DSPIC33EP256GM310-E/PT - 16-bit DSC 60 MIPs 256KB TQFP-100 | Microchip
MPN: DSPIC33EP256GM310-E/PT ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $7.2 | $7.20 |
| 10 | $6.55 | $65.50 |
| 100 | $5.9 | $590.00 |
| 500 | $5.4 | $2,700.00 |
| 1,000 | $4.95 | $4,950.00 |
DSPIC33EP256GM310-E/PT Overview
A digital signal controller combines the compute architecture of a microcontroller with the multiply-accumulate (MAC) DSP engine of a digital signal processor. Within the power management hierarchy of embedded systems, the DSC sits between general-purpose MCUs and dedicated DSPs, making it the dominant architecture for closed-loop control tasks such as field-oriented motor control, digital power conversion, and sensor fusion, where deterministic interrupt latency and hardware math acceleration matter more than raw clock speed.
Key features of this part include the enhanced dsPIC33E core with DSP instruction support, an extensive peripheral set covering motor-control PWM, input capture, quadrature encoder interface, and integrated operational amplifiers for current sensing, plus multiple UART, SPI, and I2C communication modules. The 256KB self-programmable Flash supports field firmware updates, and the 16KB RAM provides headroom for control-loop state and communication buffers.
The -E temperature grade (-40C to +125C) and AEC-Q100-capable automotive qualification of the dsPIC33EP256GM310 family make this suffix suitable for under-hood and other harsh-environment electronics, while the GM (general-purpose with op-amps) peripheral variant integrates analog amplifiers that reduce external component count in current-sense front ends.
Typical applications include brushless DC and PMSM motor drives, digital SMPS and power-factor-correction stages, automotive body and powertrain auxiliary modules, and industrial sensing and automation nodes that require DSP-grade math with MCU-class integration.
A key design consideration: the dsPIC33EP core requires a stabilized internal 2.5V supply via an external low-ESR capacitor on the VCAP/VDDCORE pin, and Flash erase/write endurance must be respected when logging data to program memory. Decouple all VDD/VSS pin pairs with 0.1uF ceramics placed within 2 mm of the pins.
This page synthesizes distributor stock data, drop-in family alternatives, and practical design guidance not consolidated in the manufacturer datasheet, with pricing and availability refreshed as of 2026-09-24.
Drop-in alternatives for DSPIC33EP256GM310-E/PT — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EP256GM310-E/PT (same form factor and footprint) — differing in Core Architecture, Package, Core Processor, Supply Voltage, Qualification.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33EP256GM310-I/PT
✅ Drop-In✓ In Stock
$4.18 / Unit
View Datasheet →DSPIC33EP512GM310-E/PT
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$6.55 / Unit
View Datasheet →DSPIC33EP128GM310-E/PT
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP256GM710-E/PT
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$5.65 / Unit
View Datasheet →DSPIC33EP256MC310-E/PT
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP256GM310-E/PT Maximum Ratings & Electrical Characteristics
| Core Architecture | 16-bit dsPIC33EP Harvard |
| Max CPU Speed | 60 MIPs |
| Program Memory (Flash) | 256KB (85.5K x 24) |
| RAM | 16KB |
| Supply Voltage | 3.3 V |
| Package | 100-TQFP (12x12 mm) |
| Operating Temperature | -40C to +125C (E grade) |
| Qualification | Automotive, AEC-Q100 |
| Series | dsPIC33EP256GM310 |
| Mounting Type | Surface Mount |
| Packaging | Tray |
| Integrated Op Amps | Yes (per family datasheet) |
| Motor Control PWM | Yes (per family datasheet) |
| Quadrature Encoder Interface | Yes (per family datasheet) |
| Timers IC/OC | 8/8 (family configuration) |
DSPIC33EP256GM310-E/PT 100-tqfp (12x12 mm) Pin Configuration Guide
Pin configuration for DSPIC33EP256GM310-E/PT (100-tqfp (12x12 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EP256GM310-E/PT.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EP256GM310-E/PT is suitable for 6 applications: BLDC / PMSM Motor Control, Automotive Body and Powertrain Auxiliary Modules, Digital Power Conversion (SMPS / PFC / Inverters), Industrial Automation and Sensor Acquisition, Test and Measurement Instrumentation, Appliance and HVAC Control.
