DSPIC33EV128GM106-I/MR - 16-bit 5V 70 MIPS DSC 128KB Flash | Microchip
MPN: DSPIC33EV128GM106-I/MR ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5.2 | $5.20 |
| 10 | $4.68 | $46.80 |
| 100 | $4.16 | $416.00 |
| 500 | $3.72 | $1,860.00 |
| 1,000 | $3.3 | $3,300.00 |
DSPIC33EV128GM106-I/MR Overview
A digital signal controller combines the computational power of a digital signal processor (DSP) with the peripheral set and control logic of a microcontroller (MCU) in a single chip. Within the power-management hierarchy of embedded systems, a DSC such as the dsPIC33EV sits between general-purpose MCUs and dedicated DSPs, offering hardware multiply-accumulate units and DSP-style instructions for real-time control loops, filtering, and transform calculations while retaining MCU-grade peripherals like UART, SPI, I2C, and CAN.
Key features of this device include a robust 5V operating supply that directly tolerates harsh electrical environments without a 3.3V regulator, on-chip CAN peripheral for automotive and industrial networks, SENT module for sensor interfaces, high-resolution PWM outputs for motor control and power conversion, and integrated op amps with advanced analog features that reduce external component count.
Architecturally, the CMOS dsPIC33EV core pairs a 16-bit modified Harvard pipeline with DSP engine instructions, a barrel shifter, and ECC Flash for functional-safety-oriented designs. According to Microchip product documentation, the family is specifically targeted at appliances, industrial, and automotive applications exposed to noise and vibration.
Typical applications include brushless DC (BLDC) and permanent magnet synchronous motor (PMSM) control, automotive sensor and touch control units, switched-mode power supplies, and industrial automation nodes communicating over CAN.
Design consideration: the 5V rail simplifies BOM design in electrically noisy systems, but verify that any 3.3V-only companion devices in the design include level shifting, since most dsPIC33EV I/O is not 5V-tolerant in reverse.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, with data verified as of 2026-09-26.
Drop-in alternatives for DSPIC33EV128GM106-I/MR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EV128GM106-I/MR (same form factor and footprint) — differing in Package, RAM, Peripherals, Core, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33EV128GM106-E/MR
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33EV256GM106-I/MR
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
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View Datasheet →DSPIC33EV64GM106-I/MR
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
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View Datasheet →DSPIC33EV128GM004-E/MR
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EV128GM106-I/MR Maximum Ratings & Electrical Characteristics
| Core Architecture | 16-bit dsPIC DSC (CMOS) |
| Maximum Clock / Performance | 70 MIPS |
| Supply Voltage | 5 V |
| Program Memory (Flash) | 128 KB with ECC |
| RAM | 8 KB |
| Package | 64-VQFN (9x9 mm), MR |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +85C (I grade) |
| Peripherals | CAN, SENT, PWM, op amps, advanced analog |
| Target Applications | Appliances, industrial, automotive |
| Barrel Shifter | Yes (DSP engine) |
| Programming/Debug Interface | ICSP (multiple PGECx/PGEDx pairs) |
| Toolchain Support | MPLAB X, SEGGER J-Link/Flasher supported |
DSPIC33EV128GM106-I/MR 64-vqfn (9x9 mm), mr Pin Configuration Guide
Pin configuration for DSPIC33EV128GM106-I/MR (64-vqfn (9x9 mm), mr package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EV128GM106-I/MR.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EV128GM106-I/MR is suitable for 6 applications: BLDC/PMSM Motor Control, Automotive Sensor and Control Units, Home Appliance Control, Industrial Automation and CAN Networking Nodes, Digital Power Conversion (SMPS/PFC), Embedded DSP Signal Processing Nodes.
