DSPIC33EP512GP806-E/MR - 60 MIPS 16-bit DSC, 512KB Flash | Microchip
MPN: DSPIC33EP512GP806-E/MR ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8.2 | $8.20 |
| 10 | $7.45 | $74.50 |
| 100 | $6.6 | $660.00 |
| 500 | $5.95 | $2,975.00 |
| 1,000 | $5.4 | $5,400.00 |
DSPIC33EP512GP806-E/MR Overview
A digital signal controller combines the compute architecture of a microcontroller with DSP-capable instruction support in a single chip, sitting in the system hierarchy between a general-purpose MCU and a dedicated DSP. DSCs such as the dsPIC33EP family are widely used where deterministic control loops and math-intensive signal processing must coexist, such as motor control, digital power conversion, and embedded sensing.
Key features of this device include the highest-speed 70 MIPS-class dsPIC33E core (clocked at 60 MIPS in the standard configuration), dual CAN 2.0B modules for robust industrial networking, an 8-bit parallel master port that simplifies graphic display interfacing, and integrated high-performance analog peripherals. Per distributor listings, the device provides 53 general-purpose I/O pins and operates from a 3.0V to 3.6V supply.
Architecturally, the dsPIC33EP core uses a modified Harvard pipeline with DSP multiply-accumulate and divide instructions, providing strong code density and real-time responsiveness. The family datasheet (622 pages) documents high-speed PWM, advanced analog integration, and extensive serial connectivity (UART, SPI, I2C, dual CAN), allowing a single controller to close control loops and manage fieldbus communication concurrently.
Typical applications include industrial automation nodes with dual CAN buses, motor control and digital power supplies leveraging the DSP engine and PWM peripherals, and HMI/display products using the parallel master port. The extended temperature range (-40C to +125C) suits harsh industrial and automotive-adjacent environments.
Design consideration: this device is reported to be more sensitive to cross-talk on the PGEC/PGED programming lines than other PIC devices; adding a small (approx. 20 pF) capacitor from PGEC to VSS close to the chip improves debugger connectivity, per Northern Software engineering notes.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet, providing unique selection value for engineers.
Drop-in alternatives for DSPIC33EP512GP806-E/MR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EP512GP806-E/MR (same form factor and footprint) — differing in CAN Modules, Package, RAM.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33EP512GP806-I/MR
✅ Drop-In✓ In Stock
$4.48 / Unit
View Datasheet →DSPIC33EP512MC806
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33EP256GP806
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP128GP806
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP64GP806
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP512GP806-E/MR Maximum Ratings & Electrical Characteristics
| Core | dsPIC33EP, 16-bit |
| Max CPU Speed | 60 MIPS |
| Program Memory (Flash) | 512KB (170K x 24) |
| RAM | 53248 bytes (24K x 16) |
| General Purpose I/O | 53 |
| Supply Voltage Range | 3 V to 3.6 V |
| Package | 64-VQFN (9x9 mm), MR |
| Operating Temperature | -40C to +125C (E grade) |
| CAN Modules | 2 (Dual CAN) |
| Display Interface | 8-bit parallel master port |
| Series | dsPIC33EP 512GP General Purpose |
| Mounting Type | Surface Mount |
| Product Type | Digital Signal Controller (DSC) |
| Extended Peripherals | High-Speed PWM, UART, SPI, I2C |
| Analog Integration | Integrated advanced analog |
DSPIC33EP512GP806-E/MR 64-vqfn (9x9 mm), mr Pin Configuration Guide
Pin configuration for DSPIC33EP512GP806-E/MR (64-vqfn (9x9 mm), mr package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EP512GP806-E/MR.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EP512GP806-E/MR is suitable for 6 applications: Industrial Automation CAN Nodes, Motor Control and Digital Power, Embedded HMI and Graphic Displays, Sensor Acquisition and DSP Signal Processing, Automotive-Adjacent Control Units, Building Automation and Networking Gateways.
Industrial Automation CAN Nodes
The DSPIC33EP512GP806-E/MR fits industrial automation nodes because it integrates two independent CAN 2.0B modules, letting one 60 MIPS controller bridge a control bus and a diagnostic bus without an external gateway chip. The -40C to +125C extended temperature rating survives control-cabinet heat and cold-warehouse conditions, while 512KB Flash holds protocol stacks such as CANopen or J1939 alongside the application firmware. The controller closes deterministic control loops using its DSP multiply-accumulate engine while CAN transactions are serviced by hardware modules with configurable FIFOs, keeping worst-case bus latency predictable. With 53 I/O pins, digital and analog sensor inputs, actuators, and status indicators attach directly, and the 3.0V to 3.6V single-supply operation simplifies power tree design in 24V industrial panels with an appropriate buck regulator front end.
Recommended
Motor Control and Digital Power
The dsPIC33EP core's DSP engine (single-cycle MAC, DSP addressing modes) combined with high-speed PWM peripherals makes the GP806 well suited for field-oriented motor control and digitally controlled power converters running at tens of kHz. The 60 MIPS throughput executes current-loop PI calculations and coordinate transforms well within one PWM period, and the 512KB Flash accommodates sensorless observer algorithms plus parameter tables. Although the dedicated dsPIC33EP512MC806 offers motor-optimized PWM features and is pin-compatible for later migration, this GP part already provides the essential control loop resources. Designers should validate ADC sampling instants against PWM trigger points per the family datasheet to minimize control-loop jitter, and use the -E temperature grade for sealed drives where ambient temperatures exceed 85C.