BLDC / PMSM Motor Control
The DSPIC33EP256GM310-E/PT fits sensorless and sensored motor drives because its 60 MIPs dsPIC33E core executes field-oriented control (FOC) loops in tens of microseconds while the integrated op-amps condition shunt or in-line current-sense signals with no external amplifier stage. The motor-control PWM and quadrature encoder interface peripherals handle complementary gate drive timing and rotor position feedback directly. Designers place the DSC between a gate driver (such as the MIC4104 class parts) and the inverter bridge, sampling current every PWM cycle at 20-50 kHz carrier frequencies. The 256KB Flash stores multiple control-law profiles and field-upgradable firmware. Trade-off: the -E grade sustains -40C to +125C under-hood ambients, at a price premium over the -I industrial variant.
Recommended
Automotive Body and Powertrain Auxiliary Modules
The -E/PT ordering code combines the -40C to +125C extended temperature rating with AEC-Q100-capable family qualification, targeting automotive pump controllers, HVAC actuators, throttle and wiper drives, and lighting modules. The 256KB self-programmable Flash supports end-of-line calibration data storage and OTA-style field updates, while the 16KB RAM buffers LIN/CAN communication stacks. In a typical module, the DSC runs the control loop and diagnostic monitor ( watchdog, plausibility checks) on the same core, with the GM-series op-amps reading ratiometric position sensors. Compared with a discrete MCU-plus-op-amp solution, integration cuts BOM count and qualification surface area. Verify the exact AEC-Q100 grade against Microchip's current qualification summary for the specific program.
Recommended
Digital Power Conversion (SMPS / PFC / Inverters)
Digital switch-mode power supplies and power-factor-correction stages benefit from the DSC's deterministic DSP engine: multiply-accumulate instructions execute compensator math (PI, 3p3z) inside every switching period at 100-500 kHz control rates. The 12-bit ADC pipeline and flexible trigger structure align sampling precisely with PWM events, minimizing switching-noise corruption of current measurements, while integrated op-amps amplify shunt voltages ahead of the ADC. The 256KB Flash holds multiple firmware profiles for wide-input products (universal AC rectification, solar micro-inverters, telecom rectifiers). Unlike fixed-function controllers, firmware enables adaptive gain scheduling and soft fault recovery. Design consideration: budget core-headroom for ISR latency, and use the peripheral pin select to keep analog channels away from PWM-switched pins.
Recommended
Industrial Automation and Sensor Acquisition
Factory automation nodes use the DSPIC33EP256GM310-E/PT to fuse multiple sensor streams - quadrature encoder counting for motion feedback, input-capture for ultrasonic or Hall timing, and op-amp-conditioned analog channels for pressure, temperature, and load cells. The 16-bit core performs FFT or RMS computations in firmware that a conventional 8-bit MCU cannot sustain at line rates, and multiple UART/SPI/I2C modules bridge Modbus, RS-485, and isolated field buses. The 100-pin TQFP provides ample GPIO for relay drivers, HMI lines, and status indicators in a single controller. The 256KB Flash accommodates protocol stacks plus data logging. For network-heavy nodes, pair with an external CAN transceiver at the physical layer.
Recommended
Test and Measurement Instrumentation
Bench instruments, battery analyzers, and handheld meters exploit the DSC's DSP capability for true-RMS computation, digital filtering, and waveform triggering in real time. The 60 MIPs core sustains kilosample-per-second control and processing loops while UART and USB-bridge links stream results to a host, and the 256KB Flash stores calibration tables and multi-language UI resources. Integrated op-amps amplify low-level signals from shunts and thermocouples, trimming front-end component count in portable designs where board space dominates cost. The -E grade extends reliability for instruments used outdoors or adjacent to heat sources. Note that analog channels share the op-amp pool, so assign channels to avoid peripheral contention in multi-channel instruments.