BLDC/PMSM Motor Control
The DSPIC33EV128GM106-I/MR fits brushless DC and permanent magnet synchronous motor control because its 70 MIPS DSP core executes field-oriented control loops with multiply-accumulate instructions at PWM-update rates, while high-resolution PWM peripherals generate complementary dead-time-controlled inverter gate signals. The integrated op amps amplify current-shunt sensor signals on-chip, reducing external analog component count and board area. The 5V supply provides superior noise margin near switching power stages, which is why Microchip targets the dsPIC33EV family explicitly at motor control in appliances and industrial drives. Running the control ISR from ECC Flash protects against single-bit corruption that could cause uncontrolled torque. Typical trade-off: at 70 MIPS the FOC loop closes fast, but verify ADC sampling alignment with PWM triggers to minimize current-measurement ripple.
Recommended
Automotive Sensor and Control Units
Automotive sensor and touch control units benefit directly from the DSPIC33EV128GM106-I/MR's 5V tolerance, SENT peripheral, and CAN module. SENT (Single Edge Nibble Transmission) is the standardized automotive sensor link, and the on-chip SENT module lets the DSC interface gearbox, position, and pressure sensors without external protocol converters. The 5V I/O survives the noisy harness environment typical of vehicles, where 3.3V systems need extra protection circuitry. Microchip explicitly positions the dsPIC33EV family for automotive applications exposed to noise and vibration. The 128KB ECC Flash supports software safety mechanisms such as program-flow monitoring and CRC-checked parameter blocks. For extended under-hood ambient temperatures, the pin-compatible DSPIC33EV128GM106-E/MR extended-temperature variant can be substituted without PCB changes.
Recommended
Home Appliance Control
Home appliances such as washing machines, dishwashers, refrigerators, and range hoods combine noisy motor drives, mains-connected sensing, and user interfaces - exactly the harsh environment the 5V dsPIC33EV128GM106-I/MR was designed for. The large 5V noise margins tolerate the burst and conducted interference generated by triac and inverter stages without elaborate filtering, and the 128KB Flash holds motor control, UI, and communication firmware in one part. Integrated op amps condition current sensors for motor-load monitoring, while PWM outputs drive the inverter stage. ECC Flash prevents field failures from memory bit corruption over appliance lifetimes measured in decades. CAN or UART links connect the control board to display and power boards across the appliance harness.
Recommended
Industrial Automation and CAN Networking Nodes
In industrial automation, the DSPIC33EV128GM106-I/MR serves as an intelligent node on a CAN network, executing local real-time control while communicating with PLCs and other controllers. The on-chip CAN peripheral implements the physical-to-network layer with hardware filtering, reducing CPU load, and the 70 MIPS DSP core runs digital filtering and control algorithms on sensor inputs in real time. The 5V supply matches legacy industrial sensor standards such as 0-5V and 4-20 mA front ends with simple external conditioning. -I grade operation from -40C to +85C covers cabinet and machine-mounted installations. ECC Flash ensures firmware integrity in electrically noisy factory environments where VFDs and contactors generate significant conducted interference on shared supply rails.
Recommended
Digital Power Conversion (SMPS/PFC)
Switched-mode power supplies and power-factor-correction stages demand fast, deterministic control loops with precise PWM. The DSPIC33EV128GM106-I/MR delivers this with its 70 MIPS core computing voltage and current loop compensation, high-resolution PWM generating phase-shifted or complementary gate waveforms with cycle-level dead-time control, and on-chip op amps amplifying shunt-current feedback. The 5V core directly scales PWM gate-drive logic levels for many driver ICs, simplifying the interface. ECC Flash protects the control firmware whose corruption could short converter outputs. Microchip's dsPIC33EV family documentation cites power conversion among the design targets for the 5V robust DSC. Trade-off versus analog-control SMPS: digital control adds firmware development effort but enables adaptive mode switching and remote parameter tuning over CAN or UART.
