DSPIC33EP512GP502T-I/MM - 16-bit 70 MIPS DSC, 512KB Flash | Microchip
MPN: DSPIC33EP512GP502T-I/MM ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4.67 | $4.67 |
| 10 | $4.35 | $43.50 |
| 100 | $3.95 | $395.00 |
| 500 | $3.6 | $1,800.00 |
| 1,000 | $3.25 | $3,250.00 |
DSPIC33EP512GP502T-I/MM Overview
A digital signal controller combines the deterministic control structure of a microcontroller with the math acceleration of a DSP engine, including single-cycle multiply-accumulate (MAC) and hardware division support. DSCs occupy the middle of the embedded hierarchy between general-purpose MCUs and dedicated DSP ICs, making them the default choice for closed-loop power conversion and motor control where fast interrupt response and fixed-point arithmetic both matter.
Key features include 70 MIPS maximum core speed, 12-bit ADC performance with high sample-rate conversion, dual integrated operational amplifiers and comparators, a Charge Time Measurement Unit (CTMU), CAN 2.0B communication, four DMA channels, five 16-bit timers, high-speed PWM outputs, and a Peripheral Trigger Generator (PTG) that automates peripheral sequencing with minimal CPU intervention. Operating voltage is 3.3 V (per datasheet-class listing: 16-bit dsPIC RISC, 512 KB Flash, 3.3 V, 28-pin QFN-S EP, tape and reel).
The dsPIC33EP architecture pairs the enhanced Flash with an execution pipeline that sustains single-cycle instruction throughput at 70 MIPS, and the PTG plus DMA offload keeps the core free during time-critical control loops. The integrated op amps directly condition current-shunt or resolver signals ahead of the ADC, reducing external BOM count.
Typical applications span sensorless BLDC and PMSM motor control, digital power supplies (PFC, LLC), industrial automation nodes with CAN connectivity, and general-purpose signal conditioning where analog integration reduces board area.
Design consideration: the QFN-S exposed pad must be soldered to a grounded thermal pad for both heat dissipation and signal integrity; VCAP/VDDCORE requires the manufacturer-specified capacitance for stable core regulation.
This page adds value beyond the raw datasheet by consolidating distributor pricing, verified drop-in alternatives, practical layout notes, and an honest comparison across temperature-grade variants.
Drop-in alternatives for DSPIC33EP512GP502T-I/MM — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EP512GP502T-I/MM (same form factor and footprint) — differing in Core, Operating Temperature, Package, CPU Speed, PWM.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33EP512GP502T-E/MM
✅ Drop-In✓ In Stock
$3.92 / Unit
View Datasheet →DSPIC33EP512GP502T-H/MM
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33EP512GP502-I/MM
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33EP256GP502T-I/MM
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$3.1 / Unit
View Datasheet →DSPIC33EP32GP502T-E/MM
✅ Drop-In✓ In Stock
$2.98 / Unit
View Datasheet →DSPIC33EP512GP502T-I/MM Maximum Ratings & Electrical Characteristics
| Core | 16-bit dsPIC33EP RISC with DSP engine |
| Core Speed | 70 MIPS (60 MHz class per family listing) |
| Program Memory | 512 KB (170K x 24) Flash |
| RAM | 48 KB |
| Supply Voltage | 3.3 V |
| Package | 28-QFN-S (6x6 mm) with exposed pad |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +85C (I grade) |
| Timers | 5 x 16-bit timers |
| DMA Channels | 4 |
| External Interrupts | Up to 3 |
| Integrated Analog | Op amps, comparators, CTMU |
| Communication Interfaces | CAN 2.0B, UART, SPI, I2C |
| Packaging | Tape & Reel (T suffix) |
DSPIC33EP512GP502T-I/MM Pin Configuration
| Pin 1 | MCLR — Master clear reset input / programming voltage |
| Pin 2 | AN0/VREF+/CN2/RB0 — Analog input 0 / positive voltage reference |
| Pin 3 | AN1/VREF-/CN3/RB1 — Analog input 1 / negative voltage reference |
| Pin 4 | AN2/SS1/CN4/RB2 — Analog input 2 / SPI slave select |
| Pin 5 | AN3/IND/CN5/RB3 — Analog input 3 / comparator-inductor input |
| Pin 6 | AN4/C1IN-/CN6/RB4 — Analog input 4 / comparator 1 inverting input |
| Pin 7 | VDD — Power supply (3.3 V) |
| Pin 8 | VSS — Ground reference |
| Pin 9 | OSC1/CLKI/CN7/RA2 — Crystal oscillator input / external clock input |
| Pin 10 | OSC2/CLKO/CN8/RA3 — Crystal oscillator output / clock output |
| Pin 11 | VCAP/VDDCORE — Internal core regulator capacitor connection |
