PIC18F25K80-E/MM - 8-bit 64MHz 32KB Flash MCU w/ ECAN | Microchip
MPN: PIC18F25K80-E/MM ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4.32 | $4.32 |
| 10 | $3.91 | $39.10 |
| 100 | $3.45 | $345.00 |
| 500 | $2.99 | $1,495.00 |
| 1,000 | $2.65 | $2,650.00 |
| 3,000 | $2.32 | $6,960.00 |
PIC18F25K80-E/MM Overview
An 8-bit PIC microcontroller is a compact, low-cost CMOS compute core that executes a reduced-instruction-set instruction set (RISC) in a single clock cycle, providing deterministic timing for embedded control. Within the broader taxonomy, the PIC18F25K80 belongs to the PIC18 family of mid-range 8-bit microcontrollers, sits in the MCU / microcontroller product category (a subset of embedded microcontrollers and integrated circuits), and is positioned as a power-optimized, connectivity-rich variant aimed at CAN-bus and battery-powered applications.
Key features include nanoWatt XLP sleep currents as low as 100 nA typical (deep sleep), an integrated CTMU (Charge Time Measurement Unit) for capacitive touch or precise time-of-flight measurements, an on-chip 8 MHz internal oscillator selectable via configuration bits, and dual-watchdog with Windowed WDT. The ECAN module is compliant with CAN 2.0B active, supporting 11-bit and 29-bit identifiers, which removes the need for an external CAN transceiver microcontroller pair.
Architecturally, the device uses a 16-bit wide instruction path with an 8-bit data path, eight-level hardware stack, hardware multiplier (8x8 single-cycle), and 31 interrupt sources with vectored interrupt controller. The 12-bit ADC with acquisition timer supports up to 100 ksps conversion, sufficient for sensor readout in industrial control loops.
Typical applications include automotive body control modules (BCM), HVAC controllers, CAN node endpoints in vehicle networks, industrial elevator control panels, building automation sensor hubs, capacitive touch user interfaces via CTMU, and battery-powered metering nodes. The wide 1.8V-5.5V supply range supports direct Li-Ion battery connection without a separate LDO.
When designing with this part, place a 100 nF decoupling capacitor on every VDD/VSS pair and ensure the exposed pad (EP) is soldered to a continuous ground plane. The E suffix denotes the extended (-40C to +125C) temperature grade suitable for under-hood automotive and outdoor industrial enclosures.
This page synthesizes distributor pricing, drop-in QFN-28 alternatives from the same PIC18F family, ECAN node firmware design notes, and CTMU touch measurement guidance not consolidated on any single distributor or manufacturer page.
Drop-in alternatives for PIC18F25K80-E/MM — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC18F25K80-E/MM (same form factor and footprint) — differing in ADC, CTMU, I/O Pins, MSL Level, Package.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC18F25K80-I/MM
✅ Drop-In✓ In Stock
$1.8 / Unit
View Datasheet →PIC18F25K80T-I/MM
✅ Drop-In📋 Reference alternative (not in catalog)
PIC18F26K80-E/MM
✅ Drop-In📋 Reference alternative (not in catalog)
PIC18F26K80-H/MM
✅ Drop-In📋 Reference alternative (not in catalog)
PIC18F25Q10-I/SS
✅ Drop-In📋 Reference alternative (not in catalog)
PIC18F25K80-E/MM Maximum Ratings & Electrical Characteristics
