-bit accumulators makes the dsPIC33EP128GM310T-I/BG effective for real-time audio processing: active crossovers, speaker protection, and effect processing in embedded audio products. The integrated op-amps serve as line-level input buffers, the 8 input-capture channels measure PWM-encoded audio inputs, and Flash retains multiple DSP coefficient sets for field switching. Running from a single 3.3V rail at industrial temperatures suits powered speakers and installed-audio hardware. While not a replacement for dedicated audio DSPs at very high sample rates, the combination of control peripherals plus DSP throughput handles most mid-band embedded audio tasks in one 10x10 mm BGA.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EP128GM310T-I/BG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EP128GM310-I/BG | DSPIC33EP256GM310T-I/BG | DSPIC33EP64GM310T-I/BG | DSPIC33EP128GM710T-I/BG |
|---|---|---|---|---|---|
| Package | 121-TFBGA (10x10) | 121-TFBGA (10x10) - same | 121-TFBGA (10x10) - same | 121-TFBGA (10x10) - same | 121-TFBGA (10x10) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Performance | 70 MIPS 16-bit dsPIC33E | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Flash Memory | 128KB (43K x 24) | 128KB | 256KB (+100%) | 64KB (-50%) | 128KB |
| RAM | 16KB | 16KB | 16KB | 16KB | 16KB |
| Packaging Medium | Tape & Reel (T suffix) | Tray | Tape & Reel | Tape & Reel | Tape & Reel |
Key Differentiators
- Tape-and-reel supply for automated assembly (vs DSPIC33EP128GM310-I/BG)
- Flash headroom within the same footprint (vs DSPIC33EP256GM310T-I/BG)
- Cost-optimized memory point (vs DSPIC33EP64GM310T-I/BG)
Design Notes
The 121-TFBGA (10x10) uses fine-pitch BGA land patterns requiring controlled PCB fabrication. Follow the Microchip BGA layout guidelines: via-in-pad or dog-bone escape routing, a solid ground plane on layer 2 connected to ground balls with an array of vias, and solder-mask-defined pads per the datasheet land pattern. Rework requires X-ray inspection and a profiled BGA rework station - plan test points on escaped signals before layout freeze, since probing BGA balls directly is impractical.
Power the device from a clean 3V to 3.6V rail. Place 100 nF ceramic decoupling capacitors at each power-ball cluster plus bulk 10 uF per Microchip decoupling recommendations. All ADC and op-amp accuracy depends on AVDD cleanliness; isolate analog supply balls with an RC or ferrite filter from the digital 3.3V rail, especially when the same rail feeds gate-driver circuitry. A poor AVDD filter directly degrades the on-chip op-amp and CTMU measurements in motor-control front ends.
Most TFBGA balls are software-multiplexed via the Peripheral Pin Select scheme; verify the complete ball-to-peripheral map against the datasheet before routing, because swapping two muxed functions is a common and costly error in BGA designs. Also confirm Flash budget early: 128KB accommodates FOC plus CAN stacks, but adding bootloader plus field upgrades can exhaust it - if headroom is tight, move to the pin-compatible DSPIC33EP256GM310T-I/BG rather than compressing firmware.
Compliance Information
Compliance status not stated in the provided web data; verify on the Microchip product page or distributor compliance reports before design-in.
