DSPIC33EP128GM710-E/BG - 60 MIPS 16-bit DSC, 128KB Flash | Microchip
MPN: DSPIC33EP128GM710-E/BG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $7.9 | $7.90 |
| 10 | $7.35 | $73.50 |
| 100 | $6.72 | $672.00 |
| 500 | $6.18 | $3,090.00 |
| 1,000 | $5.71 | $5,710.00 |
DSPIC33EP128GM710-E/BG Overview
A digital signal controller combines the computational power of a DSP with the peripheral integration and ease of use of a microcontroller. Within the power-management hierarchy of embedded systems, the DSC sits between a general-purpose MCU and a dedicated DSP: it executes multiply-accumulate (MAC) and DSP instructions in a single cycle while retaining interrupt-driven control peripherals such as PWM modules, quadrature encoders, and motor-control-specific timers.
Key features include the 16-bit dsPIC33E Harvard-architecture core with DSP engine, on-chip 3.3V operation (3V to 3.6V supply), dual operational amplifiers, 4 quadrature encoder interfaces, 8 input capture and 8 output compare channels, and multiple serial communication interfaces including CAN. The GM710 variant specifically integrates 2 on-chip op-amps for current-sense amplification, reducing external BOM cost in motor-drive designs.
Architecturally, the dsPIC33EP core uses CMOS technology with a pipelined execution unit supporting fixed-point DSP arithmetic at 60 MHz operation. The 43K x 24 instruction-word Flash organization supports an MCU+DSP dual-memory model, and the peripheral ecosystem is shared across the dsPIC33EP family, simplifying firmware migration between memory densities.
Typical applications include precision brushless DC and PMSM motor control for industrial drives, automotive subsystems (the device is specified for automotive use per distributor data), digital power conversion, and sensor signal conditioning where the integrated op-amps directly amplify shunt-current signals.
When designing with this device, plan the 121-ball BGA layout early: ball-pitch fanout requires at least 4-layer PCB stack-up with via-in-pad or dogbone breakout, and the 3V-3.6V supply range demands a tight regulator tolerance.
This page synthesizes distributor pricing, family drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for DSPIC33EP128GM710-E/BG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EP128GM710-E/BG (same form factor and footprint) — differing in Core, Package, Supply Voltage, Mounting Type, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33EP256GM710-E/BG
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP512GM710-E/BG
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$6.3 / Unit
View Datasheet →DSPIC33EP64GM710-E/BG
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP128GM710T-E/BG
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33EP128GM710-H/BG
✅ Drop-In✓ In Stock
$1 / Unit
View Datasheet →DSPIC33EP128GM710-E/BG Maximum Ratings & Electrical Characteristics
| Core | dsPIC33E 16-bit |
| CPU Speed | 60 MIPS (60 MHz) |
| Core Family Max Speed | 70 MIPS |
| Program Memory (Flash) | 128 KB (43K x 24) |
| RAM | 16 KB |
| Supply Voltage | 3 V to 3.6 V |
| Operating Temperature | -40C to +125C |
| Package | 121-TFBGA (10x10 mm) |
| Mounting Type | Surface Mount |
| Input Capture Channels | 8 |
| Output Compare Channels | 8 |
| Quadrature Encoder Interfaces (QEI) | 4 |
| On-chip Op-Amps | 4 |
| Motor Control PWM | Yes (Motor Control peripherals) |
| CAN Interface | Yes |
| Architecture | Harvard, fixed-point DSP, CMOS |
| Automotive Qualification | Yes (automotive-specified per distributor data) |
DSPIC33EP128GM710-E/BG 121-tfbga (10x10 mm) Pin Configuration Guide
Pin configuration for DSPIC33EP128GM710-E/BG (121-tfbga (10x10 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EP128GM710-E/BG.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EP128GM710-E/BG is suitable for 6 applications: Precision Motor Control (FOC/PMSM), Automotive Subsystems, Digital Power Conversion, Multi-Axis Motion and Robotics, Industrial Sensing and Condition Monitoring, Audio and Signal Processing Modules.
Precision Motor Control (FOC/PMSM)
The DSPIC33EP128GM710-E/BG fits brushless DC and PMSM field-oriented control because its 60 MIPS 16-bit DSP core executes single-cycle MAC and division for Clarke/Park transforms within typical 10-20 kHz current loops. Four quadrature encoder interfaces support multi-axis feedback, while the on-chip op-amps amplify shunt currents directly, cutting external amplifier count. Use 8 output compare channels or the motor-control PWM for complementary gate drive, with dead-time inserted in hardware. Placed as the single controller between position sensors and gate drivers, it delivers deterministic interrupt latency; the main trade-off is 3.3V-only I/O requiring level translation to 5V gate-driver logic.
Recommended
Automotive Subsystems
Distributor data classifies the DSPIC33EP128GM710-E/BG as an automotive-specified DSC, and its -40C to +125C operating range covers under-hood-adjacent modules such as pump controllers, throttle actuators, and fan drives. The 60 MIPS core runs sensor fusion and diagnostic tasks, while the CAN interface integrates the node into vehicle networks. The 121-ball BGA provides dense I/O for switch monitoring and H-bridge control in a compact 10x10 mm footprint suited to constrained ECU enclosures. For formal PPAP and AEC-Q100 documentation requirements, confirm grade designation with Microchip; the -E suffix addresses the temperature grade that most 12V-adjacent modules require.