| Core | PIC18 8-bit RISC |
| Program Memory (Flash) | 32 KB (16K x 16) |
| Data SRAM | 3.6 KB (3648 bytes) |
| Data EEPROM | 1 KB (1024 bytes) |
| Maximum CPU Speed | 64 MHz (16 MIPS) |
| Operating Voltage Range | 1.8 V to 5.5 V |
| Operating Temperature Range | -40C to +125C (E = Extended) |
| ADC | 12-bit, up to 8 channels |
| CAN Interface | ECAN 2.0B active (1 module) |
| UART | Enhanced USART (1) |
| SPI | 1 (MSSP) |
| I2C | 1 (MSSP) |
| Timers | 4 x 8/16-bit (Timer0-3) |
| PWM Outputs | Enhanced CCP, up to 4 channels (ECCP + CCP) |
| CTMU | Yes (Charge Time Measurement Unit) |
| Comparators | 2 |
| Internal Oscillator | 8 MHz selectable via OSCCON |
| I/O Pins | 24 |
| Package | 28-QFN-S (6x6 mm) with exposed pad |
| Mounting Type | Surface Mount |
| MSL Level | 3 |
| Lead-Free / RoHS | Yes, RoHS compliant |
PIC18F25K80-E/MM Pin Configuration
| Pin 1 | RA3/AN3 — GPIO RA3 / analog input AN3 |
| Pin 2 | RA4/AN4 — GPIO RA4 / analog input AN4 |
| Pin 3 | RA5/AN5 — GPIO RA5 / analog input AN5 |
| Pin 4 | RA6/OSC2 — GPIO RA6 / crystal oscillator output |
| Pin 5 | RA7/OSC1 — GPIO RA7 / crystal oscillator input |
| Pin 6 | VDD — Positive supply voltage |
| Pin 7 | VSS — Ground reference |
| Pin 8 | RB0/INT0 — GPIO RB0 / external interrupt 0 |
| Pin 9 | RB1/INT1 — GPIO RB1 / external interrupt 1 |
| Pin 10 | RB2/INT2 — GPIO RB2 / external interrupt 2 |
| Pin 11 | RB3/INT3 — GPIO RB3 / external interrupt 3 |
| Pin 12 | RB4/ECCP1/P1A — GPIO RB4 / ECCP1 PWM output |
| Pin 13 | RB5/ECCP2/P2A — GPIO RB5 / ECCP2 PWM output |
| Pin 14 | RB6/PGC — GPIO RB6 / ICSP clock |
| Pin 15 | RB7/PGD — GPIO RB7 / ICSP data |
| Pin 16 | RC0/SOSCO — GPIO RC0 / secondary oscillator output |
| Pin 17 | RC1/SOSCI — GPIO RC1 / secondary oscillator input |
| Pin 18 | RC2/CCP1 — GPIO RC2 / CCP1 PWM |
| Pin 19 | RC3/SDA — GPIO RC3 / I2C SDA (MSSP) |
| Pin 20 | RC4/SCL — GPIO RC4 / I2C SCL (MSSP) |
| Pin 21 | RC5/SDO — GPIO RC5 / SPI SDO (MSSP) |
| Pin 22 | RC6/CANTX — GPIO RC6 / ECAN transmit output |
| Pin 23 | RC7/CANRX — GPIO RC7 / ECAN receive input |
| Pin 24 | RD0 — GPIO RD0 (PSP) |
| Pin 25 | RD1 — GPIO RD1 (PSP) |
| Pin 26 | RE3/MCLR — GPIO RE3 / master clear reset |
| Pin 27 | AVDD — Analog positive supply |
| Pin 28 | AVSS — Analog ground (also serves as exposed thermal pad) |
Typical Applications
PIC18F25K80-E/MM is suitable for 6 applications: Automotive Body Control Module (BCM), HVAC and Elevator Control Panels, Capacitive Touch User Interface via CTMU, CAN-Bus Sensor Node (Industrial 4.0), Building Automation Lighting Controller, Battery-Operated Metering and Data Logging.
Automotive Body Control Module (BCM)
The PIC18F25K80-E/MM is a canonical BCM node MCU. Its integrated ECAN 2.0B controller removes the need for a separate CAN controller IC and reduces BOM cost by USD 1.50-2.00 per node, while the 1.8-5.5 V VDD range tolerates the 6V-16V automotive transient environment after a single TVS-protected LDO. At 64 MHz (16 MIPS) it services CAN, LIN, and PWM-driven body functions (window lift, mirror fold, lighting) within tight scheduling budgets. The -40C to +125C extended temperature grade is mandatory for under-dash and under-hood zones, and 32 KB flash covers the typical BCM application with bootloader headroom.