Recommended
Embedded DSP Signal Processing Nodes
The DSP engine in the DSPIC33EV128GM106-I/MR - with hardware multiply-accumulate and a barrel shifter - makes it suitable for embedded signal processing tasks such as sensor filtering, FFT-based condition monitoring, and acoustic analysis, where a full DSP would be oversized. At 70 MIPS, the device executes 16-bit fixed-point FFTs and FIR/IIR filter chains at audio and vibration analysis rates, while 128KB ECC Flash stores coefficient tables and buffering code and 8KB RAM holds working data blocks. The advanced analog peripherals acquire sensor inputs on-chip. This makes the part a compact single-chip alternative for smart sensor and predictive-maintenance products that must both process signals locally and report results over CAN or UART to supervisory systems.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EV128GM106-I/MR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EV128GM106-E/MR | DSPIC33EV256GM106-I/MR | DSPIC33EV64GM106-I/MR | DSPIC33EV128GM004-E/MR |
|---|---|---|---|---|---|
| Package | 64-VQFN (9x9 mm) MR | 64-VQFN (9x9 mm) MR - same | 64-VQFN (9x9 mm) MR - same | 64-VQFN (9x9 mm) MR - same | 64-VQFN (9x9 mm) MR - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Flash | 128 KB (ECC) | 128 KB (ECC) | 256 KB (ECC) | 64 KB (ECC) | 128 KB (ECC) |
| Performance | 70 MIPS (5V) | 70 MIPS (5V) | 70 MIPS (5V) | 70 MIPS (5V) | 70 MIPS (5V) |
| Operating Temperature | -40C to +85C (I) | Extended grade (E) | -40C to +85C (I) | -40C to +85C (I) | Extended grade (E) |
| Peripheral Feature Set | CAN, SENT, PWM, op amps, advanced analog | CAN, SENT, PWM, op amps - identical | CAN, SENT, PWM, op amps - identical | CAN, SENT, PWM, op amps - identical | Reduced feature set - verify CAN/SENT |
Key Differentiators
- Extended temperature option in identical footprint (vs DSPIC33EV128GM106-E/MR)
- Double the firmware headroom without respin (vs DSPIC33EV256GM106-I/MR)
- Full peripheral set vs reduced-feature sibling (vs DSPIC33EV128GM004-E/MR)
Design Notes
ICSP pairing discipline: the dsPIC33EV128GM106 provides multiple PGECx/PGEDx programming pin pairs, and per programming-tool documentation any pair may be used but ICSPCLK and ICSPDAT must come from the SAME pair (e.g., PGEC2 with PGED2). Mixing pairs from different sets will prevent programming. Additionally, connect ALL VDD and VSS pins on the 64-VQFN package, not just one supply pin pair - omitting a power pin pair is a common cause of unstable operation and programming failures. Route the ICSP header to a chosen pair and lock it in hardware documentation.
The 64-VQFN 9x9 mm MR package has a center thermal pad and fine-pitch perimeter lands. Use the exposed pad as the primary ground connection: create a via array (5x5 or denser) under the pad to the ground plane to minimize ground bounce for the 5V 70 MIPS core and provide a thermal path. Place 100 nF ceramic decoupling capacitors within 2 mm of each VDD pin pair, plus one 4.7-10 uF bulk capacitor. Keep the CAN transceiver within 20 mm of the CANTX/CANRX pins and route with matched short traces.
In 5V motor-control environments, protect I/O pins that leave the board: series resistors (100-470 ohm) on PWM outputs to gate drivers and clamp structures on sensor inputs limit injection current during load-dump-like transients. Microchip targets this family at noisy appliance and automotive environments, but the DSC still requires conventional hardening: ground-guard analog routing for the op-amp inputs, keeping high-current PWM traces away from the ADC reference, and separating the power ground for gate drivers from the DSC signal ground with a single-point connection at the exposed pad.
Compliance Information
Compliance status not stated in the provided verified web data; confirm RoHS/REACH status on the Microchip product page or distributor compliance documents before production release.