Recommended
Digital Power Conversion
In digital SMPS, PFC, and inverter stages, the DSPIC33EP128GM710-E/BG closes control loops at 60 MIPS using hardware output compares for phase-shifted PWM and 8 input captures for timing synchronization. The 3V-3.6V core tolerates the noisy ground environment typical of power stages when VDD decoupling is rigorous. Integrated op-amps condition current-transformer or shunt signals before the ADC path, and CAN or UART links support PMBus-style supervisory communication. The 121-BGA's many I/O enable per-phase gating and fault latching; the key design consideration is keeping the fast analog front-end ball assignments physically separated from switching-node traces on the PCB.
Recommended
Multi-Axis Motion and Robotics
Robotics controllers benefit from the GM710's four quadrature encoder interfaces, which decode four motor encoders simultaneously in hardware without CPU overhead - a distinctive advantage over controllers with one or two QEI modules. At 60 MIPS, the DSPIC33EP128GM710-E/BG runs coordinated motion profiles plus kinematics for multi-DOF arms, while 8 input capture and 8 output compare channels handle limit switches and PWM outputs. The 121-ball package supplies sufficient GPIO for end-stop sensing, communication, and auxiliary actuators. Its -40C to +125C range also suits industrial cobots that see wide ambient swings inside sealed housings.
Recommended
Industrial Sensing and Condition Monitoring
The DSPIC33EP128GM710-E/BG serves vibration and current-signature condition-monitoring nodes where DSP processing - FFT, filters, envelope detection - runs on-device at 60 MIPS rather than streaming raw data upstream. Its integrated op-amps amplify sensor signals directly, and the 16KB RAM buffers acquisition windows for batch processing. The wide -40C to +125C range suits outdoor cabinets and machine interiors, and the CAN/UART interfaces publish results to SCADA or PLC networks. The 121-BGA footprint enables a compact single-controller design; designers should budget for at least a 4-layer PCB to fan out the dense ball field cleanly.
Recommended
Audio and Signal Processing Modules
Fixed-point audio processing - filters, AGC, codec control - maps naturally to the DSPIC33EP128GM710-E/BG's single-cycle MAC engine at 60 MIPS, comfortably handling 48 kHz stereo pipelines with headroom. The 128KB Flash holds application firmware plus coefficient tables, and 16KB RAM implements delay lines and filter states. On-chip op-amps can buffer microphone or line-level inputs ahead of conversion, reducing external component count in compact modules. The 121-ball BGA integrates the DSC with UART/SPI-connected codecs in a small 10x10 mm area, making it practical for embedded loudspeaker management and industrial intercom designs.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EP128GM710-E/BG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EP256GM710-E/BG | DSPIC33EP512GM710-E/BG | DSPIC33EP64GM710-E/BG | DSPIC33EP128GM710T-E/BG |
|---|---|---|---|---|---|
| Package | 121-TFBGA (10x10 mm) | 121-TFBGA (10x10 mm) - same | 121-TFBGA (10x10 mm) - same | 121-TFBGA (10x10 mm) - same | 121-TFBGA (10x10 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Flash | 128 KB (43K x 24) | 256 KB | 512 KB | 64 KB | 128 KB |
| CPU Speed | 60 MIPS (60 MHz) | 60 MIPS (60 MHz) | 60 MIPS (60 MHz) | 60 MIPS (60 MHz) | 60 MIPS (60 MHz) |
| Core | 16-bit dsPIC33E | 16-bit dsPIC33E | 16-bit dsPIC33E | 16-bit dsPIC33E | 16-bit dsPIC33E |
| Supply Voltage | 3 V to 3.6 V | 3 V to 3.6 V | 3 V to 3.6 V | 3 V to 3.6 V | 3 V to 3.6 V |
| Operating Temperature | -40C to +125C (E suffix) | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C |
Key Differentiators
- Four quadrature encoder interfaces on-chip (vs DSPIC33CK64MP502T-I/SS)
- Largest Flash option in the same footprint (vs DSPIC33EP512GM710-E/BG)
- Extended -40C to +125C grade in BGA (vs DSPIC33EP64GM710-E/BG)
- BGA I/O density vs TQFP family members (vs DSPIC33EP128GM306-E/PT)
Design Notes
The 121-ball TFBGA (10x10 mm) requires a controlled fanout strategy. At 0.8 mm-class ball pitch, use dogbone breakout with 0.25-0.3 mm vias or via-in-pad with filled caps on a 4-layer minimum stack-up. Reserve inner layers for a solid ground plane to keep the 60 MIPS core noise contained. Estimated: a 10x10 mm BGA with ~121 balls fanouts within roughly 16x16 mm of routing keep-out on each side - plan component placement around this zone early in layout.
Supply the DSPIC33EP128GM710-E/BG from a 3.0-3.6V rail only (nominal 3.3V). Place 0.1uF ceramics at every VDD/VSS ball pair plus one bulk 10uF near the package. Because BGA pins are invisible after assembly, verify power integrity at the regulator output with a scope under 60 MIPS load transients before first programming - a sagging rail is the most common cause of unexplainable BGA boot failures.
Use the peripheral pin select feature to route high-speed signals (QEI, PWM) to balls on the package perimeter rather than the center rows, shortening escape routing. For the integrated op-amp and ADC paths, keep analog ball assignments isolated from switching PWM traces with a local analog ground pour connected at one point to the main ground plane.
Firmware written for smaller dsPIC33EP parts migrates cleanly to the GM710 family, but verify the configuration-bit word and clock setup: this device runs 60 MIPS in the -E/-I grade and the family core max is 70 MIPS. Also confirm memory models in the linker script when dropping in the 64KB or 512KB Flash family variants, since Flash base addresses and code-page sizes change with density.
Compliance Information
Distributor data (findics.us) classifies the device as automotive-specified; formal RoHS/REACH/AEC-Q100 status must be confirmed on the official Microchip product page or product identification card.