Recommended
HVAC and Elevator Control Panels
The PIC18F25K80-E/MM drives industrial HVAC and elevator user-interface controllers where its nanoWatt XLP technology keeps standby current below 200 nA for mains-powered units in standby. The 12-bit ADC with up to 8 channels reads thermistor, humidity, and pressure sensors at 100 ksps with sufficient resolution for closed-loop fan-coil control. The 24 GPIO pins handle 7-segment or TFT displays, keypads, and relay outputs. The -40C to +125C grade supports elevator shaft cabinets and rooftop AHU installations, and ECAN lets the unit communicate with a building automation backbone without extra silicon.
Recommended
Capacitive Touch User Interface via CTMU
The on-chip CTMU (Charge Time Measurement Unit) is the key feature that lets the PIC18F25K80-E/MM replace a dedicated capacitive-touch IC plus a host MCU with a single chip, cutting touch-panel BOM cost roughly in half. Combined with a software-defined current source and the 12-bit ADC, the CTMU measures capacitance change on PCB pads through 3 mm of overlay plastic. According to Microchip AN1375 and AN1334, scan rates under 10 ms with 1% linearity are achievable across up to 12 channels, supporting sliders, wheels, and matrix keypads for appliance and consumer front panels.
Recommended
CAN-Bus Sensor Node (Industrial 4.0)
Battery-powered wireless or wired CAN sensor nodes benefit from the PIC18F25K80-E/MM's 100 nA typical deep-sleep current and 32 KB flash that holds a CANopen or J1939 stack plus sensor application code. The integrated ECAN module accepts standard and extended frames directly, removing an external CAN controller that would otherwise draw milliwatts continuously. With a 16 MIPS core, the device wakes, samples sensors via the 12-bit ADC, transmits on CAN, and returns to deep sleep within 1 ms, achieving years of operation on two AA cells in typical 10-second reporting duty cycles.
Recommended
Building Automation Lighting Controller
The PIC18F25K80-E/MM is well-suited to DALI or 0-10 V lighting control modules where its PWM (ECCP) channels dim LED drivers and its ECAN or UART talks to a BACnet/Modbus gateway. The 1.8-5.5 V VDD range simplifies power supply design for 24V commercial-lighting bus rails. The 12-bit ADC provides precise photocell sensing for daylight harvesting with 0.5 lx resolution, and the 32 KB flash holds DALI 2.0 application controller firmware plus custom lighting profiles with room for secure firmware update.
Recommended
Battery-Operated Metering and Data Logging
Portable metering instruments such as ultrasonic flow meters, gas-leak detectors, and handheld data loggers fit the PIC18F25K80-E/MM well, thanks to its combination of low deep-sleep current (100 nA typical), 64 MHz burst compute for FFT or DSP filtering, and 32 KB flash that accommodates application plus rolling buffer management. The 12-bit ADC at 100 ksps is adequate for transducer analog front-ends, and the CTMU supports precise time-of-flight measurements for ultrasonic sensing. ECAN allows tethered metering devices to stream data into vehicle or industrial backbones.
