DSPIC33FJ128GP710A-H/PT - 16-bit 40 MIPS DSC 128KB Flash | Microchip
MPN: DSPIC33FJ128GP710A-H/PT ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $7.95 | $7.95 |
| 10 | $7.15 | $71.50 |
| 100 | $6.45 | $645.00 |
| 500 | $5.85 | $2,925.00 |
| 1,000 | $5.25 | $5,250.00 |
DSPIC33FJ128GP710A-H/PT Overview
A digital signal controller is a hybrid class of semiconductor that merges the deterministic control architecture of a microcontroller with the mathematical acceleration of a digital signal processor. Within the power-management and embedded-processing hierarchy, the dsPIC33F family sits above basic PIC16/PIC18 MCUs and parallel to PIC24H 16-bit microcontrollers, offering single-cycle MAC, hardware divide, and DSP instructions while remaining pin compatible with the PIC24H family and highly compatible with the dsPIC30F family for easy migration.
Key features of this device include 40 MIPS instruction throughput, 128KB self-programmable Flash with in-system programming capability, rich analog integration, and a broad peripheral set including multiple UART, SPI, and I2C ports, motor-control and general-purpose PWM modules, input capture and output compare channels, a high-speed ADC, and DMA controllers that offload data movement from the CPU core.
Architecturally, the dsPIC33FJ128GP710A uses a modified Harvard 16-bit core with a 16-bit data path and dedicated DSP engine supporting single-cycle multiply-accumulate operations. The A-suffix devices incorporate Microchip silicon revisions improving peripheral behavior over the original dsPIC33FJ128GP710. The GP (General Purpose) family variant balances analog and communication peripherals for general embedded signal processing rather than motor-control-centric designs.
Typical applications include industrial automation and control panels, power conversion and digital power supplies, sensory and signal-conditioning endpoints, and general-purpose embedded systems that need DSP capability without a separate DSP chip. The 100-pin TQFP provides generous GPIO for display, keypad, and communication interfacing.
For design, plan the clock architecture early: with the internal PLL, the device reaches its full 40 MIPS rating; external crystal designs should budget PCB layout for oscillator routing and decoupling close to the VDD/AVDD pins.
This page synthesizes distributor pricing, drop-in alternatives, design notes, and application guidance not found in the manufacturer datasheet.
Drop-in alternatives for DSPIC33FJ128GP710A-H/PT — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33FJ128GP710A-I/PT
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33FJ128GP710A-E/PT
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33FJ128GP710A-H/PF
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33FJ256GP710A-H/PT
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$6.4 / Unit
View Datasheet →DSPIC33FJ128GP710-H/PT
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33FJ128GP710A-H/PT Maximum Ratings & Electrical Characteristics
| Core Architecture | 16-bit dsPIC33F (DSC) |
| Maximum Speed | 40 MIPS |
| Program Memory | 128KB (128K x 8) Flash |
| Supply Voltage | 3.3 V |
| Package | 100-TQFP (12x12 mm) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +150C (H grade, per Microchip H temperature designation) |
| Family | dsPIC 33F General Purpose (GP) |
| Pin Count | 100 |
| Communication Interfaces | UART, SPI, I2C |
| Analog Peripherals | Integrated ADC |
| Timers / PWM | Output Compare / PWM modules, Input Capture |
| DMA | Yes |
| In-System Programming | Yes (Flash self-programmable) |
| Series | dsPIC33FJ128GP710A |
DSPIC33FJ128GP710A-H/PT 100-tqfp (12x12 mm) Pin Configuration Guide
Pin configuration for DSPIC33FJ128GP710A-H/PT (100-tqfp (12x12 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33FJ128GP710A-H/PT.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33FJ128GP710A-H/PT is suitable for 6 applications: Industrial Automation and Control, Digital Power Conversion, Sensory and Signal Conditioning Systems, General Purpose Embedded Systems, Test and Measurement Instrumentation, Motor Drive and Motion Control辅助 Systems.
Industrial Automation and Control
The DSPIC33FJ128GP710A-H/PT fits industrial control nodes that must combine deterministic 40 MIPS throughput with rich communication. Its multiple UART, SPI, and I2C ports connect PLC backplanes, HMI panels, and sensor buses, while output-compare PWM channels drive actuators and its integrated ADC digitizes process variables. The 128KB Flash accommodates substantial protocol stacks and control state machines without external memory, and DMA offloads data transfers so the core stays responsive. In factory environments, the high-temperature H-grade option supports enclosure-mounted electronics near heat sources. Designers typically clock the device via external crystal with PLL for timing-critical sequencing, and use ICSP (PGD/PGC) for field firmware updates through the production test header.
Recommended
Digital Power Conversion
Digital power supplies, inverters, and PFC stages benefit directly from this DSC's DSP engine and control peripherals. The single-cycle multiply-accumulate capability executes PID and compensator loops at high sampling rates, while the fast ADC and PWM modules form a tight voltage/current control loop with microsecond-level response. The 3.3V core keeps logic compatible with modern gate-driver ICs, and the 100-pin package provides enough GPIO for fault latching, telemetry (UART/CAN-equivalent via UART), and housekeeping I/O. Because loop latency determines converter performance, designers map ADC trigger-to-PWM-update paths using DMA and peripheral pin select to minimize software overhead. The -H temperature grade suits power supplies mounted near heat-generating stages.