Recommended
Appliance and HVAC Control
High-end appliances and HVAC systems increasingly use variable-speed BLDC compressors, fans, and pumps, which is precisely the workload the DSPIC33EP256GM310-E/PT was architected for: one DSC runs the sensorless FOC motor loop, the user-interface scan, and the communications interface (UART to Wi-Fi modules or Zigbee stacks) concurrently via prioritized interrupts. The extended -40C to +125C rating survives rooftop condenser and oven-adjacent ambients, while integrated op-amps read compressor current for stall and leak detection. The 100-pin package supplies enough I/O for keypads, displays, and relays without an expansion MCU. Compared with discrete MCU plus driver solutions, this integration shortens EMC qualification by reducing the radiating trace count.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EP256GM310-E/PT — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EP256GM310-I/PT | DSPIC33EP512GM310-E/PT | DSPIC33EP128GM310-E/PT | DSPIC33EP256GM710-E/PT | DSPIC33EP256MC310-E/PT |
|---|---|---|---|---|---|---|
| Package | 100-TQFP (12x12 mm) | 100-TQFP (12x12 mm) - same | 100-TQFP (12x12 mm) - same | 100-TQFP (12x12 mm) - same | 100-TQFP (12x12 mm) - same | 100-TQFP (12x12 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 256KB | 256KB | 512KB | 128KB | 256KB | 256KB |
| Core Speed | 60 MIPs | 60 MIPs | 60 MIPs | 60 MIPs | 60 MIPs | 60 MIPs |
| Operating Temperature | -40C to +125C (E) | -40C to +85C (I) | -40C to +125C (E) | -40C to +125C (E) | -40C to +125C (E) | -40C to +125C (E) |
| Integrated Op Amps | Yes (GM variant) | Yes | Yes | Yes | Yes | No (MC variant - HR PWM instead) |
| Automotive Capability | AEC-Q100-capable family, -E grade | Industrial grade only | AEC-Q100-capable family, -E grade | AEC-Q100-capable family, -E grade | AEC-Q100-capable family, -E grade | AEC-Q100-capable family, -E grade |
| Distinct Feature | Op-amps + automotive temp, 256KB | Lowest-cost identical die | 2x Flash headroom | Cost-optimized Flash | Dual CAN modules | High-resolution motor PWM |
Key Differentiators
- Extended -40C to +125C automotive-grade temperature rating (vs DSPIC33EP256GM310-I/PT)
- Integrated operational amplifiers on-chip (vs DSPIC33EP256MC310-E/PT)
- 100-pin TQFP with maximum family I/O count (vs DSPIC33EP128GP502-E/SS)
- Trade-off: 60 MIPs single core (vs DSPIC33CK512MP606T-I/PT)
Design Notes
The dsPIC33EP core regulator requires a dedicated low-ESR (about 0.1 to 10 ohm) ceramic capacitor, typically around 10 uF, on the VCAP/VDDCORE pin to stabilize the internal 2.5V rail. Do not connect an external supply to VCAP. Decouple every VDD/VSS pair with 100 nF ceramics placed within 2 mm of the pins, and tie AVDD/AVSS to a quiet analog supply with an RC or ferrite filter to preserve ADC accuracy. Estimated: with a 60 MIPs core, active current is in the tens of mA range, so a single 3.3V LDO input rail is generally sufficient for the digital domain.
Use the Peripheral Pin Select (PPS) system during layout planning to route PWM outputs away from analog traces and to cluster high-speed UART/SPI lines near connector exits. Keep the crystal/oscillator loop compact with ground guard traces, and provide the datasheet-required minimum pin connections (MCLR pull-up 10k, AVDD/AVSS local, VCAP) before first power-up. For the 100-pin TQFP (0.5 mm pitch), use 4-mil trace/space and consider a 4-layer stack with a solid ground plane to control return paths for motor-control PWM edges.
Three frequent issues: (1) Flash endurance - writing calibration logs to program memory consumes erase cycles; reserve a dedicated erase page and wear-level writes. (2) Configuration bits - oscillator selection and watchdog settings live in config words that a blank device does not inherit; a wrong oscillator config leaves the chip seemingly dead. (3) Temperature suffix mix-ups - the -I/PT will function electrically in an -E/PT socket but is not rated above +85C, a silent reliability risk in automotive builds. Always re-verify the ordering-code suffix at incoming inspection.
Compliance Information
Distributor listings (findic.us, Hotenda) identify the part as Automotive, AEC-Q100 within the dsPIC33EP256GM310 series. RoHS/lead-free status was not stated verbatim in the verified data and should be confirmed via Microchip's certificate of compliance.