Recommended
Recommended Products Summary
Engineering reference data for PIC18F25K80-E/MM — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC18F25K80-I/MM | PIC18F25K80T-I/MM | PIC18F26K80-E/MM | PIC18F26K80-H/MM | PIC18F25Q10-I/SS |
|---|---|---|---|---|---|---|
| Package | 28-QFN-S (6x6 mm) | 28-QFN-S (6x6 mm) | 28-QFN-S (6x6 mm) | 28-QFN-S (6x6 mm) | 28-QFN-S (6x6 mm) | 28-SSOP |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 32 KB | 32 KB | 32 KB | 64 KB | 64 KB | 32 KB |
| RAM | 3.6 KB | 3.6 KB | 3.6 KB | 4 KB | 4 KB | 2 KB |
| ECAN Module | Yes (1x ECAN 2.0B) | Yes (1x ECAN 2.0B) | Yes (1x ECAN 2.0B) | Yes (1x ECAN 2.0B) | Yes (1x ECAN 2.0B) | No |
| Maximum CPU Speed | 64 MHz (16 MIPS) | 64 MHz (16 MIPS) | 64 MHz (16 MIPS) | 64 MHz (16 MIPS) | 64 MHz (16 MIPS) | 64 MHz (16 MIPS) |
| Operating Temperature | -40C to +125C (E) | -40C to +85C (I) | -40C to +85C (I) | -40C to +125C (E) | -40C to +150C (H) | -40C to +85C (I) |
| Operating Voltage | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 2.3 V to 5.5 V |
| ADC | 12-bit, 8 ch | 12-bit, 8 ch | 12-bit, 8 ch | 12-bit, 8 ch | 12-bit, 8 ch | 10-bit, 8 ch |
Key Differentiators
- Integrated ECAN controller saves external CAN IC (vs PIC18F25Q10-I/SS)
- nanoWatt XLP gives sub-microamp deep sleep (vs PIC18F25K22-E/MM)
- Same 28-QFN-S package allows drop-in upgrade to 64 KB flash (vs PIC18F25K80T-I/MM)
Design Notes
Place a 100 nF low-ESR ceramic decoupling capacitor (X7R, 10 V) within 3 mm of every VDD/AVDD pin and the exposed thermal pad. The PIC18F25K80-E/MM has separate analog (AVDD/AVSS) and digital (VDD/VSS) rails; connect a ferrite bead between AVDD and VDD to keep digital switching noise out of the 12-bit ADC reference path. If the application draws heavy bursts on ECAN, add a 10 uF bulk capacitor on VDD to suppress rail droop during bus contention.
The 28-QFN-S (6x6 mm) package dissipates heat primarily through the exposed pad (EP). Solder the EP to a continuous VSS copper pour of at least 100 mm^2 (top or bottom plane). At 64 MHz and 5 V VDD the active current is roughly 13 mA (1 MIPS/MHz rule of thumb times 16 MIPS), giving worst-case dissipation of 65 mW - well within the package's 60 C/W theta_JA - but continuous CAN transmit at 1 Mbps adds 30-50 mA during transmission. For enclosed automotive enclosures ensure adequate thermal relief via PCB copper.
Do not leave the MCLR pin (RE3) floating; tie it to VDD through a 10 kohm pull-up. For ICSP programming, populate the PGC (RB6) and PGD (RB7) series resistors (typically 4.7 kohm) so that firmware debugging is possible after PCB assembly. Avoid routing ECAN traces through noisy regions; keep CANH/CANL differential traces of equal length (within 5 mm) and 100 ohm characteristic impedance. The CTMU requires calibration - skip the CTMU current-source trim procedure in Microchip TB3065 or AN1375 and touch measurements will drift by 30% or more.
For the 28-QFN-S 6x6 mm land pattern, follow IPC-7351 nominal-density guidelines with 0.4 mm pitch and 0.2 mm pad width. Maintain a 0.5 mm keep-out under the exposed pad to avoid solder wicking into signal vias. The exposed pad must be connected to VSS through at least four thermal vias (0.3 mm drill, 0.6 mm pad) for adequate thermal dissipation.
Compliance Information
RoHS compliant per Microchip product page. The 'E' suffix denotes -40C to +125C extended temperature grade but is not a formal AEC-Q100 automotive qualification - for AEC-Q100 grade use PIC18F25K80-E/MMV01 or contact Microchip for AEC variants.