| Pin 12 | RP15/SDA1/CN11/RF3 — Remappable pin / I2C data |
| Pin 13 | RP14/SCL1/CN10/RF2 — Remappable pin / I2C clock |
| Pin 14 | INT0/RP2/CN12/RB5 — External interrupt 0 / remappable pin |
| Pin 15 | AN5/C1IN+/CN7/RB6 — Analog input 5 / comparator 1 non-inverting input |
| Pin 16 | AN6/OCFA/CN8/RB7 — Analog input 6 / PWM fault input |
| Pin 17 | AN7/RP0/CN9/RB8 — Analog input 7 / remappable pin |
| Pin 18 | AN8/RP1/CN10/RB9 — Analog input 8 / remappable pin |
| Pin 19 | AN9/RP3/CN11/RB10 — Analog input 9 / remappable pin |
| Pin 20 | AN10/RP4/CN12/RB11 — Analog input 10 / remappable pin |
| Pin 21 | AN11/RP17/CN13/RB12 — Analog input 11 / remappable pin |
| Pin 22 | AN12/RP18/CN14/RB13 — Analog input 12 / remappable pin |
| Pin 23 | PGD/RP19/CN15/RB14 — In-circuit debug data / remappable pin |
| Pin 24 | PGC/RP20/CN16/RB15 — In-circuit debug clock / remappable pin |
| Pin 25 | VSS — Ground reference |
| Pin 26 | VDD — Power supply (3.3 V) |
| Pin 27 | AVDD — Analog power supply |
| Pin 28 | AVSS — Analog ground |
Typical Applications
DSPIC33EP512GP502T-I/MM is suitable for 6 applications: Sensorless BLDC/PMSM Motor Control, Digital Power Supplies (PFC, LLC, Buck), Industrial Automation CAN Nodes, Precision Sensor Signal Conditioning, Embedded Test and Measurement Probes, Lighting and Power Conversion Control.
Sensorless BLDC/PMSM Motor Control
The DSPIC33EP512GP502T-I/MM fits three-phase motor control because its 70 MIPS DSP core with single-cycle MAC executes field-oriented control loops at tens of kHz, while the integrated op amps amplify shunt-resistor current feedback directly into the ADC, eliminating external amplifier ICs. In a typical sensorless topology, the high-speed PWM module generates complementary three-phase drive signals with dead-time insertion, and back-EMF is sampled through the 12-bit ADC synchronized to the PWM. Using one DSC for control, PWM, and analog conditioning shrinks board area versus a discrete MCU-plus-ADC-plus-op-amp solution, and four DMA channels move ADC results without CPU overhead, keeping interrupt latency deterministic for the control loop.
Recommended
Digital Power Supplies (PFC, LLC, Buck)
Digital power conversion benefits directly from the GP502's combination of high-speed PWM with fine resolution, fast 16-bit control math, and the Peripheral Trigger Generator that fires ADC sampling at the optimal point in each switching cycle. In a PFC or LLC controller, the PTG sequences ADC captures and PWM updates autonomously, so the CPU is reserved entirely for the compensation algorithm running at up to 70 MIPS. The integrated comparators provide cycle-by-cycle current limiting as a hardware fast path, independent of firmware. This hardware-analog-plus-DSP blend delivers the deterministic protection response of analog controllers with the flexibility and programmability of digital control, in a single 6x6 mm QFN-S footprint.
Recommended
Industrial Automation CAN Nodes
For industrial field nodes, the GP502's integrated CAN 2.0B module plus UART, SPI and I2C gives a complete communication suite from one 3.3 V part. The 512 KB Flash is large enough to hold a full CANopen or custom protocol stack, a bootloader for field firmware updates, and the application control code with headroom to spare. The CTMU (Charge Time Measurement Unit) supports capacitive touch and precise time-interval measurement for sensor interfacing, while five 16-bit timers handle scheduling and encoder counting. Nodes built on this DSC integrate sensing, actuation and networking without external interface chips beyond a CAN transceiver, reducing BOM and qualification effort.
Recommended
Precision Sensor Signal Conditioning
The GP502 integrates dual operational amplifiers, comparators, a 12-bit-class ADC and the CTMU, making it a compact front-end for bridges, RTDs, photodiodes and other low-level sensors. The op amps provide gain staging immediately adjacent to the ADC, shortening analog traces on the 6x6 mm package and improving noise immunity versus off-chip amplification. DMA channels stream conversion results to RAM at full ADC throughput, and the DSP engine applies fixed-point filtering (IIR/FIR) at 70 MIPS. In portable and industrial instruments, this level of analog integration removes two to three external ICs from the signal chain, cutting both board area and calibration complexity per channel.