Recommended
Sensory and Signal Conditioning Systems
Sensor hubs and conditioning endpoints use the DSPIC33FJ128GP710A-H/PT where raw sensor signals need filtering, scaling, and decision logic on one chip. The integrated ADC samples analog channels, the DSP instructions implement IIR/FIR filtering and FFT-based analysis at 40 MIPS, and the 128KB Flash stores calibration tables and compensation algorithms. Multiple communication ports stream processed data over UART or SPI to host systems, while DMA keeps sample streams continuous without CPU intervention. Compared to an MCU-plus-external-DSP two-chip approach, this single-chip design reduces BOM cost, board area, and inter-chip latency. The generous GPIO of the 100-pin TQFP also supports relay drivers and local indication in measurement instruments.
Recommended
General Purpose Embedded Systems
For general embedded products that outgrow 8-bit MCUs, this DSC offers a straightforward migration path. Microchip documents that the dsPIC33F family is pin compatible with the PIC24H family and highly compatible with dsPIC30F devices, so existing code and board layouts migrate with minimal rework. The 40 MIPS core handles UI, communication, and control concurrently, the 100-pin TQFP supplies abundant remappable I/O for keypads, displays, and peripherals, and 128KB Flash hosts feature-rich firmware. Development uses the low-cost Explorer 16/32 board with a PIM for this device family, plus MPLAB X and the XC16 compiler, keeping prototyping expense low. High-temperature H-grade availability broadens deployment into warm enclosures.
Recommended
Test and Measurement Instrumentation
Bench instruments, data loggers, and handheld meters exploit this controller's balanced analog, timing, and communication resources. Input-capture channels timestamp external events with core-clock resolution, output-compare modules generate stimulus waveforms, and the ADC digitizes measured signals for on-chip processing - RMS computation, averaging, and limit checking run efficiently using DSP instructions. The multiple UART/SPI/I2C ports interface displays, front-panel encoders, and PC connectivity, while 128KB Flash supports feature sets and logged data buffering. The 100-pin TQFP offers the I/O breadth typical of instrument mainboards. Sampling determinism is preserved by DMA-driven ADC sequencing, and the ICSP port allows firmware field updates after deployment.
Recommended
Motor Drive and Motion Control辅助 Systems
Although the GP (General Purpose) variant of the dsPIC33FJ128GP710A emphasizes balanced analog and communication peripherals rather than the MC (motor control) family's specialized PWM, it still serves auxiliary and light-duty motion roles: the output-compare/PWM modules drive low-complexity actuators, DC fans, and stepper drivers, while the ADC reads position sensors and current shunts. The 40 MIPS core executes commutation and supervisory loops, and communication ports link to a drive's master controller. For high-channel-count BLDC/PMSM drives, Microchip's dsPIC33FJ MC-family parts are the recommended choice, but for actuator supervision, handshaking, and coordination logic inside the same footprint, this GP DSC is cost-effective. The H-grade supports drive enclosures with elevated ambient temperature.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33FJ128GP710A-H/PT — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33FJ128GP710A-I/PT | DSPIC33FJ128GP710A-E/PT | DSPIC33FJ128GP710A-H/PF | DSPIC33FJ256GP710A-H/PT |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-TQFP (12x12 mm) | 100-TQFP (12x12 mm) - same | 100-TQFP (12x12 mm) - same | 100-TQFP (12x12 mm) - same | 100-TQFP (12x12 mm) - same |
| Program Flash | 128KB | 128KB | 128KB | 128KB | 256KB |
| Max Speed | 40 MIPS | 40 MIPS | 40 MIPS | 40 MIPS | 40 MIPS |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Temperature Grade | -H (high temperature, per Microchip H designation) | -I industrial (-40C to +85C) | -E extended (-40C to +125C) | -H (same as this product) | -H (same as this product) |
| Silicon Revision | A (revised stepping) | A | A | A | A |
| Packaging Option | Tape & Reel (/PT) | Tape & Reel | Tape & Reel | Tray (/PF) | Tape & Reel |
Key Differentiators
- High-temperature H-grade availability (vs DSPIC33FJ128GP710A-I/PT)
- 2x program memory option in the same footprint (vs DSPIC33FJ256GP710A-H/PT)
- A-revision silicon with resolved errata (vs DSPIC33FJ128GP710-H/PT)
Design Notes
The dsPIC33FJ128GP710A is a 3.3V single-supply device. Provide separate, well-filtered VDD/AVDD domains: place a 0.1uF ceramic capacitor at each VDD/VSS pin pair plus bulk 10uF, and isolate AVDD with an RC or ferrite filter from the digital rail so the ADC reference stays quiet. Estimated: with typical 16-bit DSC core current of tens of milliamps at 40 MIPS, total board consumption stays well under 100 mA - size the 3.3V regulator accordingly. Check exact ICC values in the manufacturer datasheet electrical characteristics section.
The 100-TQFP (12x12 mm) has 0.5 mm pin pitch; design the land pattern to the manufacturer-recommended footprint and route oscillator traces (OSC1/OSC2) short and guarded by ground when using an external crystal. Decouple every VDD pin locally - one 0.1uF per pair - and connect the exposed center area to a solid ground plane via via stitching. Keep PGD/PGC ICSP traces routed to a production programming header; this costs nothing at layout time and enables field firmware updates without rework.
Always specify the A-suffix device: the original DSPIC33FJ128GP710 (pre-A) has documented silicon errata, and Microchip publishes separate errata and Flash programming specification documents for this family. When substituting temperature grades, remember the -H grade replaces -I or -E ranges - confirm the actual temperature limits in the current Microchip ordering-information table rather than assuming equivalence. Finally, on 0.5 mm pitch TQFP parts, inspect solder joints under magnification: bridging on the fine-pitch pins is the most common first-article assembly defect.
Compliance Information
Verified web data for this orderable part does not include explicit RoHS/REACH/lead-free certificates. Verify against Microchip's official environmental compliance documentation for this specific MPN before use in regulated markets.