Recommended
Embedded HMI and Graphic Displays
Microchip states the dsPIC33E GP family simplifies graphic display interfacing through its 8-bit parallel master port, and this device's 512KB Flash provides ample room for graphics libraries, fonts, and screen assets in moderate-resolution LCD designs. Running at 60 MIPS, the controller can refresh monochrome or small TFT panels while concurrently sampling sensors and servicing serial links. The 53 general-purpose I/O pins drive backlight control, touch keys, and beeper outputs directly, reducing external component count. For cost-sensitive HMI nodes (thermostats, panel meters, chargers), this part consolidates display control, communication, and application logic in a single 64-VQFN chip; designers should size the parallel-port write timing per the datasheet to match the chosen LCD controller's cycle requirements, and reserve Flash headroom for future UI revisions.
Recommended
Sensor Acquisition and DSP Signal Processing
The integrated advanced analog peripherals and the DSP instruction set make the GP806 a strong fit for data-acquisition nodes that must filter or transform signals locally. The 60 MIPS core performs FIR/IIR filtering, FFT windows, and RMS computation in real time, while 53248 bytes of RAM buffers waveform segments before transmission over UART, SPI, or CAN. The -40C to +125C operating range supports sensors mounted on motors, pumps, and outdoor equipment where commercial-grade parts would fail. With 53 I/O pins, front-end multiplexers, gain stages, and status outputs are controlled without expansion logic. Designers should budget RAM carefully between sample buffers and protocol stacks, and use the extended-grade part wherever enclosure temperatures can exceed the standard +85C industrial ceiling, avoiding field returns from thermal stress.
Recommended
Automotive-Adjacent Control Units
While this GP part is not AEC-Q100 qualified, its -40C to +125C E-grade rating and dual CAN 2.0B connectivity make it appropriate for non-safety-critical automotive-adjacent equipment such as aftermarket telematics, workshop tools, agricultural implements, and J1939 diagnostic gateways. The 512KB Flash stores vehicle protocol stacks and logging tables, the 60 MIPS core processes message throughput from two buses, and the 8-bit parallel master port can drive a small service display. For designs that later require formal automotive qualification, Microchip's dsPIC33E automotive variants within the same family should be evaluated; board-level reuse is the main benefit of starting with this footprint. Confirm bus transceivers are also rated to the application's temperature range, and implement CAN error confinement per the protocol standard in firmware.
Recommended
Building Automation and Networking Gateways
The GP806 serves building automation gateways by combining dual CAN with UART, SPI, and I2C links on one 60 MIPS controller, translating between fieldbus protocols and local sensor buses without a second processor. The 512KB Flash holds two complete protocol stacks simultaneously - for example CANopen on one bus and a proprietary bus on the other - while 53248 bytes of RAM maintain message queues during burst traffic. The extended temperature rating permits mounting in rooftop units, plant rooms, and unconditioned electrical closets that exceed +85C. Its 53 I/O pins directly drive relay drivers, damper actuators, and LED status arrays. Design practice: size CAN FIFO depths and interrupt priorities so that neither bus starves the other, and verify the 3.0V-3.6V supply holds under brownout conditions per the datasheet's electrical characteristics.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EP512GP806-E/MR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EP512GP806-I/MR | DSPIC33EP512MC806 | DSPIC33EP256GP806 | DSPIC33EP128GP806 |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-VQFN (9x9 mm, MR) | 64-VQFN (9x9 mm, MR) - same | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same |
| Core Speed | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS |
| Flash Memory | 512KB (170K x 24) | 512KB (170K x 24) | 512KB | 256KB | 128KB |
| CAN Modules | 2 (Dual CAN) | 2 | 2 | 2 | 2 |
| Family Optimization | General purpose (GP) | General purpose (GP) | Motor control (MC) | General purpose (GP) | General purpose (GP) |
| Display Interface | 8-bit parallel master port | 8-bit parallel master port | 8-bit parallel master port | 8-bit parallel master port | 8-bit parallel master port |
Key Differentiators
- Extended -40C to +125C temperature rating (vs DSPIC33EP512GP806-I/MR)
- Dual independent CAN 2.0B modules in GP family (vs DSPIC33EP256GP806)
- General purpose balance vs motor-control specialization (vs DSPIC33EP512MC806)
Design Notes
The dsPIC33EP512GP806 is reported (Northern Software engineering notes) to be more sensitive to cross-talk between the PGEC and PGED programming lines than other PIC devices, which can cause ICSP connectivity or verification failures. Mitigation: place a small ~20pF capacitor from the PGEC line to VSS as close to the chip as possible, route PGC/PGD traces short and away from fast PWM or CAN signals, and add series resistance on PGD only per Microchip programming specification guidance.
The device operates from 3.0V to 3.6V with 3.3V nominal. Decouple every VDD/AVDD pin with 0.1uF ceramic capacitors placed within 2 mm of the pins, and add one bulk 10uF capacitor near the 64-VQFN. Keep analog and digital supply domains separate per the family datasheet, using ferrite or RC isolation into AVDD if ADC accuracy matters. Estimated: a 60 MIPS active load of a few tens of mA on a 3.3V rail stays well under 150 mW, so no heatsinking is required.
The 64-VQFN (9x9 mm) MR package has a central exposed thermal pad that must be soldered to a grounded copper pour array of vias for reliable grounding and heat dissipation. Define pin 1 orientation using the package dot per Microchip footprint drawing. For CAN routing, keep transceiver-to-mcu traces short with a series termination resistor near the transceiver, and route CAN differential pairs at 120 ohm characteristic impedance when bus length exceeds a few tens of centimeters.
Compliance Information
Compliance data not present in verified web data; consult Microchip's official product page or environmental datasheet. Not an AEC-Q100 automotive-qualified part number (the -E suffix indicates extended temperature, not automotive qualification).