Recommended
Embedded Test and Measurement Probes
Handheld instruments and smart probes exploit the GP502's CTMU for precise charge and time-domain measurement, its timers for frequency capture, and the DSP engine for on-device waveform math. The 512 KB Flash supports a full acquisition, analysis and UI framework, while the 48 KB RAM buffers waveform samples for post-processing. USB-class or UART links (via remappable pins) stream results to a host PC, and CAN integrates the probe into automated test racks. Running all capture and analysis locally at 70 MIPS reduces host dependency and enables battery-powered operation, since the DSC handles measurement, filtering and communication in one low-power 3.3 V device.
Recommended
Lighting and Power Conversion Control
High-intensity and smart lighting ballasts use the GP502's high-speed PWM with complementary outputs and dead-time control to drive half-bridge and LLC stages, while ADC sampling via PTG closes current and luminance loops. The integrated comparators give fast overcurrent protection independent of software, which is essential for lamp and LED driver reliability. On-board op amps condition dimming feedback and current-shunt signals without external amplifiers. With CAN and UART on the remappable pins, fixtures connect into building-automation networks (DALI gateways, CAN-based dimming buses), letting one 28-pin controller handle power conversion, control and networked dimming commands simultaneously.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EP512GP502T-I/MM — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EP512GP502T-E/MM | DSPIC33EP512GP502T-H/MM | DSPIC33EP256GP502T-I/MM | DSPIC33EP32GP502T-E/MM |
|---|---|---|---|---|---|
| Package | 28-QFN-S (6x6 mm) | 28-QFN-S (6x6 mm) - same | 28-QFN-S/28-PQCC - same footprint | 28-QFN-S (6x6 mm) - same | 28-QFN-S (6x6 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Memory (Flash) | 512 KB (170K x 24) | 512 KB | 512 KB | 256 KB | 32 KB |
| Core Speed | 70 MIPS | 70 MIPS class | 70 MIPS class | 70 MIPS class | 70 MIPS class |
| Operating Temperature | -40C to +85C (I grade) | -40C to +125C (E grade) | -40C to +150C (H grade) | -40C to +85C (I grade) | -40C to +125C (E grade) |
| Packaging | Tape & Reel (T) | Tape & Reel (T) | Tape & Reel (T) | Tape & Reel (T) | Tape & Reel (T) |
| Key Peripherals | Op amps, comparators, CTMU, CAN, PTG | Identical peripheral set | Identical peripheral set | Identical peripheral set | Identical peripheral set |
Key Differentiators
- Full 512 KB Flash in a 28-pin footprint (vs DSPIC33EP32GP502T-E/MM)
- Integrated analog front-end (vs DSPIC33EP256GP502T-I/MM)
- Lowest-cost temperature grade for standard industrial use (vs DSPIC33EP512GP502T-E/MM)
Design Notes
The VCAP/VDDCORE pin stabilizes the internal 1.8 V-class core regulator. Fit the datasheet-specified low-ESR ceramic capacitor within a few millimeters of pin 11; an omitted or undersized VCAP capacitor is the most common cause of sporadic reset and brownout symptoms on dsPIC33EP boards. Decouple both VDD/VSS pairs with 0.1 uF ceramics placed close to the package, and keep AVDD/AVSS fed through an RC or ferrite filter from the digital 3.3 V rail to protect ADC noise performance.
The QFN-S exposed pad must be soldered to a PCB thermal pad - it is not optional. Connect it to a grounded pour with a stitched via array (typically 3x3 or 4x4 vias) to provide the low-inductance ground reference and heat spreading the 6x6 mm QFN package expects. During hand assembly, a hot-plate or reflow profile that wets the underside pad is required; solder-paste-only hand ironing will leave the thermal pad unwetted and cause intermittent ground faults.
For motor-control or power-conversion use, route PWM outputs away from the analog inputs (pins 2-6, 15-22) and keep the shunt-amplifier traces from the integrated op amps short and shielded by ground pour. Synchronize ADC sampling to the PWM period using the PTG or ADC trigger rather than polling - this eliminates sampling jitter that otherwise shows up as current-loop noise. Use the Peripheral Pin Select to route UART/SPI/I2C away from high dV/dt traces during PCB revision cycles.
Temperature-grade selection is the frequent ordering error: the I suffix is rated to +85C while E (+125C) and H (+150C) grades fit harsher environments - a design validated only at 25C may fail in enclosed enclosures that trap motor-driver heat. Also remember the T suffix means tape-and-reel minimum quantity; prototypers should order the non-T tube version. Finally, in-circuit programming uses PGC/PGD (pins 23/24) plus MCLR - reserve these pads and a 5-pin ICSP header on every board.
Compliance Information
Compliance status was not stated in the provided verified web data. Modern Microchip dsPIC33EP parts are generally RoHS-compliant, but verify on the official Microchip product page before export documentation.
